212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Semiconductor die contact structure and method
#302Semiconductor structure and manufacturing method thereof
#303ELECTRICAL BARRIER LAYERS
#304Semiconductor device and a method of manufacturing the same
#305Designs and methods for conductive bumps
#306Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#307Semiconductor devices and methods of manufacturing the same
#308Semiconductor device
#309High quality electrical contacts between integrated circuit chips
#310Hermetically-sealed MEMS device and its fabrication
#311Structures and methods for low temperature bonding using nanoparticles
#312Vertically integrated wafers with thermal dissipation
#313Integrated fan-out package structures with recesses in molding compound
#314Methods and structures to repair device warpage
#315Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#316Packaging devices and methods of manufacture thereof
#317Semiconductor device and a method of manufacturing the same
#318Semiconductor device with trench-like feed-throughs
#319Pre-package and methods of manufacturing semiconductor package and electronic device using the same
#320Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#321Semiconductor package and manufacturing method thereof
#322Semiconductor devices having metal bumps with flange
#323Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#324Wafer backside interconnect structure connected to TSVs
#325Chip package
#326Chip package
#327Semiconductor device and a method of manufacturing the same
#328Semiconductor integrated circuit device
#329Metal-semiconductor contact structure with doped interlayer
#330Semiconductor device with metal structure electrically connected to a conductive structure
#331SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#332Semiconductor chip with redundant thru-silicon-vias
#333Light-emitting apparatus
#334Solder metallization stack and methods of formation thereof
#335Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by the same
#336Semiconductor packaging structure and method
#337Moisture barrier for semiconductor structures with stress relief
#338Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#339Semiconductor device and method of forming a thin wafer without a carrier
#340Power semiconductor device and method therefor
#341Methods of packaging semiconductor devices and packaged semiconductor devices
#342Low cost substrates
#343PACKAGE SUBSTRATE AND METHODS FOR MANUFACTURING THE SAME
#344Methods and apparatus for measuring analytes using large scale FET arrays
#345Method for low temperature bonding and bonded structure
#346Tooling for coupling multiple electronic chips
#347Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
#348Semiconductor device
#349Devices, systems, and methods for ion trapping
#350Method of fabricating semiconductor device having voids between top metal layers of metal interconnects
#351Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#352Chip package and method for fabricating the same
#353Chip on package structure and method
#354Methods for forming semiconductor device packages
#355Semiconductor device and a method of manufacturing the same
#356Semiconductor device packages
#357Semiconductor package structure and method for manufacturing the same
#358Electronic device and method for production
#359Semiconductor device and a method of manufacturing the same
#360Alignment structures and methods of forming same
#361Methods for forming pillar bumps on semiconductor wafers
#362Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#363Semiconductor device for preventing crack in pad region and fabricating method thereof
#3643D semiconductor package interposer with die cavity
#365Packaging devices and methods of manufacture thereof
#366Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#367Integrated antennas in wafer level package
#368Method of manufacturing a semiconductor device having scribe lines
#369Semiconductor device
#370Method of producing a hybridized device including microelectronic components
#371Circuit module and method of manufacturing the same
#372Methods of manufacturing wide band gap semiconductor device and semiconductor module, and wide band gap semiconductor device and semiconductor module
#373MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#374Semiconductor device and method of manufacturing same
#375Three dimensional device integration method and integrated device
#376Semiconductor device and method for manufacturing semiconductor device
#377Reliable and robust electrical contact
#378Bonding method using bonding material
#379Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#380Semiconductor device and an electronic device
#381Stacked semicondcutor structure and method
#382Electronic packages and methods of making and using the same
#383Test structure for monitoring liner oxidation
#384Method of producing an interposer with microspring contacts
#385Semiconductor device and method for production of semiconductor device
#386Method of forming an interconnection and arrangement for a direct interconnect chip assembly
#387Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#388Methods of forming 3-D circuits with integrated passive devices
#389Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#390LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#391Bonding material and bonding method using the same
#392Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition
#393Semiconductor constructions, and methods of forming cross-point memory arrays
#394Method for low temperature bonding and bonded structure
#395Semiconductor device and a method of manufacturing the same
#396Room temperature metal direct bonding
#397Semiconductor device and a method of manufacturing the same
#398Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#399Semiconductor device and a method of manufacturing the same
#400Semiconductor package
#401High-power electronic device packages and methods
#402Semiconductor device and method for fabricating the same
#403Light emitting device and method for manufacturing light emitting device
#404Vertically integrated wafers with thermal dissipation
#405Method for forming package systems having interposers
#406Memory device structure
#407Selective die electrical insulation by additive process
#408Moisture barrier for semiconductor structures with stress relief
#409Light-emitting apparatus
#410Substrate interconnections having different sizes
#411Integrated fan-out package structures with recesses in molding compound
#412Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#413Processing techniques for silicon-based transient devices
#414Four D device process and structure
#415Semiconductor device having low on resistance
#416Surface finish for wirebonding
#417Semiconductor device and an electronic device
#418Semiconductor device and a method of manufacturing the same
#419Three-dimensional semiconductor architecture
#420Circuit module and method of manufacturing the same
#421Microelectronic packages having cavities for receiving microelectronic elements
#4223D IC method and device
#423Electrical barrier layers
#424Semiconductor component with a monocrystalline semiconductor region arranged in a via region
#425Wafer level packages having non-wettable solder collars and methods for the fabrication thereof
#426LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#427Semiconductor device comprising an active layer and a Schottky contact
#428INTEGRATED CIRCUIT
#429Metal-semiconductor contact structure with doped interlayer
#430Semiconductor chip having different conductive pad widths and method of making layout for same
#431Wafer having pad structure
#432Semiconductor device and method of forming bump-on-lead interconnection
#433Semiconductor device and method for manufacturing semiconductor device
#434Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#435Method for low temperature bonding and bonded structure
#436Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#437Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#438Solder bump reflow by induction heating
#439Semiconductor device
#440Module comprising a semiconductor chip
#441Semiconductor device with output circuit and pad arrangements
#442Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#443Three dimensional device integration method and integrated device
#444Integrated circuit chip and fabrication method
#445Heat management in electronics packaging
#446Semiconductor device
#447Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#448Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#449Substrate bonding with diffusion barrier structures
#450Semiconductor device
#451Semiconductor device
#452Semiconductor device and method of manufacturing same
#453Mixed alloy solder paste
#454Integrated passive flip chip package
#455Solder paste, joining method using the same and joined structure
#456Assembly method, of the flip-chip type, for connecting two electronic components, assembly obtained by the method
#457Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#458LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#459Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same
#460Semiconductor device and a method of manufacturing the same
#461Semiconductor device
#462Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#463Bonded processed semiconductor structures and carriers
#464Mixed alloy solder paste
#465Thermal pads between stacked semiconductor dies and associated systems and methods
#466Methods of packaging semiconductor devices and packaged semiconductor devices
#467Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#468Semiconductor device with through silicon via and alignment mark
#469Semiconductor device
#470Semiconductor package
#471Method of fabricating a bond pad structure
#472Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#473Low z-height package assembly
#474Semiconductor device and method of forming stress relief layer between die and interconnect structure
#475Reduced expansion thermal compression bonding process bond head
#476Formation of alpha particle shields in chip packaging
#477Electronic module with EMI protection
#478Laser ashing of polyimide for semiconductor manufacturing
#479Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#480Selectively conducting devices, diode constructions, methods of forming diodes and methods of current modulation
#481Semiconductor device and a method of manufacturing the same
#482Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#483METHOD OF FABRICATION, DEVICE STRUCTURE AND SUBMOUNT COMPRISING DIAMOND ON METAL SUBSTRATE FOR THERMAL DISSIPATION
#484Stacked microelectronic devices
#485Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#486Electrochemical deposition method
#487Semiconductor die contact structure and method
#488Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#489Semiconductor element
#490Semiconductor device and method of manufacturing semiconductor device
#491Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#492Alignment marks in substrate having through-substrate via (TSV)
#493Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#494Thin integrated circuit chip-on-board assembly
#495Semiconductor device and manufacturing method thereof
#496Semiconductor device for battery power voltage control
#497Semiconductor device and method of manufacturing
#498Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#499Vertical LED chip package on TSV carrier
#500Multiple access over proximity communication
#501Method of room temperature covalent bonding
#502Method of forming a memory device
#503Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#504Substrateless power device packages
#505Semiconductor device and method of forming pad layout for flipchip semiconductor die
#506Multilayer pillar for reduced stress interconnect and method of making same
#507Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#508SEMICONDUCTOR DEVICE
#509Structures and methods for improving solder bump connections in semiconductor devices
#510Multi-function and shielded 3D interconnects
#511Conductive structure and method for forming the same
#512Method of forming package systems having interposers
#513Semiconductor device having an on die termination circuit
#514Semiconductor device and method of manufacturing same
#515Electronic devices with yielding substrates
#516Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#517Apparatus for thermal melting process and method of thermal melting process
#518Room temperature metal direct bonding
#519Group III nitride based flip-chip integrated circuit and method for fabricating
#520Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
#521Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
#522Semiconductor device and radio communication device
#523Light-emitting apparatus
#524Semiconductor device
#525SEMICONDUCTOR DEVICE
#526Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
#527Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#528Semiconductor package with single sided substrate design and manufacturing methods thereof
#529Techniques for fabricating fine-pitch micro-bumps
#530Compliant interconnects in wafers
#531Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices
#532Method of making a conductive pillar bump with non-metal sidewall protection structure
#533Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#534Methods of forming 3-D circuits with integrated passive devices
#535Semiconductor device including DC-DC converter
#536Semiconductor device
#537Semiconductor device having under-bump metallization (UBM) structure and method of forming the same
#538Wafer backside interconnect structure connected to TSVs
#539Stackable package by using internal stacking modules
#540Semiconductor device and method of forming high routing density interconnect sites on substrate
#541Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#542Voidlessly encapsulated semiconductor die package
#543Semiconductor device, substrate and semiconductor device manufacturing method
#544Wafer backside interconnect structure connected to TSVs
#545Semiconductor device and a method of manufacturing the same
#546Materials, structures and methods for microelectronic packaging
#547Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
#548Semiconductor packages and methods of fabricating the same
#549Chip and manufacturing method thereof
#550Passivated copper chip pads
#551System and method of sensing current in a power semiconductor device
#552Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#553Power module having stacked flip-chip and method for fabricating the power module
#554Three-dimensional semiconductor architecture
#555Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#556Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
#557Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate
#558Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#559Semiconductor component comprising copper metallizations
#560Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#561Printed circuit board
#562Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#563Semiconductor device with a connection pad in a substrate and method for production thereof
#564Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#565Bonded structure with enhanced adhesion strength
#566Wafer level chip scale package and process of manufacture
#567Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers
#568Apparatus for lead free solder interconnections for integrated circuits
#569Front side copper post joint structure for temporary bond in TSV application
#570Isolation structure for stacked dies
#571Semiconductor module system having encapsulated through wire interconnect (TWI)
#572Structure and method of forming a pad structure having enhanced reliability
#573Semiconductor device, semiconductor package, and electronic device
#574Method for forming a thin semiconductor device
#575Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure
#576Semiconductor device
#577Pre-soldered leadless package
#578Circuit module and method of manufacturing the same
#579Method for low temperature bonding and bonded structure
#580Stacked microelectronic assembly with TSVS formed in stages and carrier above chip
#581Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#582Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
#583Extended redistribution layers bumped wafer
#5843D IC method and device
#585Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#586Semiconductor device including passivation layer encapsulant
#587Semiconductor device with through silicon via and alignment mark
#588System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#589Semiconductor device and method of manufacturing the same
#590Dicing tape-integrated film for semiconductor back surface
#591Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#592Substrate contact opening
#593Routing layer for mitigating stress in a semiconductor die
#594Semiconductor device
#595Semiconductor die package and method for making the same
#596Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package
#597Method of manufacturing a semiconductor device using markings on both lead frame and sealing body
#598Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
#599Semiconductor device and production method therefor
#600Multi-chip package and manufacturing method