212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
DIE STRUCTURES AND METHODS OF FORMING THE SAME
#2BONDING SCHEME TO PROVIDE IMPROVED COPLANARITY AND HIGH JOINT YIELDS WITH REDUCED COSTS AND METHODS FOR FORMING THE SAME
#3Integrated Circuit Package and Method
#4SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#5SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#6SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#7PACKAGE PROCESS AND PACKAGE STRUCTURE
#8HERMETIC SMD PACKAGE
#9ELECTRONIC DEVICES IN SEMICONDUCTOR PACKAGE CAVITIES
#10SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#11DUAL-SIDE HEAT-DISSIPATION PACKAGE STRUCTURE AND PACKAGE STRUCTURE
#12CAPILLARY FOR A WIRE BONDING MACHINE HAVING A DYNAMICALLY ADJUSTABLE CHAMFER DIAMETER
#13SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#14ELECTRONIC DEVICE
#15PACKAGE COMPONENT AND FORMING METHOD THEREOF
#16DIE-TO-DIE INPUT/OUTPUT SIGNAL ROUTING UTILIZING OPPOSING DIE SURFACES IN INTEGRATED CIRCUIT COMPONENT PACKAGING
#17TECHNOLOGIES FOR THERMAL PLUGS IN A PHOTONIC INTEGRATED CIRCUIT DIE
#18SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
#19SEMICONDUCTOR DEVICE
#20WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#21SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#22MANAGING CONDUCTIVE CONNECTIONS FOR SEMICONDUCTIVE DEVICES
#23EFFICIENT REDISTRIBUTION LAYER TOPOLOGY
#24SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#25SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#26ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
#27MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#28Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die
#29SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#30SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
#31THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYSTEMS AND METHODS
#32METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THERMAL ATOMIC LAYER DEPOSITION ON CONDUCTIVE CONTACTS AND STRUCTURES FORMED USING THE SAME
#33SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
#34SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#35STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
#36Electronic devices in semiconductor package cavities
#37ENCAPSULANT-DEFINED LAND GRID ARRAY (LGA) PACKAGE AND METHOD FOR MAKING THE SAME
#38SEMICONDUCTOR DEVICES INCLUDING SEED STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICES
#39CORELESS SUBSTRATE PACKAGE AND FABRICATION METHOD THEREOF
#40Semiconductor package with nickel-silver pre-plated leadframe
#41SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK SIDE CONDUCTORS
#42Integrated Circuit Package and Method
#43Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features
#44Electronic device with multi-layer contact and system
#45Methods for forming metal gapfill with low resistivity
#46SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#47SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#48Die Structures and Methods of Forming the Same
#49LIGHT-EMITTING DIODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#50Semiconductor device
#51SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
#52Structures for low temperature bonding using nanoparticles
#53Packaged die and RDL with bonding structures therebetween
#54Stacked semiconductor structure and method
#55Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package
#56METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHODS FOR ELECTRICALLY TESTING AND PROTECTING THE INTEGRATED CIRCUIT
#57Semiconductor device and a method of manufacturing the same
#58Methods for low temperature bonding using nanoparticles
#59Semiconductor device
#60Semiconductor die contact structure and method
#61Semiconductor device
#62Semiconductor chip with redundant thru-silicon-vias
#63Semiconductor bonding structure
#64Semiconductor structure and manufacturing method thereof
#65MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND ASSOCIATED METHODS OF MANUFACTURING
#66Efficient redistribution layer topology
#67Semiconductor package with nickel-silver pre-plated leadframe
#68Semiconductor device with metal film on surface between passivation film and copper film
#69Protective surface layer on under bump metallurgy for solder joining
#70Package process and package structure
#71Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#72Semiconductor memory device structure
#73Method for fabricating semiconductor device with slanted conductive layers
#74Method for fabricating semiconductor device with graphene layers
#75Semiconductor device with slanted conductive layers and method for fabricating the same
#76BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME
#77Methods of forming stacked integrated circuits using selective thermal atomic layer deposition on conductive contacts and structures formed using the same
#78Semiconductor device with graphene layers and method for fabricating the same
#79DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#80Electronic devices in semiconductor package cavities
#81Methods of forming metal chalcogenide pillars
#82Hermetic package for high CTE mismatch
#83Hermetic package for high CTE mismatch
#84PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#85Efficient redistribution layer topology
#86Post passivation interconnect
#87Semiconductor device and method for production of semiconductor device
#88Semiconductor devices including seed structure and method of manufacturing the semiconductor devices
#89Semiconductor device and method for manufacturing semiconductor device
#903D IC method and device
#91Semiconductor device and a method of manufacturing the same
#923D IC method and device
#93Packaged die and RDL with bonding structures therebetween
#94Semiconductor device
#95THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING METAL
#96Thermocompression Bonding with Passivated Gold Contacting Metal
#97Thermocompression bonding with passivated copper-based contacting metal
#98Thermocompression Bonding with Passivated Tin-Based Contacting Metal
#99Stacked semiconductor structure and method
#100Structures and methods for low temperature bonding using nanoparticles
#101Redistribution layer (RDL) structure, semiconductor device and manufacturing method thereof
#102Thermocompression bonding with passivated nickel-based contacting metal
#103Thermocompression bonding using metastable gas atoms
#104Semiconductor device and manufacturing method of the same
#105METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#1063DI solder cup
#107Method for forming a semiconductor device having TSV formed through a silicon interposer and a second silicon substrate with cavity covering a second die
#108Device and Method for UBM/RDL Routing
#109Method of manufacturing an electronic device
#110Integrated circuit package and method
#111Semiconductor components having conductive vias with aligned back side conductors
#112Distribution layer structure and manufacturing method thereof, and bond pad structure
#113Fingerprint sensor device and method
#114Semiconductor die contact structure and method
#115Thermal pads between stacked semiconductor dies and associated systems and methods
#116Semiconductor device and a method of manufacturing the same
#117System-in-package with double-sided molding
#118High-Reliability Copper Alloy Bonding Wire for Electronic Packaging and Preparation Method Therefor
#119Semiconductor memory device structure
#120Integrated fan-out package structures with recesses in molding compound
#121Semiconductor device and a method of manufacturing the same
#122Alignment marks in substrate having through-substrate via (TSV)
#123Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#124Flip chip package utilizing trace bump trace interconnection
#125PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#126Semiconductor device and a method of manufacturing the same
#127Semiconductor device
#128System-in-package with double-sided molding
#129METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#130Semiconductor device and a method of manufacturing the same
#131Semiconductor device and method of manufacturing a semiconductor device
#132Printed circuit board and semiconductor package
#133Semiconductor device and manufacturing method of the same
#134Structures and methods for low temperature bonding using nanoparticles
#135Semiconductor device and method for production of semiconductor device
#136Fingerprint sensor device and method
#137Redistribution metal and under bump metal interconnect structures and method
#138Stacked semiconductor structure and method
#139Electronic device with multi-layer contact and system
#1403DI solder cup
#141Post passivation interconnect
#142Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#143Four D device process and structure
#144Device and method for UBM/RDL routing
#145Semiconductor device
#146Semiconductor device and method for manufacturing semiconductor device
#147Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#148Semiconductor device package and method of manufacturing the same
#149Method of manufacturing semiconductor device
#150Method of room temperature covalent bonding
#151METHOD OF ROOM TEMPERATURE COVALENT BONDING
#152Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package
#153Method of detecting delamination in an integrated circuit package structure
#154Multilayer pillar for reduced stress interconnect and method of making same
#155Multilayer pillar for reduced stress interconnect and method of making same
#156Semiconductor memory device structure
#157Metal bonding pads for packaging applications
#158Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#159Flip chip package utilizing trace bump trace interconnection
#160Semiconductor device and manufacturing method of the same
#161Methods of forming metal chalcogenide pillars
#162Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
#163Fingerprint sensor device and method
#164SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#165Bond pads with surrounding fill lines
#166Semiconductor device and method of manufacturing the same
#167SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#168Designs and methods for conductive bumps
#169Semiconductor device and a method of manufacturing the same
#170Multilayer pillar for reduced stress interconnect and method of making same
#171Systems and methods for electromagnetic interference shielding
#172Multiple plated via arrays of different wire heights on same substrate
#1733D IC method and device
#1743DI solder cup
#175Method for forming package structure
#176Alignment marks in substrate having through-substrate via (TSV)
#177Stacked semiconductor structure and method
#178Redistribution metal and under bump metal interconnect structures and method
#179Semiconductor die contact structure and method
#180ROOM TEMPERATURE METAL DIRECT BONDING
#181Semiconductor device and a method of manufacturing the same
#182Radar module with wafer level package and underfill
#183Semiconductor package device and method of manufacturing the same
#184MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#185INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND PLANE
#186Solder metallization stack and methods of formation thereof
#187Semiconductor device
#188Wire bonding systems and related methods
#189Thermal pads between stacked semiconductor dies and associated systems and methods
#190Fan-out stacked system in package (SIP) and the methods of making the same
#191Method for producing electronic device with multi-layer contact
#192Packaged die and RDL with bonding structures therebetween
#193Chip on package structure and method
#194System and method for an improved interconnect structure
#195Power semiconductor device load terminal
#196Electronic module with EMI protection
#197Integrated fan-out package structures with recesses in molding compound
#198Semiconductor device with metal structure electrically connected to a conductive structure
#199Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#200Methods and apparatus for measuring analytes using large scale FET arrays
#201Electrical device and a method for forming an electrical device
#202Method of making fully molded peripheral package on package device
#203ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#204Multiple bond via arrays of different wire heights on a same substrate
#205Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#206Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#207Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#208Processing Techniques for Silicon-Based Transient Devices
#209System-in-package with double-sided molding
#210Metal bonding pads for packaging applications
#211Semiconductor device and method of manufacturing a semiconductor device
#212Semiconductor device and method of packaging
#213Structures and methods for low temperature bonding using nanoparticles
#214Package substrate, method for fabricating the same, and package device including the package substrate
#215Semiconductor device and method for production of semiconductor device
#216Semiconductor device and a method of manufacturing the same
#217Packaged semiconductor assemblies and methods for manufacturing such assemblies
#218Chip package
#219Integrated circuit package structure and testing method using the same
#220Post passivation interconnect and fabrication method therefor
#221Alignment pattern for package singulation
#222Fingerprint sensor device and method
#223Hermetically sealed MEMS device and its fabrication
#224Manufacturing method of semiconductor device
#225Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#226Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#227Thermocompression Bonding with Passivated Gold Contacting Metal
#228Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#229Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#230Thermocompression Bonding Using Metastable Gas Atoms
#231System for Low-Force Thermocompression Bonding
#232Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#233Light emitting device and method for manufacturing light emitting device
#234Semiconductor device and manufacturing method of the same
#235Fully molded miniaturized semiconductor module
#236Semiconductor device and method of forming interposer with opening to contain semiconductor die
#237Light emitting diode display with redundancy scheme
#238SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#239Semiconductor device
#240Multi-stack package-on-package structures
#241Semiconductor device and method of manufacturing the same
#242Metal bonding pads for packaging applications
#243Power decoupling attachment
#244Semiconductor packaging structure and method
#245METHOD FOR FORMING BUMP STRUCTURE
#246Tooling for coupling multiple electronic chips
#247Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2483D semiconductor package interposer with die cavity
#249Semicondcutor structure and semiconductor manufacturing process thereof
#250Semiconductor device and a method of manufacturing the same
#251Package with passivated interconnects
#252Self-alignment for redistribution layer
#2533D bonded semiconductor structure with an embedded capacitor
#254Semiconductor device
#255Package structure and method for forming the same
#256Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#257Power decoupling attachment
#258Capacitive interconnect in a semiconductor package
#259Thermal pads between stacked semiconductor dies and associated systems and methods
#260Device and Method for UBM/RDL Routing
#261Semiconductor device and a method of manufacturing the same
#262Multi-stack package-on-package structures
#263Stacked semiconductor structure and method
#264Package-on-package device with supplemental underfill and method for manufacturing the same
#2653D IC method and device
#266Chip on package structure and method
#267Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#268Printed circuit board and semiconductor package
#269Devices, systems, and methods for ion trapping
#270Semiconductor device that includes a molecular bonding layer for bonding of elements
#271Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#272Semiconductor device and method for forming the same
#273Systems and methods for electromagnetic interference shielding
#274Semiconductor device and method for production of semiconductor device
#275Package process and package structure
#276Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#277Surface mount device package having improved reliability
#278Semiconductor constructions, electronic systems, and methods of forming cross-point memory arrays
#279Multi-chip package and manufacturing method
#280Semiconductor device and a method of manufacturing the same
#281Fingerprint sensor device and method
#282Sensor and manufacturing method thereof
#283Method of forming a reliable and robust electrical contact
#284Power semiconductor device load terminal
#285Method of manufacturing semiconductor devices and corresponding device
#286Systems and methods for gap filling improvement
#287Fan-out stacked system in package (SIP) and the methods of making the same
#288Method for self-aligned solder reflow bonding and devices obtained thereof
#289Package substrate, method for fabricating the same, and package device including the package substrate
#290System and method for an improved interconnect structure
#291Electronic element mounting substrate and electronic device
#292Semiconductor packaging structure and method
#293Semiconductor device and method
#294Multilayer pillar for reduced stress interconnect and method of making same
#295Three dimensional device integration method and integrated device
#296Semiconductor device and method for manufacturing semiconductor device
#297Hermetically sealed MEMS device and its fabrication
#298Semiconductor device having polyimide layer
#299Multilayer pillar for reduced stress interconnect and method of making same
#300Integrated circuit package comprising surface capacitor and ground plane