Semiconductor device packages with electromagnetic interference shielding

Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device

Power conversion apparatus

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES

Interconnect structure including hybrid frame panel

Method of fabricating bonding structure

METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE

Reinforced assembly carrier

Mounting apparatus, inspecting apparatus, inspecting method, and mounting method

Three chip package

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Electronic component and method for its production

LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method therefor

Multi-chip package including die paddle with steps

Semiconductor device package having features formed by stamping

Method of forming a semiconductor package and structure therefor

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

Electronic parts packaging structure and method of manufacturing the same

Circuit Device and Method for Manufacturing the Circuit Device

Method for bonding metallic terminals by using elastic contact

Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

Adhesive composition, adhesive sheet and production method of semiconductor device

METHOD OF PRODUCING SEMICONDUCTOR PACKAGES

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

Semiconductor device manufacturing method

ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same

Semiconductor device and bonding material

Method for manufacturing multilayer printed wiring board

Power Device Substrates and Power Device Packages Including the Same

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Semiconductor device and manufacturing method of the same

Approach to high temperature wafer processing

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Window type BGA semiconductor package and its substrate

Underbump metallurgy for enhanced electromigration resistance

Semiconductor device and fabrication method thereof

Substrate, manufacturing method thereof, method for manufacturing semiconductor device

Mock bump system for flip chip integrated circuits

Mock bump system for flip chip integrated circuits

Module including a rough solder joint

Semiconductor device and method for manufacturing same

Integrated circuit package system with planar interconnect

System and method of forming a wafer scale package

Flip chip interconnection structure with bump on partial pad and method thereof

Semiconductor device package

Integrated circuit package system with rigid locking lead

Electronic system modules and method of fabrication

Integrated circuit package system with stacking module

Mountable integrated circuit package system with substrate

Method and apparatus for a package having multiple stacked die

Semiconductor chip package assembly method and apparatus for countering leadfinger deformation

Leadframe, semiconductor packaging structure and manufacturing method thereof

I/O connection scheme for QFN leadframe and package structures

Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Method of manufacturing semiconductor device and semiconductor device

Capacitive isolation circuitry with improved common mode detector

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Semiconductor device capable of switching operation modes

Device interconnects

Method for manufacturing a multilayer printed wiring board for providing an electronic component therein

Method for mounting semiconductor device

Bump bonding method

Method of forming an interconnect on a semiconductor substrate

Component built-in wiring board

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING

Integrated circuit package system for stackable devices

Package-on-package system with via Z-interconnections

Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Wire bonding over active circuits

Microelectronic devices

Semiconductor device packages and assemblies

Semiconductor device

PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

Solder preform and electronic component

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Semiconductor device including a pressure-contact section

SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER

Method of making and designing lead frames for semiconductor packages

COL SEMICONDUCTOR PACKAGE

Semiconductor package having a bridged plate interconnection

Semiconductor chip package

Apparatus and method for series connection of two die or chips in single electronics package

Integrated circuit package system with isloated leads

Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers

Semiconductor device and manufacturing method of the same

Method of electrically connecting a microelectronic component

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Dual flat non-leaded semiconductor package

Wafer level IC assembly method

Thin quad flat package with no leads (QFN) fabrication methods

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE

Broadband Power Amplifier with A High Power Feedback Structure

Adhesive Film for Semiconductor and Semiconductor Device Therewith

Semiconductor device and manufacturing method thereof

Semiconductor device including adhesive covered element

Bump-on-lead flip chip interconnection

Semiconductor device

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Mounted body and method for manufacturing the same

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device

Semiconductor die package including embedded flip chip

Semiconductor die package including multiple semiconductor dice

Semiconductor module

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof

Support mounted electrically interconnected die assembly

Multi-chips package structure and the method thereof

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF

Semiconductor package having a cavity structure

Leadframe package with dual lead configurations

Semiconductor Device

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Bump forming method and bump forming apparatus

Method of forming an inlay substrate having an antenna wire

Dicing tape and die attach adhesive with patterned backing

Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots

Semiconductor module

Method and device for fabricating an assembly of at least two microelectronic chips

NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP

Semiconductor device

SEMICONDUCTOR DEVICE

Method of fabricating semiconductor components with through interconnects

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor module molded by resin with heat radiation plate opened outside from mold

Semiconductor device and fabricating method thereof

Wafer level die integration and method therefor

Chip package with a dam structure on a die pad

Semiconductor die package including exposed connections

Semiconductor device with wire-bonding on multi-zigzag fingers

Protection for bonding pads and methods of formation

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

Optical semiconductor device and method of manufacturing optical semiconductor device

ELECTRONIC COMPONENT MOUNTING METHOD

Lead frame isolation using laser technology

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Electronic component mounting method

Etching Solution And Method For Structuring A UBM Layer System

Method of manufacturing a semiconductor device

Power electronics assembly with cooling element

Semiconductor integrated circuit device

Lamination Tape for Reducing Chip Warpage and Semiconductor Device Containing Such Tape

Methods for bonding and micro-electronic devices produced according to such methods

Wafer-level integrated circuit package with top and bottom side electrical connections

Flip chip semiconductor assembly with variable volume solder bumps

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

Semiconductor module and method of producing the same

Autoclave capable chip-scale package

Semiconductor device

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor IC-embedded substrate and method for manufacturing same

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

SEMICONDUCTOR DEVICE

Semiconductor module

Semiconductor package having a bridge plate connection

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Storage medium and semiconductor package

Lead frame based semiconductor package and a method of manufacturing the same

Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device

WIRE BONDER

METHOD OF PRODUCING ELECTRONIC COMPONENT

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Manufacturing method of resin-sealed semiconductor device

Capacitive isolation circuitry

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Semiconductor device

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Power semiconductor device including a double metal contact

Carbon nanotube-based conductive connections for integrated circuit devices

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and a method of manufacturing the same

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Integrated circuit package system with external interconnects within a die platform

Resin sealed semiconductor device and manufacturing method therefor

Thermally enhanced molded leadless package

Semiconductor device

Package system for shielding semiconductor dies from electromagnetic interference

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

DICING DIE-BONDING FILM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS

Method for forming lead frame land grid array

Semiconductor device

Submount and method of manufacturing the same

High voltage isolation dual capacitor communication system

Semiconductor device with recessed registration marks partially covered and partially uncovered

Semiconductor device and a method of manufacturing the same

Wirebond over post passivation thick metal

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

Solder interconnect pads with current spreading layers

Flip chip device and manufacturing method thereof

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

System and method for integrated waveguide packaging

Integrated circuit and method

Module including a sintered joint bonding a semiconductor chip to a copper surface

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Integrated semiconductor device

Semiconductor device and a method of manufacturing the same

Method of manufacturing printed wiring board with built-in electronic component

Method of manufacturing printed wiring board with built-in electronic component

SEMICONDUCTOR DEVICE FABRICATING METHOD

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Adhesive film

Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same

Gap capacitors for monitoring stress in solder balls in flip chip technology

Electrical connecting structure and bonding structure

Electronic packaging method and apparatus

Semiconductor device

Passivated Copper Chip Pads

Integrated circuit having wide power lines

Semiconductor device and method of manufacturing the same

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Circuit board structure embedded with semiconductor chips

3D smart power module

Semiconductor device and manufacturing method thereof

Method of electrically connecting a microelectronic component

Method of electrically connecting a microelectronic component

Semiconductor device and manufacturing method of the same

Embedded die system and method

Package substrate with built-in capacitor and manufacturing method thereof

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Wire clamp and wire bonding apparatus having the same

Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport

Electric Component with Two-Phase Cooling Device and Method for Manufacturing

ADHESIVE FILM FOR SEMICONDUCTOR

Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them

Method of fabricating chip package structure

Semiconductor device singulation method

Method for manufacturing stack package using through-electrodes

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

Device mounting board, and semiconductor module and manufacturing method therefor

Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard

System, apparatus, and method for advanced solder bumping

Differential internally matched wire-bond interface

Bond pad structure

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Electronic device

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

Semiconductor chip package and method for manufacturing thereof

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

Panel level methods and systems for packaging integrated circuits with integrated heat sinks

Integrated module for data processing system

Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

Semiconductor package and methods of fabricating the same

MOLDED PACKAGE ASSEMBLY

Semiconductor device package and method of making a semiconductor device package

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Semiconductor Device Having Element Portion and Method of Producing the Same

Wire bonding method

Bondwire design

Wafer processing method for processing wafer having bumps formed thereon

Semiconductor device and manufacturing method thereof

Method for singulating semiconductor devices

METHOD OF ENCAPSULATING AN ELECTRONIC COMPONENT

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Electronic device and method of manufacturing same

Semiconductor device

ELECTRONIC ELEMENT PACKAGING

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Multi-chip module

ANGLED FLYING LEAD WIRE BONDING PROCESS

Fine pitch solder bump structure with built-in stress buffer

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit package system with wafer scale heat slug

Multiphase synchronous buck converter

Method of manufacturing semiconductor device

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Semiconductor package with stacked dice for a buck converter

Semiconductor device and manufacturing method of the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Ultra-Thin Semiconductor Package

Semiconductor device

Method of manufacturing electronic device on leadframe

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Mounting substrate

Multilayer wiring board with concave portion for accomodating electronic component

Bonding wire for semiconductor device