Stackable semiconductor package and manufacturing method thereof

Semiconductor device having a through-substrate via

Method of manufacturing printed wiring board

Production apparatus of composite silver nanoparticle

High efficiency module

Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief

Heterogeneous chip integration with low loss interconnection through adaptive patterning

Semiconductor light-emitting device, method for producing same, and display device

Semiconductor package including flip chip controller at bottom of die stack

Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Electrically bonded arrays of transfer printed active components

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Substrate with embedded stacked through-silicon via die

Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer

Semiconductor device with bump structure on an interconncet structure

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor package having internal shunt and solder stop dimples

Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

Method of processing solder bump by vacuum annealing

Packaging process tools and systems, and packaging methods for semiconductor devices

Flip chip package utilizing trace bump trace interconnection

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Monolithic semiconductor switches and method for manufacturing

Bonding material for semiconductor devices

Microelectronic package with self-heating interconnect

Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump

Semiconductor device and methods of manufacturing semiconductor devices

Semiconductor device including cladded base plate

Multi-transistor exposed conductive clip for semiconductor packages

Wafer level chip scale package

Metallization structure for high power microelectronic devices

Solder in cavity interconnection structures

Integrated circuit having staggered bond pads and I/O cells

Mechanisms for forming fine-pitch copper bump structures

Semiconductor device and manufacturing method thereof

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

Wire loops, methods of forming wire loops, and related processes

Flexible interconnect pattern on semiconductor package

Test structure and method of testing electrical characteristics of through vias

Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die

Method for developing a custom device

Microelectronic package and method of manufacturing same

Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump

Resin paste composition

Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer

Post-passivation interconnect structure and method of forming the same

Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Resin composition and semiconductor device produced by using the same

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die

Compact wirebonded power quad flat no-lead (PQFN) package

Support mounted electrically interconnected die assembly

WAFER LEVEL CHIP SCALE PACKAGE DEVICE AND MANUFACTURING METHOD THEROF

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

WIRING SUBSTRATE AND MANUFACTURING METHOD OF THE SAME

Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates

Semiconductor device and method of forming conductive pillar having an expanded base

Semiconductor device

Post-passivation interconnect structure

Semiconductor package and method of forming the same

Multilayer adhesive sheet and method for manufacturing electronic component

Packaging process tools and packaging methods for semiconductor devices

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Diode package having improved lead wire and manufacturing method thereof

Electrical device with protruding contact elements and overhang regions over a cavity

Interposer for ESD, EMI, and EMC

Curable amine, carboxylic acid flux composition and method of soldering

Curable flux composition and method of soldering

Electrochemical deposition apparatus

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS

Semiconductor device and method of forming interconnect substrate for FO-WLCSP

Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

Semiconductor device

Semiconductor device and method of forming protection and support structure for conductive interconnect structure

Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure

Device including a semiconductor chip and metal foils

Method of manufacturing an electronic device package

Chips having rear contacts connected by through vias to front contacts

Manufacturing method of semiconductor device

Method for producing chip stacks, and a carrier for carrying out the method

Semiconductor integrated circuit device and method of manufacturing same

Multi-chip packages providing reduced signal skew and related methods of operation

Semiconductor structure and method for making same

Elongated bump structure in semiconductor device

Semiconductor device including cladded base plate

Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices

Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure

Method for manufacturing a package-on-package type semiconductor device

Electronic component and method for producing same

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Pillar structure having a non-planar surface for semiconductor devices

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure

Inductive loop formed by through silicon via interconnection

Method for making a sensor device using a graphene layer

STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS

Self-aligned protection layer for copper post structure

Methods of fabricating semiconductor chip solder structures

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Semiconductor laser mounting with intact diffusion barrier layer

Semiconductor device including a recess formed above a semiconductor chip

Method for permanent connection of two metal surfaces

FLUX COMPOSITION, PROCESS FOR PRODUCING ELECTRICALLY CONNECTED STRUCTURES, ELECTRICALLY CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures

Semiconductor package with under bump metallization routing

LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME

Light emitting device and method for manufacturing light emitting device

Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface

Structure and method for power field effect transistor

Multilayer printed circuit board

Routing layer for mitigating stress in a semiconductor die

Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device

Semiconductor device comprising through-electrode interconnect

Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby

Method and system for forming conductive bumping with copper interconnection

Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die

Method for manufacturing semiconductor device

Wafer-level chip scale package

Semiconductor element-embedded wiring substrate

Flip chip interconnection having narrow interconnection sites on the substrate

Coaxial solder bump support structure

Bump structures in semiconductor device and packaging assembly

Self-aligning conductive bump structure and method of making the same

PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE

Semiconductor device

Dual metal for a backside package of backside illuminated image sensor

Copper column

LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE

Composition of a solder, and method of manufacturing a solder connection

Semiconductor device

Semiconductor device and a method of manufacturing the same

Semiconductor device

Semiconductor device and method of manufacturing the same

Method of manufacturing a semiconductor device

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

Void-Free Implantable Hermetically Sealed Structures

Methods and apparatus for measuring analytes using large scale FET arrays

Integrated antennas in wafer level package

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK

PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTS

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-CHIP SEMICONDUCTOR, AND DICING TAPE-INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features

Interconnection and assembly of three-dimensional chip packages

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Solder bump with inner core pillar in semiconductor package

Semiconductor device with solder bump formed on high topography plated Cu pads

Bump I/O contact for semiconductor device

Electronic assembly including an embedded electronic component

Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die

Mechanisms for marking the orientation of a sawed die

Method of forming an inductor on a semiconductor wafer

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and apparatus for measuring analytes using large scale FET arrays

PLATING APPARATUS AND PLATING METHOD

Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor

Method for producing a wafer provided with chips

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Laminate electronic device

Carrier structures for microelectronic elements

Power module and method for manufacturing the same

Circuit board and process for producing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

Oblique parts or surfaces

Ball-limiting-metallurgy layers in solder ball structures

Methods of forming a metal pattern

Electronic device

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Four MOSFET full bridge module

Semiconductor device and manufacturing method thereof

Semiconductor constructions

Semiconductor device

Multi-component integrated circuit contacts

Conductive connecting member and manufacturing method of same

Electrically conductive paste, and electrically conducive connection member produced using the paste

Semiconductor Device and Method of Forming a Wafer Level Package Structure Using Conductive Via and Exposed Bump

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Method of manufacturing an electronic system

Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

Stacked semiconductor device and fabrication method for same

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

Connecting film, and joined structure and method for producing the same

Method for Predetermined Component Placement to a Target Platform

Method for Predetermined Component Placement to a Target Platform

Method of cutting semiconductor substrate

Semiconductor die package and method for making the same

Fabrication method of semiconductor integrated circuit device

Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Chip package with reinforced positive alignment features

Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES

Bump structure with barrier layer on post-passivation interconnect

Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation

Laminated film and use thereof

Optoelectronic component and method for producing an optoelectronic component

Metal bump formation

Die backside standoff structures for semiconductor devices

Semiconductor device and manufacturing of the semiconductor device

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Method for wafer level packaging of electronic devices

SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

Manufacturing method including deformation of supporting board to accommodate semiconductor device

Method of producing a radiation-emitting optoelectronic component

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

Conductor structure element and method for producing a conductor structure element

Module substrate, module-substrate manufacturing method, and terminal connection substrate

Semiconductor device and manufacturing method

Method for fabricating a semiconductor and semiconductor package

Electrical connection for multichip modules

SEMICONDUCTOR PACKAGE

Semiconductor device and bonding material for semiconductor device

Flip chip interconnect solder mask

Flip chip interconnect solder mask

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Semiconductor storage device and manufacturing method thereof

Wiring board with built-in semiconductor element

Electronic device and method for producing electronic device

Electronic device and manufacturing thereof

Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material

Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package

Bonded semiconductor structures and methods of forming same

Method and apparatus for dicing die attach film on a semiconductor wafer

Chip package structure and method of making the same

Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Module including a sintered joint bonding a semiconductor chip to a copper surface

Multilayer pillar for reduced stress interconnect and method of making same

Apparatus for restricting moisture ingress

Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME

Semiconductor device and method of manufacturing same

Power converter, semiconductor device, and method for manufacturing power converter

Component-embedded substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming WLCSP structure using protruded MLP

Conductive pads defined by embedded traces

Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector

Semiconductor device

Wafer-level package device

CHIP PACKAGE

HIGH-FREQUENCY MODULE MANUFACTURING METHOD

Semiconductor device including Schottky barrier diode

Light emitting device package and lighting system

Power semiconductor device

Electronic component module

MODULE MANUFACTURING METHOD

Semiconductor device including semiconductor chips with different thickness

Distributed semiconductor device methods, apparatus, and systems

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Connecting and bonding adjacent layers with nanostructures

Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die

Copper bonding wire for semiconductor device and bonding structure thereof

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Pad layout structure of semiconductor chip

SEMICONDUCTOR DEVICE

Method for producing a metal layer on a substrate and device

Shielded electronic components and method of manufacturing the same

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Multi-transistor exposed conductive clip for high power semiconductor packages

Thermally enhanced semiconductor package with exposed parallel conductive clip

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

METHOD OF JOINING A CHIP ON A SUBSTRATE

Method for soldering surface-mount component and surface-mount component

Flexible interconnect pattern on semiconductor package

Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Wafer level IC assembly method

Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)

BUMP STRUCTURE AND FABRICATION METHOD THEREOF

EMBEDDED CHIP PACKAGE

Robust FBEOL and UBM structure of C4 interconnects

Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy

Semiconductor device and a manufacturing method thereof

Die stacking with an annular via having a recessed socket

Doping Minor Elements into Metal Bumps

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer