Semiconductor device with a connection pad in a substrate and method for production thereof

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Window ball grid array (BGA) semiconductor packages

Semiconductor device

Semiconductor device including a plurality of magnetic shields

Wafer level chip scale package and process of manufacture

Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Apparatus for lead free solder interconnections for integrated circuits

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Front side copper post joint structure for temporary bond in TSV application

Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function

Semiconductor module system having encapsulated through wire interconnect (TWI)

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor packages and methods of packaging semiconductor devices

Method for forming a thin semiconductor device

Semiconductor device and method of forming conductive vias with trench in saw street

Semiconductor device

Bonding apparatus and bonding method

Semiconductor die mount by conformal die coating

Pre-soldered leadless package

Circuit module and method of manufacturing the same

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device including cooler

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Sensor package

Fixture to constrain laminate and method of assembly

Sonotrode with cutting mechanism

Method of manufacturing semiconductor device

External storage device and method of manufacturing external storage device

3D IC method and device

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device including passivation layer encapsulant

Three-dimensional structure in which wiring is provided on its surface

Three-dimensional structure for wiring formation

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Semiconductor device and method of manufacturing the same

Dicing tape-integrated film for semiconductor back surface

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Substrate contact opening

Routing layer for mitigating stress in a semiconductor die

Semiconductor device

Semiconductor die package and method for making the same

Method for top-side cooled semiconductor package with stacked interconnection plates

Methods for attachment and devices produced using the methods

Semiconductor package and process for fabricating same

Semiconductor device

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

Semiconductor device and production method therefor

Packaged microelectronic components

Semiconductor device and semiconductor package containing the same

Semiconductor device

Wire bonding apparatus and bonding method

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device with copper-tin compound on copper connector

Semiconductor device having conductive pads and a method of manufacturing the same

Plasma treatment for semiconductor devices

Method for producing an optoelectronic semiconductor component

Semiconductor packages utilizing leadframe panels with grooves in connecting bars

Method of manufacturing semiconductor device

Method for fabricating a semiconductor and semiconductor package

Embedded semiconductor die package and method of making the same using metal frame carrier

Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Memory device, laminated semiconductor substrate and method of manufacturing the same

Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same

Semiconductor package having multi-phase power inverter with internal temperature sensor

Microelectronic assembly with impedance controlled wirebond and reference wirebond

Laminate electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Bump interconnection techniques

Glass carrier with embedded semiconductor device and metal layers on the top surface

Stacked dual-chip packaging structure and preparation method thereof

Semiconductor device having electrode pads arranged between groups of external electrodes

Control and driver circuits on a power quad flat no-lead (PQFN) leadframe

Power quad flat no-lead (PQFN) package having control and driver circuits

Integrated antennas in wafer level package

Semiconductor device and method of confining conductive bump material with solder mask patch

Semiconductor device and method for manufacturing thereof

Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Wire bondable surface for microelectronic devices

Routing layer for mitigating stress in a semiconductor die

Bump package and methods of formation thereof

Semiconductor device and a method of manufacturing the same

Semiconductor device and production method therefor

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Self-aligned protection layer for copper post structure

Semiconductor device and a method of manufacturing the same

Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)

Dual-leadframe multi-chip package

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Open source power quad flat no-lead (PQFN) package

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Use of electrical power multiplication for power smoothing in power distribution

Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of fabricating a wafer level chip scale package without an encapsulated via

Semiconductor device

Semiconductor device including semiconductor chip mounted on lead frame

Method and apparatus for multi-chip structure semiconductor package

Semiconductor chip and film and tab package comprising the chip and film

Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer

Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier

Semiconductor packaging method using connecting plate for internal connection

Method for producing semiconductor device

Compliant printed circuit semiconductor package

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Microelectronic packages with nanoparticle joining

Semiconductor device and lead frame used for the same

Semiconductor device and method for manufacturing thereof

Semiconductor device with protective layer over exposed surfaces of semiconductor die

Chip package and manufacturing method thereof

Semiconductor device and semiconductor assembly with lead-free solder

Semiconductor package with connecting plate for internal connection

Bump structures for semiconductor package

Power quad flat no-lead (PQFN) package

Electronic system modules and method of fabrication

Chip package and a method for manufacturing a chip package

Method of manufacturing a component comprising cutting a carrier

Dicing die bond film

Semiconductor device with copper wirebond sites and methods of making same

Method of manufacturing semiconductor device

Stacked dual chip package having leveling projections

Method of fabricating a package substrate

Conductive lines and pads and method of manufacturing thereof

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Semiconductor package for high power devices

Semiconductor device and method of manufacturing the same

Semiconductor structures comprising a dielectric material having a curvilinear profile

Semiconductor device and method of manufacturing the same

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Integrated system and method of making the integrated system

Semiconductor device and programming method

Semiconductor device stack with bonding layer and wire retaining member

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Semiconductor device and manufacturing method thereof

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Semiconductor device with embedded interconnect pad

Microelectronic packages having cavities for receiving microelectronic elements

Semiconductor package with single sided substrate design and manufacturing methods thereof

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Multilayer ceramic electronic device and method for manufacturing the same

Backside processing of semiconductor devices

Method of packaging a die

Semiconductor device including cooler

Copper or copper alloy, bonding wire, method of producing the copper, method of producing the copper alloy, and method of producing the bonding wire

Semiconductor device and method of forming bump-on-lead interconnection

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Mount board and electronic device

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Package-in-packages and methods of formation thereof

Thermally enhanced semiconductor package

Semiconductor structure with thin film resistor and terminal bond pad

Insulated gate semiconductor device

Assembly and production of an assembly

Stacked packaging improvements

Reconstituted wafer stack packaging with after-applied pad extensions

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

SEMICONDUCTOR CHIP WITH EXPANSIVE UNDERBUMP METALLIZATION STRUCTURES

Semiconductor device and method of forming an embedded SOP fan-out package

Semiconductor device with output circuit and pad

Methods and apparatus for measuring analytes using large scale FET arrays

Thermally enhanced semiconductor package with conductive clip

Method of making a stacked microelectronic package

Electronic device, method for producing the same, and printed circuit board comprising electronic device

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Electronic device and method for production

Short and low loop wire bonding

Bump-on-lead flip chip interconnection

Power semiconductor device and method therefor

Semiconductor device and a method of manufacturing the same

Power electronic devices

Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device

Scheme for connector site spacing and resulting structures

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Semiconductor device

Bonding wire for semiconductor

Protected solder ball joints in wafer level chip-scale packaging

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Lead structures with vertical offsets

Cu pillar bump with electrolytic metal sidewall protection

Method of fabricating a power semiconductor chip package

Thermally enhanced electronic package

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Printed wiring board and method for manufacturing printed wiring board

Interlocking type solder connections for alignment and bonding of wafers and/or substrates

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Interconnection element with posts formed by plating

Circuit device

Circuit device

Circuit device

Circuit device and method for manufacturing same

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

Method for chip packaging

Semiconductor device fabrication method capable of scribing chips with high yield

Method for producing a component and device comprising a component

Chip package and method for assembling chip package

Semiconductor device

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Chip package and method of forming the same

Cleaning methods and compositions

Method to realize flux free indium bumping

Off-chip vias in stacked chips

Leadless array plastic package with various IC packaging configurations

Conical-shaped or tier-shaped pillar connections

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus

3D packaging with low-force thermocompression bonding of oxidizable materials

Etching solution for copper or copper alloy

Indium compositions

Semiconductor packages and methods of fabricating the same

Semiconductor device and method of manufacturing the semiconductor device

RFID tags and processes for producing RFID tags

Wireless communication system

Multifunction sensor as PoP microwave PCB

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

Shallow via formation by oxidation

Semiconductor device

SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS

Chip package and manufacturing method thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Method of cutting semiconductor substrate

Method of manufacturing a semiconductor device

Method for fabricating packaging structure having embedded semiconductor element

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Microelectronic package

Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief

Semiconductor device

Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

Clip frame semiconductor packages and methods of formation thereof

Method of manufacturing a semiconductor component

Molded leadframe substrate semiconductor package

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP

Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Power module

Wiring board and semiconductor device

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor component that includes a protective structure

Semiconductor device including a stress buffer material formed above a low-k metallization system

Room temperature metal direct bonding

Three-dimensional system-in-package architecture

TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR ASSEMBLY

Passivated copper chip pads

Method for chip package

Magnetic attachment structure

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Heavy-wire bond arrangement and method for producing same

High density sensor array without wells

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Misalignment detection devices

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

Package-in-package using through-hole via die on saw streets

Manufcaturing method for room-temperature substrate bonding

Methods and apparatus for measuring analytes using large scale FET arrays

Method of transferring and bonding an array of micro devices

Semiconductor device with die stack arrangement including staggered die and efficient wire bonding

Multilayer printed wiring board

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

Package manufacturing method and semiconductor device

ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELECTRICAL CONTACTS

Method for building vertical pillar interconnect

Packaged microdevices and methods for manufacturing packaged microdevices

OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA

Processes and structures for IC fabrication

Semiconductor component and corresponding production method

Semiconductor device

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Method of manufacturing a wiring board having pads highly resistant to peeling

Molding method for COB-EUSB devices and metal housing package

Method of fabricating a circuit board structure

Leadframe and semiconductor package made using the leadframe

Bonding structure of multilayer copper bonding wire

Module and production method

Power semiconductor device with reduced contact resistance

Integrated Circuit Device With Wire Bond Connections

Method for making a solder joint

Manufacturing method and electronic module with new routing possibilities

Semiconductor device and method for manufacturing the same

Method of fabricating a packaged semiconductor