212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Semiconductor device and assembling method thereof
#1502Substrate with embedded stacked through-silicon via die
#1503Dual-leadframe multi-chip package and method of manufacture
#1504Method for producing an integrated circuit and resulting film chip
#1505Method for connecting a plurality of unpackaged substrates
#1506Electronic component employing a layered frame
#1507Method of forming a ring-shaped metal structure
#1508Solder paste, joining method using the same and joined structure
#1509CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE
#1510Enhanced stacked microelectronic assemblies with central contacts
#1511Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#1512SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1513Light emitting semiconductor element bonded to a base by a silver coating
#1514Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core
#1515SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
#1516Localized alloying for improved bond reliability
#1517SEMICONDUCTOR COMPONENT, SEMICONDUCTOR WAFER COMPONENT, MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT, AND MANUFACTURING METHOD OF JOINING STRUCTURE
#1518Method for chip scale package and package structure thereof
#1519Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
#1520Self-organizing network with chip package having multiple interconnection configurations
#1521Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#1522SEMICONDUCTOR DEVICE
#1523Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#1524Metal paste with co-precursors
#1525Metal paste with oxidizing agents
#1526Apparatus for thermal melting process and method of thermal melting process
#1527Bonding structure and bonding method of heat diffusion member, and cooling unit using the same
#1528Electronic assemblies including mechanically secured protruding bonding conductor joints
#1529FOUR MOSFET FULL BRIDGE MODULE
#1530MOLD RELEASE FILM AND PROCESS FOR PRODUCING LIGHT EMITTING DIODE
#1531Semiconductor device for battery power voltage control
#1532Method for packaging semiconductor dies having through-silicon vias
#1533Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure
#1534Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
#1535Electronic device and method of manufacturing electronic device
#1536Semiconductor device and method of manufacture thereof
#1537Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
#1538Wafer-level interconnect for high mechanical reliability applications
#1539BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#1540Solder bump connections
#1541Semiconductor device including a DC-DC converter with schottky barrier diode
#1542Compliant interconnects in wafers
#1543Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
#1544SEMICONDUCTOR DEVICES AND ELECTRICAL PARTS MANUFACTURING USING METAL COATED WIRES
#1545Die arrangement and method of forming a die arrangement
#1546INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF
#1547Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
#1548Brace for long wire bond
#1549Aluminum enhanced palladium CMP process
#1550Semiconductor device including a DC-DC converter
#1551Wire bonding method and semiconductor device
#1552Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package
#1553Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof
#1554Electronic component
#1555Semiconductor device and a method of manufacturing the same
#1556System and method for integrated waveguide packaging
#1557MODULE IC PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
#1558Stacked microelectronic assemby with TSVS formed in stages and carrier above chip
#1559Soft error rate mitigation by interconnect structure
#1560Thermosetting die-bonding film
#1561ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
#1562Mechanisms for resistivity measurement of bump structures
#1563Semiconductor device having semiconductor substrate electrode pads, and external electrodes
#1564Semiconductor chip and semiconductor device
#1565Surface mount semiconductor device
#1566Semiconductor device and method for manufacturing the same
#1567Semiconductor device and method of manufacturing the same
#1568Solder joint flip chip interconnection
#1569TCP-type semiconductor device and method of testing thereof
#1570Micro-fluidic injection molded solder (IMS)
#1571Method and device for discharging a fixed amount of liquid
#1572Methods for wafer bonding, and for nucleating bonding nanophases
#1573ADHESIVE COMPOSITION, ADHESIVE SHEET, CIRCUIT BOARD AND SEMICONDUCTOR DEVICE BOTH PRODUCED USING THESE, AND PROCESSES FOR PRODUCING THESE
#1574STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES
#1575Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
#1576Method of making thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
#1577Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#15784D Device, process and structure
#1579IMAGING OPERATIONS FOR A WIRE BONDING SYSTEM
#1580SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME
#1581CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME
#1582Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
#1583Memory device, laminated semiconductor substrate and method of manufacturing the same
#1584Substrate Arrangement and a Method of Manufacturing a Substrate Arrangement
#1585Integrated circuit device having die bonded to the polymer side of a polymer substrate
#1586Semiconductor device and semiconductor package having the same
#1587Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#1588Wafer level chip package and a method of fabricating thereof
#1589Solder interconnect pads with current spreading layers
#1590Semiconductor device including chip with complementary I/O cells
#1591STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING
#1592THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY
#1593Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
#1594ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#1595DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#1596SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING
#1597Semiconductor device and method of forming passive devices
#1598ULTRA THIN DIE TO IMPROVE SERIES RESISTANCE OF A FET
#1599LED PACKAGE
#1600Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
#1601Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
#1602Insulating Resin Film, Bonded Structure Using Insulating Resin Film, and Production Method of Bonded Structure
#1603PACKAGE CARRIER
#1604Wiring structure for improving crown-like defect and fabrication method thereof
#1605Solder mold plates used in packaging process and method of manufacturing solder mold plates
#1606Connecting and bonding adjacent layers with nanostructures
#1607Method of manufacturing a printed circuit board with an embedded electronic component
#1608Method Of Manufacturing Semiconductor Package Board
#1609Method for manufacturing magnetic memory chip device
#1610SEMICONDUCTOR DEVICE
#1611Input/output core design and method of manufacture therefor
#1612LEAD-FREE HIGH TEMPERATURE COMPOUND
#1613SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#1614Semiconductor structure and a method of manufacturing a semiconductor structure
#1615Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#1616SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1617Stacked integrated circuit package having recessed sidewalls
#1618Semiconductor packages and methods of packaging semiconductor devices
#1619Conductive pads defined by embedded traces
#1620Adding cap to copper passivation flow for electroless plating
#1621Grain refinement by precipitate formation in Pb-free alloys of tin
#1622Ni plating of a BLM edge for Pb-free C4 undercut control
#1623Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
#1624Semiconductor device
#1625Semiconductor device having conductive vias in peripheral region connecting shielding layer to ground
#1626SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#1627Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology
#1628ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#1629Semiconductor packages with reduced solder voiding
#1630Semiconductor device and method of manufacturing semiconductor device
#1631Wiring method and device
#1632BONDING WIRE FOR SEMICONDUCTOR
#1633Apparatus for manufacturing a hierarchical structure
#1634Packaging or mounting a component
#1635Multi-chip stacking method to reduce voids between stacked chips
#1636Laser assisted transfer welding process
#1637Composite nanometal paste of two-metallic-component type, bonding method, and electronic part
#1638BONDING SHEET
#1639Sintering materials and attachment methods using same
#1640Quad flat package with exposed paddle
#1641Light emitting device with electrode having recessed concave portion
#1642Semiconductor chip and semiconductor device including the same
#1643Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#1644Method for wafer bonding using gold and indium
#1645Flexible electronic devices and related methods
#1646Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#1647SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
#1648Dual lead frame semiconductor package and method of manufacture
#1649Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die
#1650Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#1651Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die
#1652ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
#1653Wire bonding apparatus and method using the same
#1654Electronic element unit and reinforcing adhesive agent
#1655FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1656Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices
#1657ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD
#1658Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same
#1659Manufacturing light emitting diode (LED) packages
#1660Electronic component and electronic device
#1661Multilayered printed circuit board and method for manufacturing the same
#1662Electronic device and electronic apparatus
#1663Semiconductor packages
#1664Power package module with low and high power chips and method for fabricating the same
#1665LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
#1666Bonding wire for semiconductor device
#1667Semiconductor device and method for manufacturing the same
#1668DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION
#1669BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
#1670Crack arrest vias for IC devices
#1671Interconnect assemblies and methods of making and using same
#1672Semiconductor device and method of forming wafer level ground plane and power ring
#1673Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof
#1674Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1675Grounded seal ring structure in semiconductor devices
#1676Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure
#1677Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
#1678Substrateless power device packages
#1679Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die
#1680Leadframe package with recessed cavity for LED
#1681FILL ROLL FOR PRODUCING SEMICONDUCTOR DEVICE
#1682Joining method and device produced by this method and joining unit
#1683Method of operating a clamping system of a wire bonding machine
#1684Bonding material using metal nanoparticles coated with C6-C8 fatty acids, and bonding method
#1685SINGLE CHIP SEMICONDUCTOR COATING STRUCTURE AND MANUFACTURING METHOD THEREOF
#1686FILM FOR SEMICONDUCTOR AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1687Semiconductor package and method of manufacturing the same
#1688Connecting member for connecting a semiconductor element and a frame, formed of an Al-based layer and first and second Zn-based layers provided on surfaces of the Al-based layer
#1689Power/ground layout for chips
#1690SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#1691SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
#1692POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE
#1693Device with semiconductor die attached to a leadframe
#1694Bond pad for wafer and package for CMOS imager
#1695HIGH-EFFICIENCY POWER CONVERTERS WITH INTEGRATED CAPACITORS
#1696Light emitting diode package having improved wire bonding structure
#1697Light emitting device and method for manufacturing same
#1698Light emitting diode chip and manufacturing method thereof
#1699ANISOTROPIC CONDUCTIVE PARTICLES
#1700System and method for packaging electronic devices
#1701TAPE APPLYING APPARATUS
#1702Apparatus for thermal control of semiconductor chip assembly and underfill
#1703Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1704Semiconductor Chip Attach Configuration Having Improved Thermal Characteristics
#1705METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
#1706Copper alloy bonding wire for semiconductor
#1707Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics
#1708Method of producing a chip package, and chip package
#1709Integrated circuit device and structure
#1710Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
#1711Microelectronic assemblies having compliancy and methods therefor
#1712Semiconductor chip having different pad width to UBM width ratios and method of manufacturing the same
#1713Copper pillar bump with cobalt-containing sidewall protection
#1714Under-bump metallization (UBM) structure and method of forming the same
#1715Conductive pillar structure
#1716Semiconductor device
#1717Leadframe package structure and manufacturing method thereof
#1718Mixed wire semiconductor lead frame package
#1719Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die
#1720Bonding apparatus and bonding method
#1721Bonding apparatus
#1722Method and system for forming conductive bumping with copper interconnection
#1723Dicing/die-bonding film, method of fixing chipped work and semiconductor device
#1724Semiconductor device comprising thin-film terminal with deformed portion
#1725Manufacturing of a device including a semiconductor chip
#1726Semiconductor having chip stack, semiconductor system, and method of fabricating the semiconductor apparatus
#1727SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1728Semiconductor assembly and semiconductor package including a solder channel
#1729Semiconductor device and semiconductor package having the same
#1730Method for manufacturing semiconductor device, and semiconductor device
#1731PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME
#1732Electronic component device, method of manufacturing the same and wiring substrate
#1733Massively parallel interconnect fabric for complex semiconductor devices
#1734ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
#1735Method of manufacturing semiconductor device
#1736Manufacturing method of semiconductor device
#1737Semiconductor die package including low stress configuration
#1738Off-chip VIAS in stacked chips
#1739Metal wiring structures for uniform current density in C4 balls
#1740Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
#1741Delamination resistant device package having raised bond surface and mold locking aperture
#1742Method for producing display device
#1743LED package
#1744Method of Contacting a Semiconductor Substrate
#1745Multilayered printed circuit board and method for manufacturing the same
#1746Brace for wire bond
#1747SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#1748FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL
#1749Semiconductor package having buried post in encapsulant and method of manufacturing the same
#1750Manufacturing method of semiconductor device
#1751PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
#1752Semiconductor device and method of bonding different size semiconductor die at the wafer level
#1753Methods of fabricating package stack structure and method of mounting package stack structure on system board
#1754Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
#1755Semiconductor structure and method for making same
#1756Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
#1757BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
#1758Method and system for improving reliability of a semiconductor device
#1759Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#1760Semiconductor device
#1761Lead frame, semiconductor device, and method of manufacturing semiconductor device
#1762Multi-chip semiconductor packages and assembly thereof
#1763Semiconductor device and manufacturing method therefor
#1764Semiconductor device and a method of manufacturing the same
#1765Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer
#1766Semiconductor device
#1767Semiconductor module including a switch and non-central diode
#1768Packaging structure
#1769METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS
#1770POLYMER CORE WIRE
#1771Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
#1772Methods and apparatus for measuring analytes using large scale FET arrays
#1773Fixture to constrain laminate and method of assembly
#1774Stacked die assemblies including TSV die
#1775Method of making a light emitting device having a molded encapsulant
#1776Apparatus and method for mounting semiconductor light-emitting element
#1777Device and method for manufacturing a device
#1778Semiconductor device manufacture in which minimum wiring pitch of connecting portion wiring layer is less than minimum wiring pitch of any other wiring layer
#1779Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assist
#1780Method for depackaging prepackaged integrated circuit die and a product from the method
#1781Ball grid array semiconductor package and method of manufacturing the same
#1782Semiconductor device and method of forming composite bump-on-lead interconnection
#1783Method for fabricating a neo-layer using stud bumped bare die
#1784SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1785Wire bond through-via structure and method
#1786Microsprings partially embedded in a laminate structure and methods for producing same
#1787Multi-function and shielded 3D interconnects
#1788Semiconductor device package and method of making a semiconductor device package
#1789Semiconductor device with parasitic bipolar transistor
#1790Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
#1791SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR
#1792Electronic device comprising a chip disposed on a pin
#1793Resin composition and semiconductor device produced by using the same
#1794METHOD AND APPARATUS FOR LOADING SOLDER BALLS
#1795Interposer with microspring contacts
#1796Printed wiring board
#1797Soldering entities to a monolithic metallic sheet
#1798Method of making a high frequency device package
#1799Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#1800Method for reducing UBM undercut in metal bump structures