H01L2924/01201 - CPC Classification Index

ClassID:

212116 ⎘

H01L2924/01201 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Semiconductor purity grades 1N purity grades, i.e. 90%

Recent Application in this class:

20190013290

2019-01-10

Wire bonding systems and related methods

20150054146

2015-02-26

SEMICONDUCTOR DEVICE

20130043593

2013-02-21

Semiconductor arrangement

20120292774

2012-11-22

SEMICONDUCTOR DEVICE

20120276693

2012-11-01

Module comprising a semiconductor chip

20110115068

2011-05-19

Power semiconductor module and method for operating a power semiconductor module

20110058979

2011-03-10

BONDING WIRE

20100239455

2010-09-23

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

20090297391

2009-12-03

MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF

#10

20090191088

2009-07-30

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

#11

20080230928

2008-09-25

Module comprising a semiconductor chip

#12

20080230915

2008-09-25

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

#13

20080075626

2008-03-27

Wire Bump Material

#14

20080050267

2008-02-28

Au Alloy Bonding Wire

#15

20080012132

2008-01-17

Chip structure with redistribution traces

#16

20070194460

2007-08-23

Cap layer for an aluminum copper bond pad