Patents-Review.com
ClassID:

212117 ⎘

H01L2924/01202 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Semiconductor purity grades 2N purity grades, i.e. 99%

Recent Application in this class:
#1
20190013290
2019-01-10

Wire bonding systems and related methods

 #2
20180122765
2018-05-03

Bonding wire for semiconductor device

 #3
20150054146
2015-02-26

SEMICONDUCTOR DEVICE

 #4
20130175677
2013-07-11

Integrated Circuit Device With Wire Bond Connections

 #5
20120292774
2012-11-22

SEMICONDUCTOR DEVICE

 #6
20120111927
2012-05-10

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

 #7
20120074551
2012-03-29

Semiconductor device

 #8
20110121458
2011-05-26

Bonding connection between a bonding wire and a power semiconductor chip

 #9
20110120594
2011-05-26

Bonding wire for semiconductor

 #10
20110115068
2011-05-19

Power semiconductor module and method for operating a power semiconductor module

 #11
20110089549
2011-04-21

SEMICONDUCTOR DEVICE

 #12
20110058979
2011-03-10

BONDING WIRE

 #13
20110011619
2011-01-20

Bonding wire for semiconductor devices

 #14
20100314156
2010-12-16

AU ALLOY WIRE FOR BALL BONDING

 #15
20100300741
2010-12-02

Aluminum bond pads with enhanced wire bond stability

 #16
20100294532
2010-11-25

Bonding wire for semiconductor devices

 #17
20100282495
2010-11-11

Bonding wire for semiconductor device

 #18
20100270515
2010-10-28

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

 #19
20100244249
2010-09-30

Semiconductor package and method of forming

 #20
20100239455
2010-09-23

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

 #21
20100126763
2010-05-27

WIRE BONDING METHOD, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING SAME

 #22
20100035385
2010-02-11

Aluminum bump bonding for fine aluminum wire

 #23
20090297391
2009-12-03

MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF

 #24
20090191088
2009-07-30

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

 #25
20090152729
2009-06-18

Semiconductor device

 #26
20090146321
2009-06-11

Wire bonding personalization and discrete component attachment on wirebond pads

 #27
20090127317
2009-05-21

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

 #28
20090115059
2009-05-07

Gold wire for semiconductor element connection

 #29
20090101695
2009-04-23

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

 #30
20090098687
2009-04-16

Integrated circuit package including wire bonds

 #31
20090039509
2009-02-12

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #32
20090032947
2009-02-05

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

 #33
20080073786
2008-03-27

Semiconductor device and method of manufacturing the same

 #34
20080050267
2008-02-28

Au Alloy Bonding Wire

 #35
20070216026
2007-09-20

Aluminum bump bonding for fine aluminum wire

 #36
20070194460
2007-08-23

Cap layer for an aluminum copper bond pad

 #37
20060186553
2006-08-24

Semiconductor device

 #38
20060138679
2006-06-29

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

 #39
20050275077
2005-12-15

High density chip scale leadframe package and method of manufacturing the package

 #40
20050200015
2005-09-15

Semiconductor device and method for manufacturing the same

 #41
20050035449
2005-02-17

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors