H01L2924/01203 - CPC Classification Index

ClassID:

212118 ⎘

H01L2924/01203 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Semiconductor purity grades 3N purity grades, i.e. 99.9%

Recent Application in this class:

20240113066

2024-04-04

ELECTRONIC DEVICE

20230013769

2023-01-19

COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE

20190013290

2019-01-10

Wire bonding systems and related methods

20180122765

2018-05-03

Bonding wire for semiconductor device

20150014399

2015-01-15

CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE CONDUCTIVE PASTE

20140295619

2014-10-02

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

20120306077

2012-12-06

Semiconductor device

20120299182

2012-11-29

Copper bonding wire for semiconductor device and bonding structure thereof

20120104613

2012-05-03

Bonding wire for semiconductor device

#10

20110304046

2011-12-15

Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer

#11

20110272802

2011-11-10

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

#12

20110241204

2011-10-06

Semiconductor device including coupling ball with layers of aluminum and copper alloys

#13

20110115068

2011-05-19

Power semiconductor module and method for operating a power semiconductor module

#14

20110104510

2011-05-05

Bonding structure of bonding wire

#15

20110062585

2011-03-17

Semiconductor device

#16

20110058979

2011-03-10

BONDING WIRE

#17

20110011619

2011-01-20

Bonding wire for semiconductor devices

#18

20100327450

2010-12-30

Semiconductor device bonding wire and wire bonding method

#19

20100314156

2010-12-16

AU ALLOY WIRE FOR BALL BONDING

#20

20100294532

2010-11-25

Bonding wire for semiconductor devices

#21

20100282495

2010-11-11

Bonding wire for semiconductor device

#22

20100239455

2010-09-23

COMPOSITE ALLOY BONDING WIRE AND MANUFACTURING METHOD THEREOF

#23

20100200981

2010-08-12

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

#24

20100200969

2010-08-12

Wirebonded semiconductor package

#25

20090297391

2009-12-03

MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF

#26

20090230172

2009-09-17

Method of bonding

#27

20090191088

2009-07-30

MANUFACTURING METHOD FOR A COMPOSITE METAL BONDING WIRE AND PRODUCTS THEREOF

#28

20090188696

2009-07-30

Bonding wire for semiconductor device

#29

20090039509

2009-02-12

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#30

20090032947

2009-02-05

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

#31

20090022621

2009-01-22

BONDING WIRE

#32

20080203568

2008-08-28

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

#33

20080105975

2008-05-08

Gold wire for connecting semiconductor chip

#34

20080073786

2008-03-27

Semiconductor device and method of manufacturing the same

#35

20080050267

2008-02-28

Au Alloy Bonding Wire

#36

20070284415

2007-12-13

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

#37

20070194460

2007-08-23

Cap layer for an aluminum copper bond pad

#38

20060186544

2006-08-24

Copper bonding wire for semiconductor packaging

#39

20050079347

2005-04-14

Gold bonding wires for semiconductor devices and method of producing the wires