Integrated circuit device including a copper pillar capped by barrier layer

Solder joint flip chip interconnection having relief structure

Package structure having embedded electronic component and fabrication method thereof

Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar

Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer

Reduced-stress bump-on-trace (BOT) structures

Three-dimensional system-in-a-package

POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF

Semiconductor package structure and method of fabricating the same

Multi-die packages incorporating flip chip dies and associated packaging methods

Semiconductor device and manufacturing method of the same

Package with multiple dies

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

Semiconductor devices and semiconductor packages

Etchant and method for manufacturing semiconductor device using same

Routing layer for mitigating stress in a semiconductor die

Semiconductor device and manufacturing method thereof

Methods for Lead Free Solder Interconnections for Integrated Circuits

Manufacturing method for semiconductor integrated device

REINFORCED FAN-OUT WAFER-LEVEL PACKAGE

STRUCTURE FOR MEASURING BUMP RESISTANCE AND PACKAGE SUBSTRATE COMPRISING THE SAME

Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device

Semiconductor device and method of forming IPD in fan-out wafer level chip scale package

Flip-chip, face-up and face-down centerbond memory wirebond assemblies

Multi chip package, manufacturing method thereof, and memory system having the multi chip package

Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer

Mechanisms for forming copper pillar bumps using patterned anodes

SEMICONDUCTOR PACKAGE

Circuit board, semiconductor element, semiconductor device, method for manufacturing circuit board, method for manufacturing semiconductor element, and method for manufacturing semiconductor device

Multi-chip module with stacked face-down connected dies

Method of manufacturing a semiconductor device

Method of making a semiconductor device having a functional capping

Stacked chip-on-board module with edge connector

Device and method including a soldering process

Formation of alpha particle shields in chip packaging

Wafer-leveled chip packaging structure and method thereof

Semiconductor package with embedded spiral inductor

Sensor mounted in flip-chip technology on a substrate

Multi-level options for power MOSFETS

Semiconductor device

Package substrate and fabricating method thereof

Method for fabricating multi-chip module with multi-level interposer

Method of assembling semiconductor device including insulating substrate and heat sink

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER

Optical printed circuit board and method of fabricating the same

Heat radiator and manufacturing method thereof

SEMICONDUCTOR DEVICE

Multi-chip package and method of providing die-to-die interconnects in same

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Bridging arrangement and method for manufacturing a bridging arrangement

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution

DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Packaging an electronic device

REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A REINFORCED VIA FARM INTERCONNECT STRUCTURE AND A METHOD OF REDESIGNING AN INTEGRATED CIRCUIT CHIP TO INCLUDE SUCH A REINFORCED VIA FARM INTERCONNECT STRUCTURE

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device

Wiring board, semiconductor device, and method for manufacturing wiring board

Wafer level packaging of electronic devices

LED package structure

Etchant and method for manufacturing semiconductor device using same

Method for fabricating a semiconductor and semiconductor package

WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device and method for fabricating the same

Integrated Circuit Package Security Fence

Semiconductor device with through silicon via and alignment mark

Ultra-thin power transistor and synchronous buck converter having customized footprint

Die-bonded LED

Semiconductor device

Production method of connection structure

Semiconductor device and a method of manufacturing the same

Controlled electroplated solder bumps

Packaged electronic devices having die attach regions with selective thin dielectric layer

Copper post solder bumps on substrate

Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR

ELECTRONIC DEVICE, ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING CIRCUIT BOARD ASSEMBLY

Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Methods of forming bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate, and semiconductor structures formed by such methods

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

Methods for forming a semiconductor structure

Semiconductor device and a method of manufacturing the same

Method for the production of an electronic component and electronic component produced according to this method

Selective electromigration improvement for high current C4s

Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

3D semiconductor device and structure with back-bias

Lead component and method for manufacturing the same, and semiconductor package

Semiconductor device and manufacturing method thereof

Flip chip semiconductor device

Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same

Light-reflective anisotropic conductive paste and light-emitting device

Semiconductor packages

Bonding apparatus and bonding method

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

Printed substrate manufacturing equipment and manufacturing method

Method of manufacturing semiconductor device

Reducing warpage for fan-out wafer level packaging

Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM

Metallic laminate and method for preparing the same

Semiconductor device and method of forming pad layout for flipchip semiconductor die

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Integrated circuit packaging system with step mold and method of manufacture thereof

Configurable interposer

Semiconductor packaging process using through silicon vias

Integrated circuit packaging system with interconnects and method of manufacture thereof

Solder in cavity interconnection structures

Magnetic integration double-ended converter

Techniques for packaging multiple device components

Chip scale package assembly in reconstitution panel process format

Apparatuses and methods to enhance passivation and ILD reliability

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

Semiconductor device and method of forming flipchip interconnect structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Apparatus for thermally enhanced semiconductor package

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit packaging system with interconnects and method of manufacture thereof

Leadframe-based mold array package heat spreader and fabrication method therefor

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

SYSTEM AND METHOD FOR IMPROVING FREQUENCY RESPONSE

FLIP-CHIP LED PACKAGING AND MANUFACTURING THEREOF

WAFER-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURE AND MANUFACTURING METHOD THEREOF

Wireless communication system

Semiconductor device and method of manufacturing the same

Approach for bonding dies onto interposers

Semiconductor laser mounting for improved frequency stability

Manufacturing method of semiconductor device, and semiconductor device

Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof

Virtually substrate-less composite power semiconductor device

Semiconductor apparatus including a metal alloy between a first contact and a second contact

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

IC devices having TSVS including protruding tips having IMC blocking tip ends

SEMICONDUCTOR DEVICE INCLUDING A BASE PLATE

Semiconductor apparatus and method for manufacturing the same

Power module for an automobile

Power device with bottom source electrode

Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Wiring substrate and method of manufacturing the same

Low cost high frequency device package and methods

Method of manufacturing optical module

Manufacturing method of a semiconductor load board

Method of manufacturing power semiconductor device

DEVICE INCLUDING A SEMICONDUCTOR CHIP

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

Semiconductor device and method of manufacturing the same

Air-gap C4 fluidic I/O interconnects and methods of fabricating same

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Semiconductor device adapted to improve heat dissipation

Diode array and method for producing a diode array

Integrated circuit package system with stackable devices and a method of manufacture thereof

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Solder bump interconnect

Package structure, fabricating method thereof, and package-on-package device thereby

Systems including an I/O stack and methods for fabricating such systems

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

STACKED DIE POWER CONVERTER

Optoelectronic Component Having a Semiconductor Body, an Insulating Layer, and a Planar Conductor Structure, and Method for the Production thereof

Light emitting diode emitter substrate with highly reflective metal bonding

Anisotropic conductive film, connection structure and method of producing the same

Semiconductor Load Board

Printed circuit board and semiconductor package using the same

Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

Electronic device with aerogel thermal isolation

Co-axial restraint for connectors within flip-chip packages

Solder ball for semiconductor packaging and electronic member using the same

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

Flip chip package

Semiconductor device and method of forming stress relief layer between die and interconnect structure

IGBT power semiconductor package having a conductive clip

Optoelectronic component and method for producing an opto-electronic component

Wire bond pad system and method

MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE

Through-hole electrode substrate and method of manufacturing the same

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Polymer and solder pillars for connecting chip and carrier

Method of manufacturing a semiconductor device and structure

Semiconductor packages and methods of packaging semiconductor devices

Method for fabricating flip-attached and underfilled semiconductor devices

Mechanical coupling in a multi-chip module using magnetic components

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

Heat radiation material, electronic device and method of manufacturing electronic device

Light emitting apparatus, illumination apparatus and display apparatus

Vertical ballast technology for power HBT device

MULTI-CHIP MODULE PACKAGE

SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD

Semiconductor devices including a through-substrate conductive member with an exposed end

Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Wiring connection method and functional device

Ni plating of a BLM edge for Pb-free C4 undercut control

Packaging Structure and Method

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Extending metal traces in bump-on-trace structures

Metal bumps for cooling device connection

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit micro-module

Semiconductor device and semiconductor device mounting structure

Sensor mounted in flip-chip technology at a substrate edge

Mosfet package

Electronic devices with yielding substrates

ELECTRONIC COMPONENT CLEANING DEVICE AND CLEANING METHOD

Routing method for flip chip package and apparatus using the same

Methods of fabricating semiconductor devices

Semiconductor device

CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME

METHOD FOR THE SELF-ASSEMBLY OF ELECTRICAL, ELECTRONIC OR MICROMECHANICAL COMPONENTS ON A SUBSTRATE

Electrical component having an electrical connection arrangement and method for the manufacture thereof

Three-Dimensional Stack Structure Of Wafer Chip Using Interposer

Semiconductor device, method for manufacturing the same, and power supply unit

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Semiconductor device and method of forming WLCSP structure using protruded MLP

Semiconductor device having agglomerate terminals

Bump-on-lead flip chip interconnection

Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor package

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

Semiconductor device and method of confining conductive bump material with solder mask patch

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Flip Chip Interconnection Having Narrow Interconnection Sites on the Substrate

Chip package with plank stack of semiconductor dies

Semiconductor-on-insulator with back side connection

POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING A POWER SEMICONDUCTOR MODULE

Low temperature high strength metal stack for die attachment

LIGHT EMITTING DEVICE PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ELECTRONIC CIRCUIT

Semiconductor device including gate electrode provided over active region in P-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus

Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

HEAT SINK AND METHOD OF MANUFACTURING THE SAME

Method and apparatus for interfacing multiple dies with mapping to modify source identity

Method of manufacturing semiconductor device having a bumped wafer and protective layer

Semiconductor Device and Method of Forming Narrow Interconnect Sites on Substrate with Elongated Mask Openings

Semiconductor device and manufacturing method therefor

Passivation layer for semiconductor device packaging

On-Chip RF shields with front side redistribution lines

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Protecting a mold having a substantially planar surface provided with a plurality of mold cavities

Testing of semiconductor chips with microbumps

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor package

MEMS and protection structure thereof

Stack package and method for manufacturing the same

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Semiconductor device including a lead frame

Semiconductor device and a method of manufacturing the same

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of testing the same

Semiconductor-on-insulator with back side strain inducing material

Method of forming a light emitting diode emitter substrate with highly reflective metal bonding

Apparatus and method for manufacturing a packaged device

Pick assembly for agricultural seed product and pick for the pick assembly

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY

Assembly jig for a semiconductor device and assembly method for a semiconductor device

IC device having low resistance TSV comprising ground connection

WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)

SURGE PROTECTION DEVICE

Semiconductor module having deflecting conductive layer over a spacer structure

CIRCUIT ARRANGEMENT AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

Semiconductor device having a vertical interconnect structure using stud bumps

Embedded semiconductor die package and method of making the same using metal frame carrier

SEMICONDUCTOR PACKAGE

Interconnection structure

Elongated bump structure for semiconductor devices

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Package-on-package using through-hole via die on saw streets

Extended under-bump metal layer for blocking alpha particles in a semiconductor device

Sensor device having electrode draw-out portions through side of substrate

Chip package structure with ENIG plating

Semiconductor device and method of forming stud bumps over embedded die

Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device

Rule-based semiconductor die stacking and bonding within a multi-die package

IMAGE SENSOR UNITS WITH STACKED IMAGE SENSORS AND IMAGE PROCESSORS

Capacitive coupler packaging structure

IC device having low resistance TSV comprising ground connection

Semiconductor packages and methods of packaging semiconductor devices

Dual molded multi-chip package system

Solder, soldering method, and semiconductor device

Circuit substrate and method of manufacturing same