Stackable semiconductor assemblies and methods of manufacturing such assemblies

Thermal enhanced package

Laminate electronic device

Carrier structures for microelectronic elements

Power module and method for manufacturing the same

Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module

Semiconductor element-embedded substrate, and method of manufacturing the substrate

Apparatus and methods for forming through vias

Stacked memory layers having multiple orientations and through-layer interconnects

Forming wafer-level chip scale package structures with reduced number of seed layers

Chip-stacked semiconductor package

Connecting function chips to a package to form package-on-package

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor module

SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS

SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING

Semiconductor device including a contact clip having protrusions and manufacturing thereof

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

Backside illumination sensor having a bonding pad structure and method of making the same

SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, WIRING SUBSTRATE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF WIRING SUBSTRATE

Oblique parts or surfaces

Coreless packaging substrate and method of fabricating the same

Coreless package substrate and fabrication method thereof

Ball-limiting-metallurgy layers in solder ball structures

Method of manufacturing a circuit substrate

Removal apparatuses for semiconductor chips

Methods of forming a metal pattern

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Four MOSFET full bridge module

Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices

Semiconductor device and manufacturing method thereof

Wafer Level Package and a Method of Forming the Same

Multi-component integrated circuit contacts

Stack package having flexible conductors

Bump-on-trace (BOT) structures

Interconnect structure for wafer level package

Conductive connecting member and manufacturing method of same

Electrically conductive paste, and electrically conducive connection member produced using the paste

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Method of manufacturing an electronic system

Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Flip-chip QFN structure using etched lead frame

Stacked semiconductor device and fabrication method for same

Systems and methods for vertically stacking a sensor on an integrated circuit chip

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK

Method of manufacturing semiconductor device

MICRO PIN HYBRID INTERCONNECT ARRAY

Die attached to a support member by a plurality of adhesive members

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

Connecting film, and joined structure and method for producing the same

Method for Predetermined Component Placement to a Target Platform

Method for Predetermined Component Placement to a Target Platform

Methods for controlling wafer curvature

Methods of processing substrates

Through wafer vias and method of making same

Semiconductor die package and method for making the same

Flexible electronic device and method for the fabrication of same

Fabrication method of semiconductor integrated circuit device

Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance

Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps

Interposer, its manufacturing method, and semiconductor device

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Chip package with reinforced positive alignment features

Enhanced WLP for superior temp cycling, drop test and high current applications

Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps

LOW PROFILE PACKAGE AND METHOD

SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES

Bump structure with barrier layer on post-passivation interconnect

Silicon carrier optoelectronic packaging

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE

Integrated circuit packaging system with wafer level reconfiguration and method of manufacture thereof

Methods and arrangements relating to semiconductor packages including multi-memory dies

Integrated circuit packaging system with exposed vertical interconnects and method of manufacture thereof

Optoelectronic component and method for producing an optoelectronic component

Die backside standoff structures for semiconductor devices

Semiconductor device and manufacturing of the semiconductor device

Semiconductor device with heat spreader

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Method for wafer level packaging of electronic devices

SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME

Manufacturing method including deformation of supporting board to accommodate semiconductor device

Method of producing a radiation-emitting optoelectronic component

BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS

Conductor structure element and method for producing a conductor structure element

Package structure, method for manufacturing same, and method for repairing package structure

Module substrate, module-substrate manufacturing method, and terminal connection substrate

Antenna device and wireless apparatus

Piezoelectric device and fabricating method thereof

Semiconductor device and manufacturing method

Method for fabricating a semiconductor and semiconductor package

Chip package and method for forming the same

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PADS AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with laser hole and method of manufacture thereof

MICROELECTRONIC DEVICE, STACKED DIE PACKAGE AND COMPUTING SYSTEM CONTAINING SAME, METHOD OF MANUFACTURING A MULTI-CHANNEL COMMUNICATION PATHWAY IN SAME, AND METHOD OF ENABLING ELECTRICAL COMMUNICATION BETWEEN COMPONENTS OF A STACKED-DIE PACKAGE

Electrical connection for multichip modules

Integrated circuit packaging system with package on package support and method of manufacture thereof

Semiconductor device and bonding material for semiconductor device

Semiconductor device with heat spreader

Flip chip interconnect solder mask

Flip chip interconnect solder mask

Wafer level chip scale package with reduced stress on solder balls

Enhanced bump pitch scaling

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof

Semiconductor device with heat spreader

Integrated circuit packaging system with support structure and method of manufacture thereof

Wiring board with built-in semiconductor element

Method of Manufacturing a semiconductor module and device for the same

Solder ball protection structure with thick polymer layer

Electronic device and manufacturing thereof

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

CHIP BONDING APPARATUS

Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via

METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES

Substrates with transferable chiplets

Low-stress TSV design using conductive particles

Apparatus of manufacturing semiconductor packages and methods of manufacturing semiconductor packages using the same

Chip with sintered connections to package

Chip package structure and manufacturing method thereof

Semiconductor device having through silicon vias and manufacturing method thereof

Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material

Semiconductor device structures

Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package

Substrate and assembly thereof with dielectric removal for increased post height

Methods for surface attachment of flipped active componenets

Bonded semiconductor structures and methods of forming same

Power package including multiple semiconductor devices

Method and apparatus for dicing die attach film on a semiconductor wafer

Impedence controlled packages with metal sheet or 2-layer RDL

Wiring substrate, semiconductor device and manufacturing method thereof

Semiconductor device

Chip package structure and manufacturing method thereof

Chip package structure and method of making the same

LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate

Module including a sintered joint bonding a semiconductor chip to a copper surface

Package substrate and fabrication method thereof

Multilayer pillar for reduced stress interconnect and method of making same

Apparatus for restricting moisture ingress

Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates

Conformal Coining of Solder Joints in Electronic Packages

ELECTRONIC COMPONENT MOUNTING METHOD

Semiconductor device and method of manufacturing same

Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Power converter, semiconductor device, and method for manufacturing power converter

Component-embedded substrate

PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

Multi-component power structures and methods for forming the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming WLCSP structure using protruded MLP

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME

Conductive pads defined by embedded traces

Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector

Semiconductor device including excess solder

Protective layer for protecting TSV tips during thermo-compressive bonding

3D IC packaging structures and methods with a metal pillar

Connector design for packaging integrated circuits

Wafer-level package device

SEMICONDUCTOR PACKAGE WITH PRE-SOLDERED GROOVES IN LEADS

CHIP PACKAGE

HIGH-FREQUENCY MODULE MANUFACTURING METHOD

Semiconductor device, semiconductor package, and electronic device

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

Semiconductor device including Schottky barrier diode

Power semiconductor device

Metal trace fabrication for optical element

Electronic component module

Microelectronic substrate for alternate package functionality

ESTIMATION OF PRESENCE OF VOID IN THROUGH SILICON VIA (TSV) BASED ON ULTRASOUND SCANNING

MODULE MANUFACTURING METHOD

Method for fabricating packaging substrate with embedded semiconductor component

Packaging jig and process for semiconductor packaging

Semiconductor device including semiconductor chips with different thickness

Distributed semiconductor device methods, apparatus, and systems

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Connecting and bonding adjacent layers with nanostructures

Memory device and fabricating method thereof

Use of a local constraint to enhance attachment of an IC device to a mounting platform

3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

Integrated circuit apparatus, systems, and methods

SEMICONDUCTOR PACKAGES

Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die

Package-on-package process for applying molding compound

Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

LEADFRAME-BASED BALL GRID ARRAY PACKAGING

Stacked wafer level package having a reduced size

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Conductive via structure

Power Semiconductor Module with Embedded Chip Package

Semiconductor device and method of manufacturing semiconductor device

Method for dispensing solder on a substrate and method for mounting semiconductor chips

Alpha-particle emitter removal

Bonding material and bonding method using the same

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

Fabrication method of embedded chip substrate

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

MEMS anchor and spacer structure

Stacked semiconductor package

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Protection layer for adhesive material at wafer edge

Integrated circuit package with discrete components surface mounted on exposed side

Semiconductor structure having offset passivation to reduce electromigration

SEMICONDUCTOR DEVICE

Method for producing a metal layer on a substrate and device

Shielded electronic components and method of manufacturing the same

Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof

Flank wettable semiconductor device

Common drain exposed conductive clip for high power semiconductor packages

Multi-transistor exposed conductive clip for high power semiconductor packages

Thermally enhanced semiconductor package with exposed parallel conductive clip

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Methods and structures for forming integrated semiconductor structures

Semiconductor devices including stress relief structures

Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer

Chip package and package wafer with a recognition mark, and method for forming the same

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

Vertical MOSFET device

METHOD OF JOINING A CHIP ON A SUBSTRATE

Method for soldering surface-mount component and surface-mount component

Arrangement for solder bump formation on wafers

Flexible interconnect pattern on semiconductor package

Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Method for manufacturing semiconductor modules

Wafer level IC assembly method

Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)

METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD

EMBEDDED CHIP PACKAGE

Board-level package with tuned mass damping structure

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

Robust FBEOL and UBM structure of C4 interconnects

FORMATION OF THROUGH-SILICON VIA (TSV) IN SILICON SUBSTRATE

Semiconductor device and a manufacturing method thereof

Semiconductor device

Die stacking with an annular via having a recessed socket

Doping Minor Elements into Metal Bumps

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Chip package and method for forming the same

Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance

SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

Method of producing semiconductor module and semiconductor module

Integrated circuit package and packaging methods

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR MODULE USING THE SAME

Wafer level package with thermal pad for higher power dissipation

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Semiconductor device

3D interconnection structure and method of manufacturing the same

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE

SEMICONDUCTOR CHIP MODULE AND PLANAR STACK PACKAGE HAVING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Manufacturing electronic device having contact elements with a specified cross section

Method for manufacturing printed circuit board

Universal chip carrier and method

Solar cell assembly II

Electronic Component-Embedded Board and Method of Manufacturing the Same

Method for fluid guided self-assembly of microcomponents

METHOD FOR PRODUCING A TWO-SIDED FAN-OUT WAFER LEVEL PACKAGE WITH ELECTRICALLY CONDUCTIVE INTERCONNECTS, AND A CORRESPONDING SEMICONDUCTOR PACKAGE

Manufacturing method of semiconductor device

Method of manufacturing chip-stacked semiconductor package

Method of producing semiconductor device with patterned photosensitive adhesive

Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit

Circuit board having semiconductor chip embedded therein

Circuit module and manufacturing method for the same

Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip

Integrated circuit packaging system with formed interconnects and method of manufacture thereof

Integrated circuit packaging system with electrical interface and method of manufacture thereof

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die

Buffer pad in solder bump connections and methods of manufacture

Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof

Chip package and fabrication method thereof

Copper pillar bump with non-metal sidewall protection structure and method of making the same

Semiconductor structure and fabrication method thereof

Semiconductor device and method of producing same

Window interposed die packaging

Semiconductor device and method of manufacturing same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with pad connection and method of manufacture thereof

Vertical power transistor die packages and associated methods of manufacturing

EPOXY COATING ON SUBSTRATE FOR DIE ATTACH

Module comprising a semiconductor chip

Semiconductor device and method of forming wafer level die integration

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP

Chip-packaging module for a chip and a method for forming a chip-packaging module

Contact Metal for Hybridization and Related Methods

Chip package with a chip embedded in a wiring body