Power semiconductor package

Chip on film (COF) package having test line for testing electrical function of chip and method for manufacturing same

Electrical connection device

Fabrication method of semiconductor integrated circuit device

Multi-chip package with offset die stacking

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

Layered chip package and method of manufacturing same

Compliant printed circuit wafer level semiconductor package

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Die edge contacts for semiconductor devices

Ramp-stack chip package with static bends

Semiconductor device and manufacturing method of semiconductor device

Embedded package and method for manufacturing the same

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Chip package

LED PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF

MULTI-CHIP PACKAGES

Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING EXPOSING A DICING LINE ON A WAFER

Leadless array plastic package with various IC packaging configurations

METHOD FOR MANUFACTURING CHIP PACKAGE

Method of manufacturing semiconductor device

Method for detecting the under-fill void in flip chip BGA

FILM FOR USE IN MANUFACTURING SEMICONDUCTOR DEVICES, METHOD FOR PRODUCING THE FILM AND SEMICONDUCTOR DEVICE

Optical communication in a ramp-stack chip package

Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems

Stretchable electronic device

Semiconductor package with thermal heat spreader

Semiconductor apparatus, inspection method thereof and electric device

Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same

Bumpless build-up layer package with pre-stacked microelectronic devices

Semiconductor device and method for manufacturing the same

Substrate dicing technique for separating semiconductor dies with reduced area consumption

Semiconductor storage device and a method of manufacturing the semiconductor storage device

Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component

Method and system for routing electrical connections of semiconductor chips

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE HAVING THROUGH-SILICON-VIA (TSV) CHIP EMBEDDED THEREIN AND FABRICATION METHOD THEREOF

Structures embedded within core material and methods of manufacturing thereof

Package structure

Semiconductor device and method for manufacturing thereof

Semiconductor package

Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package

Bump structure with underbump metallization structure and integrated redistribution layer

Semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

Low-cost 3D face-to-face out assembly

Package substrate having main dummy pattern located in path of stress

Stress reduction in chip packaging by using a low-temperature chip-package connection regime

Pillar bumps and process for making same

Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die

Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method

Semiconductor die terminal

Semiconductor device

Semiconductor package for forming a leadframe package

Singulation method for semiconductor package with plating on side of connectors

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device, method for manufacturing same, and semiconductor apparatus

Cylindrical embedded capacitors

Semiconductor device

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

Structure and process for electrical interconnect and thermal management

Wiring board and method of manufacturing a semiconductor device

SQUEEGEE MODULE

Multilevel interconnection system

Method of manufacturing semiconductor package

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Flip chip bonder head for forming a uniform fillet

SER testing for an IC chip using hot underfill

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor memory device and semiconductor memory card

Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)

Compliant printed circuit semiconductor package

Semiconductor device and electronic apparatus including the same

Semiconductor device production method and semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Mechanisms for forming copper pillar bumps using patterned anodes

Method of packaging an integrated circuit using a laser to remove material from a portion of a lead frame

Image sensor package with dual substrates and the method of the same

Semiconductor chip with thermal interface tape

Printed circuit board and method of manufacturing the same

Manufacturing method of printed circuit board embedded chip

Process for making conductive post with footing profile

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD FOR ENCAPSULATING SEMICONDUCTOR, AND SOLVENT-BORNE SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION

Method for producing a semiconductor element

Component arrangement and method for production thereof

DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD

Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die

Repairable semiconductor device and method

Method of manufacturing and assembling semiconductor chips with offset pads

VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME

Thermal enhancement for multi-layer semiconductor stacks

Impedance controlled electrical interconnection employing meta-materials

Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Semi-conductor chip with compressible contact structure and electronic package utilizing same

Stacked Semiconductor Device And Method Of Fabricating The Same

Chip scale package with electronic component received in encapsulant, and fabrication method thereof

MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING

Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die

Semiconductor device and method of manufacturing the same

Method for producing a high-temperature and temperature-change resistant connection between a semiconductor module and a connection partner

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Through hole vias at saw streets including protrusions or recesses for interconnection

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE

Process for chip capacitive coupling

Semiconductor package and method of attaching semiconductor dies to substrates

Semiconductor package having main stamp and sub-stamp

Semiconductor device having a first conductive member connecting a chip to a wiring board pad and a second conductive member connecting the wiring board pad to a land on an insulator covering the chip and the wiring board

Side wettable plating for semiconductor chip package

Systems and Methods for Heat Dissipation Using Thermal Conduits

Stacked assembly including plurality of stacked microelectronic elements

Three-dimensional integrated circuits with protection layers

Chip scale package and fabrication method thereof

Package substrate for bump on trace interconnection

Semiconductor package and manufacturing method thereof

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Electronic component and method for manufacturing the same

Semiconductor integrated circuit device

Package structure with underfilling material and packaging method thereof

SYSTEMS AND METHODS FOR REINFORCING CHIP PACKAGES

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Flip chip package utilizing trace bump trace interconnection

Electrical contact alignment posts

Flexible micro-system and fabrication method thereof

Self-aligning structures and method for integrated chips

Package-on-package with fan-out WLCSP

Semiconductor device and semiconductor circuit substrate

Semiconductor device and method for producing such a device

Bottom source power MOSFET with substrateless and manufacturing method thereof

Compact semiconductor package with integrated bypass capacitor

Package and fabrication method of the same

Printed wiring board and a method of manufacturing a printed wiring board

ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD

Single shot molding method for COB USB/EUSB devices with contact pad ribs

Method of manufacturing component embedded printed circuit board

Manufacturing method of semiconductor apparatus and semiconductor apparatus

Alpha particle blocking wire structure and method fabricating same

Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device

Semiconductor device and manufacturing method thereof

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE AND ITS USE

Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device

Embedded wafer-level bonding approaches

Ultra-thin quad flat no-lead (QFN) package

Semiconductor device having a semiconductor chip, and method for the production thereof

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE AND METHOD FOR PRODUCING THE FILM, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT AND METHOD FOR PRODUCING AN ELECTRICAL OR ELECTRONIC COMPOSITE COMPONENT

Method of making an electronic device

Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques

LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME

Film for flip chip type semiconductor back surface

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

Power semiconductor module, method for producing a power semiconductor module and a housing element for a power semiconductor module

Chip package and fabricating method thereof

Electronic device and method for production

Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure

Solder interconnect on IC chip

BALL GRID ARRAY PACKAGE

Routable array metal integrated circuit package fabricated using partial etching process

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device

SEMICONDUCTOR PACKAGE

Semiconductor device cover mark

Microelectronic packages with nanoparticle joining

Reinforced Wafer-Level Molding to Reduce Warpage

Semiconductor device, lead frame assembly, and method for fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device packages having electromagnetic interference shielding and related methods

Wafer level chip scale package

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Optical connection through single assembly overhang flip chip optics die with micro structure alignment

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV) WITH HEATED SUBSTRATE AND COOLED ELECTROLYTE

Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production

Substrate bonding system and method of modifying the same

METHODS OF TEACHING BONDING LOCATIONS AND INSPECTING WIRE LOOPS ON A WIRE BONDING MACHINE, AND APPARATUSES FOR PERFORMING THE SAME

Arrangement for energy conditioning

Reworkable underfills for ceramic MCM C4 protection

Method for forming terminal of stacked package element and method for forming stacked package

Method of producing semiconductor chip laminate comprising an adhesive that comprises a curing compound, curing agent and spacer particles

Forming low stress joints using thermal compress bonding

Device and manufacturing method of the same

SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY

Tiered integrated circuit assembly and a method for manufacturing the same

Microelectronic elements with post-assembly planarization

Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis

Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device

FLIP-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME USING ABLATION

Semiconductor device with conductive vias between saw streets

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Methods of forming semiconductor elements using micro-abrasive particle stream

SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP

Semiconductor device

Integrated circuit package with open substrate and method of manufacturing thereof

CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT

Semiconductor device and method of forming stress relief layer between die and interconnect structure

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Doping minor elements into metal bumps

Multi-die stacking using bumps with different sizes

Reducing delamination between an underfill and a buffer layer in a bond structure

Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch

Method and package for circuit chip packaging

Chip scale package and fabrication method thereof

Mold design and semiconductor package

Microelectronic elements having metallic pads overlying vias

Substrate for semiconductor element, method for manufacturing substrate for semiconductor element, and semiconductor device

BONDING STRUCTURE AND METHOD

Microelectronic elements with rear contacts connected with via first or via middle structures

Semiconductor device and method of manufacturing the same

Method of assembling shielded integrated circuit device

Method of chip package build-up

Metal-contamination-free through-substrate via structure

Method for modular arrangement of a silicon based array and modular silicon based array

LED-BASED LIGHT EMITTING DEVICES

Semiconductor device for driving electric motor

Thermal compress bonding

Method of manufacturing PCB having electronic components embedded therein

Semiconductor package and mobile device using the same

Method of manufacturing wafer level package

Power semiconductor module and method of manufacturing the same

Semiconductor device package and method of assembly thereof

System and method for multi-chip module die extraction and replacement

PCB-mounted integrated circuits

Power module

Method for manufacturing semiconductor devices having a metallisation layer

Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another

Semiconductor and a method of manufacturing the same

Layered chip package and method of manufacturing same

Method for forming 3D-interconnect structures with airgaps

Die package structure

PACKAGE-ON-PACKAGE SEMICONDUCTOR PACKAGE HAVING SPACERS DISPOSED BETWEEN TWO PACKAGE SUBSTRATES

CHIP SCALE PACKAGE AND FABRICATION METHOD THEREOF

Packaging Structure and Method

Semiconductor device having an interconnect structure with TSV using encapsulant for structural support

Package structure

Stackable molded microelectronic packages with area array unit connectors

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Conductive sidewall for microbumps

Recessed pillar structure

Semiconductor device and heat sink with 3-dimensional thermal conductivity

Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die

Chip package and method for forming the same

Substrate stand-offs for semiconductor devices

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Submount

THERMAL FLEX CONTACT CARRIERS #2

Joint quality inspection and joint quality inspection method

Solder bump with inner core pillar in semiconductor package

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer

UBM Etching Methods

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Misalignment correction for embedded microelectronic die applications

Power semiconductor module and fabrication method

Wiring board and method for manufacturing the same

Semiconductor chip and stack package having the same

Resin-encapsulated semiconductor device

Backside processing of semiconductor devices

Methods, devices, and materials for metallization

Semiconductor device and package

SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF

Microelectronic packages with dual or multiple-etched flip-chip connectors

Method of forming Cu pillar capped by barrier layer

Method of forming semiconductor die

Conductive pillar for semiconductor substrate and method of manufacture

High density chip stacked package, package-on-package and method of fabricating the same

Semiconductor device

Semiconductor device

Method for reducing chip warpage

Semiconductor device having a capacitor

Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids

Multipath soldered thermal interface between a chip and its heat sink

CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL

Conductive bumps, wire loops, and methods of forming the same

Wiring board and method for manufacturing the same

Multilayered printed circuit board and method for manufacturing the same

Method of manufacturing printed wiring board

Method of semiconductor device protection

SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND

Internal packaging of a semiconductor device mounted on die pads

BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER

Structure and process for the formation of TSVs

Semiconductor package and method of fabricating the same

Semiconductor package and method of forming similar structure for top and bottom bonding pads

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

Semiconductor package cooled by grounded cooler

Package for high power devices

Semiconductor device with exposed thermal conductivity part

Semiconductor package with an embedded printed circuit board and stacked die

Semiconductor module and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device