Solder alloy and semiconductor device

Wafer level chip scale package without an encapsulated via

Lead frame ball grid array with traces under die

Semiconductor chip, electrode structure therefor and method for forming same

Method of fabricating a conductive post on an electrode

Conductive pillar structure for semiconductor substrate and method of manufacture

Wafer-level packaged device having self-assembled resilient leads

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor device and electronic device

Method for manufacturing a microelectronic package comprising at least one microelectronic device

Semiconductor device and method of patterning resin insulation layer on substrate of the same

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

III-nitride power device with solderable front metal

Semiconductor chip with a bonding pad having contact and test areas

Flux-free chip to wafer joint serial thermal processor arrangement

Stacking package structure with chip embedded inside and die having through silicon via and method of the same

Package process of stacked type semiconductor device package structure

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Semiconductor device and a method of manufacturing the same

Rule-based semiconductor die stacking and bonding within a multi-die package

Asymmetric Front/Back Solder Mask

Polymer matrices for polymer solder hybrid materials

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

Conductive pillar structure for semiconductor substrate and method of manufacture

Electronic device package and method for fabricating the same

Lead free solder interconnections for integrated circuits

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Electronic device package and fabrication method thereof

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

3D IC architecture with interposer and interconnect structure for bonding dies

Pillar structure having a non-planar surface for semiconductor devices

Semiconductor device and semiconductor assembly with lead-free solder

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Manufacturing of a device including a semiconductor chip

SEMICONDUCTOR PACKAGE

Stacked semiconductor package

Systems and Methods Providing Arrangements of Vias

Surface Preparation of Die for Improved Bonding Strength

Semiconductor package of a flipped MOSFET and its manufacturing method

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Vertical LED chip package on TSV carrier

Micro-fluidic injection molded solder (IMS)

Cleaning system and a package carrier for a semiconductor package

Method and apparatus for interconnect layout in an integrated circuit

Method to form solder deposits on substrates

Method for manufacturing an electronic device

Semiconductor device

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

Power semiconductor device

Integrated circuits having TSVs including metal gettering dielectric liners

Solder bump interconnect

Semiconductor module and portable apparatus provided with semiconductor module

Protruding TSV tips for enhanced heat dissipation for IC devices

Stress buffer structures in a mounting structure of a semiconductor device

T-shaped post for semiconductor devices

STACK PACKAGE

Method of manufacturing a semiconductor device

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

LED package and method for manufacturing same

LED package, method for manufacturing LED package, and packing member for LED package

LED assembly with a protective frame

LED PACKAGE

RFID tags and processes for producing RFID tags

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

Stable electroless fine pitch interconnect plating

Semiconductor device and a method of manufacturing the same

Electronic device and manufacturing method of the same

Integrated semiconductor substrate structure using incompatible processes

Packaging method involving rearrangement of dice

Packaging method involving rearrangement of dice

Array-molded package-on-package having redistribution lines

Dual carrier for joining IC die or wafers to TSV wafers

Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device structures and electronic devices including same hybrid conductive vias

Semiconductor device

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

Method of manufacturing layered chip package

Etched recess package on package system

Co-axial restraint for connectors within flip-chip packages

Multi-chip package having frame interposer

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

Method of stacking flip-chip on wire-bonded chip

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Semiconductor device

Packaged semiconductor product and method for manufacture thereof

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Encapsulation, MEMS and encapsulation method

Enhanced magnetic self-assembly using integrated micromagnets

Pad layout method for surface mount circuit board and surface mount circuit board thereof

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Stable Gold Bump Solder Connections

Semiconductor device

Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof

Chip packaging with metal frame pin grid array

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN

Multilayer printed circuit board

Precision high-frequency capacitor formed on semiconductor substrate

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip

Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

Bonded structure and manufacturing method for bonded structure

Stacked semiconductor components having conductive interconnects

SEMICONDUCTOR PACKAGE

Semiconductor device having conductive pads and a method of manufacturing the same

Method for modular arrangement of a silicon based array and modular silicon based array

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Semiconductor packages including die and L-shaped lead and method of manufacture

Semiconductor device and manufacturing method thereof

Dual die semiconductor package

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Arrangement for energy conditioning

Method for bonding high heat conductive insulating resin

Method and system for drug delivery to the eye

Method of manufacturing an interconnect structure for a semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

Reworkable electronic device assembly and method

4D device process and structure

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE

Dual Interconnection in Stacked Memory and Controller Module

Grid array connection device and method

Semiconductor device sealed in a resin section and method for manufacturing the same

SEMICONDUCTOR DEVICE

Wiring substrate, manufacturing method thereof, and semiconductor package

Attaching passive components to a semiconductor package

REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY

Chip package and fabrication method thereof

Solder Pillars in Flip Chip Assembly

Semiconductor package and manufacturing method thereof and encapsulating method thereof

Microelectronic devices

Semiconductor package

Semiconductor package with single sided substrate design and manufacturing methods thereof

Manufacturing method of lead frame substrate and semiconductor apparatus

Chip package and fabrication method thereof

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Semiconductor device including a DC-DC converter having a metal plate

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Nanotube modified solder thermal intermediate structure, systems, and methods

Plating method, semiconductor device fabrication method and circuit board fabrication method

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

Bond pad connection to redistribution lines having tapered profiles

MANUFACTURING METHOD OF SEMI-CONDUCTOR CHIP PACKAGE

Semiconductor package having buss-less substrate

Method for Fabricating Array-Molded Package-on-Package

Method of manufacturing semiconductor device

METHOD OF PACKAGING SEMICONDUCTOR DEVICE

Apparatus and method for predetermined component placement to a target platform

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Integrated circuit micro-module

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device having elastic solder bump to prevent disconnection

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

PB-free solder bumps with improved mechanical properties

Semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor package and method of manufacturing the same

Lead frame substrate and method of manufacturing the same, and semiconductor device

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration

Semiconductor device

Wafer level stack die package

Method for Soldering Contact Wires to Solar Cells

Flip-chip mounting method and bump formation method

INTEGRATED DEVICE

Acrylic insulating adhesive

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Method of manufacturing semiconductor device

Method for making a stackable package

Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME

Fan-out wafer level package with polymeric layer for high reliability

Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages

Quad flat no lead (QFN) package

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

Integrated circuit packaging system having planar interconnect and method for manufacture thereof

SEMICONDUCTOR DEVICE

Semiconductor module

Semiconductor package and stack semiconductor package having the same

Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

Modified chip attach process

Micro-bump structure

Semiconductor package having electrical connecting structures and fabrication method thereof

Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture

Semiconductor device and method for manufacturing the same

Semiconductor package and method of manufacturing the same

RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

METHOD FOR MANUFACTURING A FAN-OUT EMBEDDED PANEL LEVEL PACKAGE

Semiconductor package having chip using copper process

Fan-out chip scale package

Thermally enhanced expanded wafer level package ball grid array structure and method of making the same

Stack package

Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Chip package

ELECTRICAL MODULE

Contacting a device with a conductor

Method of repairing probe pads

Bonding apparatus

Wiring board capable of containing functional element and method for manufacturing same

Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

Structure of circuit board and method for fabricating the same

Method for fabricating electrical bonding pads on a wafer

Manufacturing method of semiconductor device

Overcoming laminate warpage and misalignment in flip-chip packages

Method of manufacturing semiconductor device

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Method for manufacturing chips

Fabrication method for semiconductor device

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Systems employing a stacked semiconductor package

Method for producing a non-plane element

Integrated circuit with inductive bond wires

Microelectronic assembly with joined bond elements having lowered inductance

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Wafer-level stack package and method of fabricating the same

Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process

Metal plugged substrates with no adhesive between metal and polyimide

Contact-based encapsulation

Lead frame land grid array with routing connector trace under unit

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Semiconductor device and method for fabricating the same

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Pre-soldered leadless package

Structures and methods to reduce maximum current density in a solder ball

Flange for semiconductor die

Window ball grid array (BGA) semiconductor packages

Integrated circuit package with embedded components

Semiconductor chip device with solder diffusion protection

Stackable circuit structures and methods of fabrication thereof

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

Integrated circuit package system employing device stacking

METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Solder in cavity interconnection technology

Printed wiring board and method for manufacturing printed wiring board

Method and apparatus for pass/fail determination of bonding and bonding apparatus

Semiconductor device and communication method

Semiconductor processing methods

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Manufacturing method for semiconductor device

Semiconductor connection component

Semiconductor package with a support structure and fabrication method thereof

External storage device and method of manufacturing external storage device

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Semiconductor device having a microcomputer chip mounted over a memory chip

Semiconductor device and electronic device

Semiconductor devices including voltage switchable materials for over-voltage protection

Ball grid array package enhanced with a thermal and electrical connector

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device and method for manufacturing the same

High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming same

Electronic device package and method for fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device, substrate and semiconductor device manufacturing method

Panel based lead frame packaging method and device

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Semiconductor device and manufacturing method thereof

Integrated circuit with pads connected by an under-bump metallization and method for production thereof

Bonding structure and method for manufacturing same

FUEL RESISTANCE PACKAGE

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

Method for manufacturing an electronic assembly

Semiconductor Device with Improved Contacts

Method for manufacturing lamination type semiconductor integrated device

Leadframe for leadless package, structure and manufacturing method using the same

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Method for manufacturing semiconductor device

REBUILT WAFER ASSEMBLY