METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES INCLUDING SAW SINGULATION

Photosensitive composition

Die package

CIRCUIT BOARD STRUCTURE, PACKAGING STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor device

Semiconductor device with stacked semiconductor chips

Semiconductor device having double side electrode structure

Electronic device package and method of manufacture

Flip chip interconnection structure

Integrated circuits with multiple I/O regions

Cu pillar bump with electrolytic metal sidewall protection

Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process

Power block and power semiconductor module using same

DIE PACKAGE AND CORRESPONDING METHOD FOR REALIZING A DOUBLE SIDE COOLING OF A DIE PACKAGE

Integrated circuit including bond wire directly bonded to pad

Power semiconductor device packaging

Semiconductor device packages with electromagnetic interference shielding

Wafer-bump structure

THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF

Semiconductor device connection

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SOI Wafer and Method of Forming the SOI Wafer with Through the Wafer Contacts and Trench Based Interconnect Structures that Electrically Connect the Through the Wafer Contacts

Reaction absorber and semiconductor assembling system

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Method of manufacturing semiconductor apparatus

STACKED WAFER MANUFACTURING METHOD

Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof

Chip embedded substrate and method of producing the same

Semiconductor memory device

Semiconductor device and method of forming conductive vias with trench in saw street

Package-on-package system with through vias and method of manufacture thereof

Stack package having flexible conductors

Integrated Circuit Package Having Under-Bump Metallization

Conductive feature for semiconductor substrate and method of manufacture

Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant

Semiconductor device and method of wafer level package integration

Wafer level die integration and method therefor

Routing layer for mitigating stress in a semiconductor die

Die structure and die connecting method

Method for fabricating bump structure without UBM undercut

Semiconductor device having multiple semiconductor elements

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Stacked semiconductor package

Chip package structure and method of making the same

Ultra high speed signal transmission/reception

Semiconductor chip embedded with a test circuit

Manufacturing method for electronic devices

Semiconductor device capable of switching operation modes

Method of forming a micro pin hybrid interconnect array

Apparatus with a multi-layer coating and method of forming the same

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Inverse chip connector

STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS

Thru silicon enabled die stacking scheme

Power semiconductor module

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Process control and manufacturing method for fan out wafers

Package substrate and fabricating method thereof

Method of manufacturing semiconductor device

Dummy pattern in wafer backside routing

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

Semiconductor device

Lead frame for semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Circuit board with embedded component and method of manufacturing same

Process for the wafer-scale fabrication of electronic modules for surface mounting

Structure and method of forming pillar bumps with controllable shape and size

MANUFACTURING METHOD OF SEMICONDUCTOR CHIP-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime

Packaging process to create wettable lead flank during board assembly

IRON PARTICULATE-REINFORCED TIN BASED MATRIX COMPOSITE SOLDER BALL AND FLIP CHIP BALL PLACEMENT METHOD USING SAME

Mount board and electronic device

Semiconductor device accommodating semiconductor module with heat radiation structure

APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM

EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF

LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

Wire bonding structure of semiconductor device and wire bonding method

Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

Semiconductor device with improved resin configuration

Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Virtually substrate-less composite power semiconductor device and method

Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same

SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND PORTABLE APPARATUS

Dummy metal design for packaging structures

Radiate under-bump metallization structure for semiconductor devices

Power semiconductor module

Semiconductor device packages with fan-out and with connecting elements for stacking and manufacturing methods thereof

Semiconductor device packages including connecting elements

SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE

Semiconductor package

LEAD FRAME WITH RECESSED DIE BOND AREA

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and communication method

Power Semiconductor Device with Low Parasitic Metal and Package Resistance

Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device

PRINTED CIRCUIT BOARD UNIT, ELECTRONIC DEVICE AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

MULTIPLE DIE STRUCTURE AND METHOD OF FORMING A CONNECTION BETWEEN FIRST AND SECOND DIES IN SAME

Thermo-compression bonded electrical interconnect structure and method

SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of making semiconductor package having redistribution layer

Semiconductor device and manufacturing method of the same

Die level integrated interconnect decal manufacturing method and apparatus

Method of manufacturing semiconductor device

Electronic device wafer level scale packages and fabrication methods thereof

Chipstack package and manufacturing method thereof

Integrated circuit package component with ball conducting joints

Conformal shielding process using process gases

Voltage converter

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

Semiconductor device and method for manufacturing the same

Methods and systems for material bonding

Sacrificial material to facilitate thin die attach

Semiconductor structure and manufacturing method of semiconductor structure

Electronic device package and fabrication method thereof

Semiconductor chip with coil element over passivation layer

Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices

Manufacturing process and structure of through silicon via

Semiconductor packages having warpage compensation

Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device package having a buffer structure and method of fabricating the same

Integrated circuit system with stress redistribution layer and method of manufacture thereof

Wafer level integrated interconnect decal and manufacturing method thereof

Cu pillar bump with non-metal sidewall protection structure

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device

Method for facilitating the stacking of integrated circuits having different areas and an integrated circuit package constructed by the method

WAFER LEVEL PACKAGING WITH HEAT DISSIPATION

Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Semiconductor device package having a jumper chip and method of fabricating the same

Integrated circuit packaging system with interconnect and method of manufacture thereof

Integrated circuit packaging system with stacking option and method of manufacture thereof

Dual-leadframe multi-chip package and method of manufacture

Integrated circuit packages

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device

Semiconductor device and lead frame

Integrated circuit packaging system with encapsulation and method of manufacture thereof

Micro-fluidic injection molded solder (IMS)

Method of attaching die to circuit board with an intermediate interposer

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Apparatus for mounting semiconductor device

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure

Electronic circuit module component and method of manufacturing electronic circuit module component

Electronic assembly with detachable components

Optical cover plate with improved solder mask dam on glass for image sensor package and fabrication method thereof

MULTI-FUNCTION CARD DEVICE

Semiconductor wafer processing

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

Embedded die with protective interposer

Electronic device having interconnections, openings, and pads having greater width than the openings

Semiconductor package including a stacking element

Enhanced WLP for superior temp cycling, drop test and high current applications

Silicon substrate for package

Semiconductor package with stacked chips and method for manufacturing the same

Under-Bump Metallization Structure for Semiconductor Devices

Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Integrated circuit package system with package stacking and method of manufacture thereof

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Stacked dual chip package and method of fabrication

Multi-layer lead frame package and method of fabrication

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor chip with a rounded corner

Alignment structures for integrated-circuit packaging

Image sensor package and fabrication method thereof

Vertical MOSFET with through-body via for gate

Power MOS transistor device and switch apparatus comprising the same

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

Die stacking with an annular via having a recessed socket

Electronic component package and method for producing electronic component package

Conformal shielding employing segment buildup

Multi-chip module with multi-level interposer

Silicon nitride passivation layer for covering high aspect ratio features

Fabrication method for resin-encapsulated semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device and automotive ac generator

Pin-type chip tooling

Electronic assembly with detachable components

Distributed semiconductor device methods, apparatus, and systems

Electronic assembly with detachable components

Electronic assembly with detachable components

Method of sensing magnitude of current through semiconductor power device

Semiconductor device

Method of manufacturing electronic device and electronic device

Layered chip package with wiring on the side surfaces

Integrated circuit packaging system with via and method of manufacture thereof

Chip package and method for forming the same

Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Process for fabricating electronic components using liquid injection molding

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device

SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD THEREFOR

Semiconductor device and method of forming insulating layer around semiconductor die

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Semiconductor packaging and fabrication method using connecting plate for internal connection

Electronic circuit device

ELECTRODE PORTION STRUCTURE

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Ferroelectric component and manufacturing the same

Carrier system with multi-tier conductive posts and method of manufacture thereof

Gear structure

Method for metalizing blind vias

CONNECTING PAD PRODUCING METHOD

Method for singulating electronic components from a substrate

Semiconductor device

Method for fabricating circuit component

Multi-surface IC packaging structures

Through Silicon via Bridge Interconnect

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Bump-on-lead flip chip interconnection

MULTI-CHIP INTEGRATED CIRCUIT

Semiconductor package with embedded die and its methods of fabrication

Stacked semiconductor chips with separate encapsulations

Thin package system with external terminals and method of manufacture thereof

Semiconductor device capable of switching operation mode and operation mode setting method therefor

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

LED packaging with integrated optics and methods of manufacturing the same

Nanotube Materials for Thermal Management of Electronic Components

Manufacturing method of a bump structure having a reinforcement member

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

Rigid-backed, membrane-based chip tooling

Semiconductor device support for bonding

Assembled multi-component electronic apparatus using alignment and reference marks

CURRENT SENSOR FOR A SEMICONDUCTOR DEVICE AND SYSTEM

High Frequency Power Supply Module Having High Efficiency and High Current

Die bond film, dicing die bond film, and semiconductor device

Methods of forming a metal pattern and semiconductor device structure

Semiconductor device with hollow structure

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

Manufacturing method for semiconductor package

CHIP PACKAGE

Stackable electronic package and method of fabricating same

Thermal vias in an integrated circuit package with an embedded die

Semiconductor substrate, package and device

ULTRA THIN FLIP-CHIP BACKSIDE DEVICE SENSOR PACKAGE

Method for placing a component onto a target platform by an apparatus using a probe

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Method for manufacturing a semiconductor structure

Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

Integrated chip package structure using organic substrate and method of manufacturing the same

Electronic component

Wireless communication system

Circuit component with conductive layer structure

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Device including an encapsulated semiconductor chip and manufacturing method thereof

Wirebondless wafer level package with plated bumps and interconnects

System and Method for Improving Reliability of Integrated Circuit Packages

Chip structure

Semiconductor device and method of forming IPD in fan-out level chip scale package

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits

Method of manufacturing a semiconductor device

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

Printed wiring board and method for manufacturing same

Method for integrating an electronic component into a printed circuit board

Adaptive patterning for panelized packaging

Flip chip mounting method and bump forming method

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

Manufacturing method of semiconductor device

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Semiconductor package

METHOD FOR FABRICATION OF A SEMICONDUCTOR DEVICE AND STRUCTURE

PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors