212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
Semiconductor device and method of manufacturing semiconductor device
#302Package-on-package assembly with wire bonds to encapsulation surface
#303Electronic module
#304Antenna package structure and antenna packaging method
#305Metal-bump sidewall protection
#306Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
#307Antenna feeder package structure and packaging method
#308Semiconductor package with high routing density patch
#309Method of manufacturing package structure
#310Semiconductor device and a method of manufacturing the same
#311Semiconductor device and method to minimize stress on stack via
#312Semiconductor package with layer structures, antenna layer and electronic component
#313Die features for self-alignment during die bonding
#314Die-on-interposer assembly with dam structure and method of manufacturing the same
#315Semiconductor chip with reduced pitch conductive pillars
#316Electrically testable integrated circuit packaging
#317Electronic device
#318Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#319Multi-chip package and method of providing die-to-die interconnects in same
#320Bonded structure and bonding material
#321Semiconductor module
#322Aligned core balls for interconnect joint stability
#323Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#324Semiconductor device
#325Method for fabricating a semiconductor and semiconductor package
#326Solder material for semiconductor device
#327Method for the manufacture of integrated devices including a die fixed to a leadframe
#328Flip chip package utilizing trace bump trace interconnection
#329Apparatuses including redistribution layers and related microelectronic devices
#330SEMICONDUCTOR DEVICE
#331Semiconductor structure and manufacturing method thereof
#332Method for manufacturing semiconductor device and semiconductor device
#333Semiconductor device having through silicon vias and manufacturing method thereof
#334Semiconductor element mounting structure, and combination of semiconductor element and substrate
#335Embedded semiconductive chips in reconstituted wafers, and systems containing same
#336Semiconductor device
#337Semiconductor package
#338ASSEMBLY COMPRISING A VERTICAL POWER COMPONENT ASSEMBLED ON A METAL CONNECTION PLATE
#339Method of forming conductive bumps for cooling device connection and semiconductor device
#340Semiconductor device having electrode pads arranged between groups of external electrodes
#341Semiconductor element
#342ELECTRONIC CONTROL DEVICE
#343Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#344Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#345PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#346Semiconductor device and a method of manufacturing the same
#347Semiconductor structure and manufacturing method thereof
#348Fingerprint sensor and manufacturing method thereof
#349Solar cell module including solar cells
#350Creating 3D features through selective laser annealing and/or laser ablation
#351METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#352Semiconductor device and a method of manufacturing the same
#353Solder material and method for die attachment
#354Semiconductor device
#355Semiconductor package structure for improving die warpage and manufacturing method thereof
#356SEMICONDUCTOR DEVICE CONNECTIONS WITH SINTERED NANOPARTICLES
#357Semiconductor device
#358Packaging method and package structure of fan-out chip
#359Semiconductor device package including embedded conductive elements
#360Package-on-package assembly with wire bonds to encapsulation surface
#361INTEGRATED CIRCUIT CHIP PACKAGING
#362INTEGRATED CIRCUIT CHIP PACKAGING
#363Lead-free solder joining of electronic structures
#364Structures and methods for low temperature bonding using nanoparticles
#365Package on package structure and method for forming the same
#366Solder ball, solder joint, and joining method
#367Semiconductor device
#368OPTICAL MODULE, OPTICAL COMMUNICATION DEVICE, AND MANUFACTURING METHOD THEREOF
#369Metal-bump sidewall protection
#370Semiconductor package with leadframe interconnection structure
#371Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#372Semiconductor device package and method for manufacturing the same
#373Semiconductor device including a solder compound containing a compound Sn/Sb
#374Methods of forming connector pad structures, interconnect structures, and structures thereof
#375Circuit system having compact decoupling structure
#376Semiconductor device manufacturing method
#377Bonded structures for package and substrate
#378Semiconductor device
#379Semiconductor device having chip stacked and molded
#380Liquid metal TIM with STIM-like performance with no BSM and BGA compatible
#381High reliability lead-free solder alloys for harsh environment electronics applications
#382Method for manufacturing semiconductor device
#383Method of Manufacturing a Multi-Chip Semiconductor Power Device
#384Semiconductor device with improved thermal dissipation and manufacturing methods
#385Die features for self-alignment during die bonding
#386Impedance controlled electrical interconnection employing meta-materials
#387Electronic device with multi-layer contact and system
#388Serializer-deserializer die for high speed signal interconnect
#389Multi-chip package and method of providing die-to-die interconnects in same
#390Method of manufacturing package structure
#391PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#392Non-planar semiconductor device having conforming ohmic contacts
#393Contact pad for semiconductor device
#394Shielded fan-out packaged semiconductor device and method of manufacturing
#395Die-on-interposer assembly with dam structure and method of manufacturing the same
#396Method for producing an optoelectronic component, and optoelectronic component
#397Package structure with improvement layer and fabrication method thereof
#398Packaging structure and forming method thereof
#399Packaging structure and forming method thereof
#400Substrate with embedded stacked through-silicon via die
#401Method for fabricating a semiconductor and semiconductor package
#402Semiconductor device and method for manufacturing the semiconductor device
#403Substrate pad structure
#404Integrated circuit packages and methods of forming same
#405Four D device process and structure
#406Structure and method for cooling three-dimensional integrated circuits
#407RF devices with enhanced performance and methods of forming the same
#408Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
#409Method for producing an electric circuit comprising a circuit carrier, contact areas, and an insulating body
#410Semiconductor device having a solder blocking metal layer
#411BGA STIM package architecture for high performance systems
#412Semiconductor device and method for manufacturing semiconductor device
#413Semiconductor structure and method for wafer scale chip package
#414Laser assisted solder bonding of direct conversion compound semiconductor detector
#415Tin or tin alloy electroplating bath, and electronic component having electrodeposit formed thereon using the plating bath
#416SEMICONDUCTOR-MOUNTED PRODUCT
#417Method of manufacturing semiconductor device
#418Hollow metal pillar packaging scheme
#419Flip chip integrated circuit packages with spacers
#420Multilayer pillar for reduced stress interconnect and method of making same
#421Multilayer pillar for reduced stress interconnect and method of making same
#422Mechanisms for forming post-passivation interconnect structure
#423Stacked semiconductor packages
#424Semiconductor device and method for manufacturing the same
#425Silicon carbide devices and methods for manufacturing the same
#426Flip chip package utilizing trace bump trace interconnection
#427RIBBON WIRE BOND
#428Antenna feeder package structure and packaging method
#429Antenna package structure and antenna packaging method
#430Antenna package structure and antenna packaging method
#431Packaging structure and packaging method for antenna
#432Grid array connection device and method
#433SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#434Method for forming a 3D IC architecture including forming a first die on a first side of a first interconnect structure and a second die in an opening formed in a second side
#435Info structure with copper pillar having reversed profile
#436Method for manufacturing semiconductor device
#437Micro device transferring method, and micro device substrate manufactured by micro device transferring method
#438Micro-LED module and method for fabricating the same
#439Packaged semiconductor components having substantially rigid support members
#440SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#441Methods and apparatus for transmission lines in packages
#442Methods of forming connector pad structures, interconnect structures, and structures thereof
#443Package structure and manufacturing method thereof
#444Interconnect structures with intermetallic palladium joints and associated systems and methods
#445SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#446Cooling bond layer and power electronics assemblies incorporating the same
#447ELECTRONIC DEVICE PACKAGE
#448Bond pads with surrounding fill lines
#449Light emitting apparatus, illumination apparatus and display apparatus
#450Semiconductor device and method of manufacturing the same
#451Semiconductor device and method for manufacturing the same
#452Method of forming a semiconductor device having through silicon vias
#453SEMICONDUCTOR PACKAGE
#454SUBSTRATE ASSEMBLY WITH SPACER ELEMENT
#455Methods for bump planarity control
#456Method of manufacturing a semiconductor device
#457Designs and methods for conductive bumps
#458CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
#459Solder material
#460Fabrication of high-temperature superconducting striated tape combinations
#461Component joining apparatus, component joining method and mounted structure
#462Dual solder methodologies for ultrahigh density first level interconnections
#463Precise Alignment and Decal Bonding of a Pattern of Solder Preforms to a Surface
#464Semiconductor device
#465Semiconductor device structures for burn-in testing and methods thereof
#466Advanced solder alloys for electronic interconnects
#467Semiconductor device having high yield strength intermediate plate
#468Multilayer pillar for reduced stress interconnect and method of making same
#469Sintered solder for fine pitch first-level interconnect (FLI) applications
#470Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#471Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
#472Component and method of manufacturing a component using an ultrathin carrier
#4733D IC method and device
#474Multi-chip package and method of formation
#475Package structure and method of manufacturing the same
#476Bump bonded cryogenic chip carrier
#477Method for 3D ink jet TCB interconnect control
#478Package on package structure and method for forming the same
#479Semiconductor package
#480Semiconductor device
#481Bump on pad (BOP) bonding structure in semiconductor packaged device
#482Semiconductor die contact structure and method
#483Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#484ROOM TEMPERATURE METAL DIRECT BONDING
#485Shaped interconnect bumps in semiconductor devices
#486Pre-molded leadframes in semiconductor devices
#487Apparatus and methods for through substrate via test
#488Semiconductor die assemblies with heat sink and associated systems and methods
#489Leadframes in semiconductor devices
#490Polymer lid wafer-level package with an electrically and thermally conductive pillar
#491Bump bonded cryogenic chip carrier
#492Package with UBM and methods of forming
#493Substrate-less stackable package with wire-bond interconnect
#494Semiconductor device and method
#495Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package
#4963DIC packaging with hot spot thermal management features
#497Electrically testable integrated circuit packaging
#498"Lead-Free Solder Ball"
#499Multichip modules and methods of fabrication
#500Methods of manufacturing a multi-device package
#501Semiconductor module
#502Semiconductor device and a method of manufacturing the same
#503SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#504Flux, solder paste, and method for forming solder bump
#505Member for semiconductor device
#506Electronic component
#507Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#508Wireless IC device
#509Radar module with wafer level package and underfill
#510Die-on-interposer assembly with dam structure and method of manufacturing the same
#511Semiconductor device structures for burn-in testing and methods thereof
#512MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#513Semiconductor module with temperature detecting element
#514Semiconductor package structure and manufacturing method thereof
#515Solder metallization stack and methods of formation thereof
#516Semiconductor package
#517Semiconductor device having electrode pads arranged between groups of external electrodes
#518Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#519Semiconductor package with high routing density patch
#520Semiconductor device and method of forming WLCSP
#521Qubit die attachment using preforms
#522ELECTRONIC CIRCUIT PACKAGE USING COMPOSITE MAGNETIC SEALING MATERIAL
#523Shielded fan-out packaged semiconductor device and method of manufacturing
#524Vertical interconnects for self shielded system in package (SiP) modules
#525Wire bond wires for interference shielding
#526Semiconductor device
#527Substrate conductor structure and method
#528Methods of fluxless micro-piercing of solder balls, and resulting devices
#529Method for assembling a carrier with components, pigment for assembling a carrier with a component and method for producing a pigment
#530DIE BONDING TO A BOARD
#531Tall and fine pitch interconnects
#532Conductive ball having a tin-based solder covering an outer surface of the copper ball
#533Conductive ball and electronic device
#534Electronic component device
#535Semiconductor device and manufacturing method thereof
#536Lead-free solder joining of electronic structures
#537Method for producing electronic device with multi-layer contact
#538Package method and package structure of fan-out chip
#539Semiconductor chip
#540Process for fabricating a circuit substrate
#541Platform with thermally stable wireless interconnects
#542Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#5433D semiconductor device and structure
#544Multi-chip structure and method of forming same
#545Electronic module
#546Chip on package structure and method
#547System and method for an improved interconnect structure
#548Integrated fan-out packages and methods of forming the same
#549Semiconductor device having upper and lower redistribution layers
#550Semiconductor package including bump
#551High temperature solder paste
#552Packaged microelectronic devices having stacked interconnect elements and methods for manufacturing the same
#553Semiconductor device
#554Multi-device packages and related microelectronic devices
#555Electronic packaging structure
#556Electronic package that includes multiple supports
#557Silicon Interposer Sndwich Structure for ESD, EMI, and EMC Shielding and Protection
#558Package-on-package assembly with wire bonds to encapsulation surface
#559Packaging device and method of making the same
#560Semiconductor package and manufacturing method thereof
#561SYSTEM IN PACKAGE PROCESS FLOW
#562METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED
#563VIA AND TRENCH FILLING USING INJECTION MOLDED SOLDERING
#564Package structures and methods for forming the same
#565Method of fabricating a semiconductor package
#566Method of fabricating low-profile footed power package
#567Method of making fully molded peripheral package on package device
#568Method for producing soldered product
#569Solder alloy and bonded structure using the same
#570Light-emitting diode (LED) display array, manufacturing method thereof, and wearable device
#571Semiconductor device and semiconductor device manufacturing method
#572SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#573Semiconductor packages and devices
#5743D integration method using SOI substrates and structures produced thereby
#575Manufacturing method of semiconductor structure
#576ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#577Power semiconductor device and power conversion device
#578Multiple bond via arrays of different wire heights on a same substrate
#579Semiconductor device
#580Implantable electrode array assembly including a carrier with packaged control modules
#581Semiconductor device package and method for manufacturing the same
#582Solder joining
#583Circuit boards and semiconductor packages including the same
#584Semiconductor device and method for manufacturing the same
#585Through-hole electrode substrate
#586Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader
#587Method of embedding WLCSP components in E-WLB and E-PLB
#588VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#589Contoured package-on-package joint
#590MICRO- OR NANO-WIRE LED LIGHT SOURCE COMPRISING TEMPERATURE MEASUREMENT MEANS
#591Semiconductor device and method of forming WLCSP
#592Copper pillar bump structure and manufacturing method therefor
#593Package with different types of semiconductor dies attached to a flange
#594Semiconductor substrate and semiconductor packaging device, and method for forming the same
#595Semiconductor device and method of packaging
#596Microelectronic elements with post-assembly planarization
#597Grid array connection device and method
#598Stackable electronic package and method of fabricating same
#599Semiconductor packages and methods of packaging semiconductor devices
#600Mounting Method of a semiconductor device using a colored auxiliary joining agent