212136 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Alloys Solder alloys
HYBRID LOW METAL LOADING FLUX
#602Micro-LED module and method for fabricating the same
#603ELECTRONIC PACKAGING STRUCTURE
#604Semiconductor package
#605Paste thermosetting resin composition, semiconductor component, semiconductor mounted article, method for manufacturing semiconductor component, and method for manufacturing semiconductor mounted article
#606Semiconductor device and method for manufacturing the same
#607Substrate-less stackable package with wire-bond interconnect
#608RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#609FLIP-CHIP MOUNTING OF SILICON-ON-INSULATOR DIE
#610Thin Film Solder Bond
#611Semiconductor module
#612Structures and methods for low temperature bonding using nanoparticles
#613METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
#614Methods of forming integrated circuit structure for joining wafers and resulting structure
#615Methods of forming connector pad structures, interconnect structures, and structures thereof
#616Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components
#617Semiconductor package structure for improving die warpage and manufacturing method thereof
#618Integrated circuit package having wirebonded multi-die stack
#619Power semiconductor device
#620Semiconductor device and its manufacturing method
#621Interconnect structures with intermetallic palladium joints and associated systems and methods
#622Sintered solder for fine pitch first-level interconnect (FLI) applications
#623Semiconductor device and a method of manufacturing the same
#624Core material, semiconductor package, and forming method of bump electrode
#625Method for forming bump of semiconductor package
#626Semiconductor device, method of positioning semiconductor device, and positioning apparatus for semiconductor device
#627Info structure with copper pillar having reversed profile
#628Semiconductor light-emitting device
#629Mount structure including two members that are bonded to each other with a bonding material layer having a first interface layer and a second interface layer
#630Wiring substrate and semiconductor device
#631Method of forming conductive bumps for cooling device connection
#632Semiconductor light emitting device including cap structure and method of making same
#633Solder particle
#634Packaged semiconductor assemblies and methods for manufacturing such assemblies
#635Chip package
#636Package-on-package with cavity in interposer
#637Solder in cavity interconnection structures
#638Packaging structures of integrated circuits
#639Multi-chip package and method of providing die-to-die interconnects in same
#640Manufacturing method of semiconductor device
#641FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE
#642Integrated circuit package substrate
#643Package with interconnections having different melting temperatures
#644Thermocompression Bonding with Passivated Nickel-Based Contacting Metal
#645Thermocompression Bonding with Passivated Silver-Based Contacting Metal
#646Thermocompression Bonding with Passivated Gold Contacting Metal
#647Thermocompression Bonding with Passivated Copper-Based Contacting Metal
#648Thermocompression Bonding with Passivated Indium-Based Contacting Metal
#649Thermocompression Bonding Using Metastable Gas Atoms
#650System for Low-Force Thermocompression Bonding
#6513D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#652Cascode semiconductor package and related methods
#653Light emitting device and method for manufacturing light emitting device
#654Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera
#655Semiconductor device package and method for forming the same
#656Semiconductor device and method for manufacturing the same
#657METHOD OF DETERMINING CURING CONDITIONS, METHOD OF PRODUCING CIRCUIT DEVICE, AND CIRCUIT DEVICE
#658Electronic circuit package using composite magnetic sealing material
#659Fully molded miniaturized semiconductor module
#660Fan-out ball grid array package structure and process for manufacturing the same
#661Semiconductor device and method of forming interposer with opening to contain semiconductor die
#662Light emitting diode with pads on side surface thereof, light emitting device and display device including the light emitting diode
#663Advanced Solder Alloys For Electronic Interconnects
#664Conductive paste for bonding
#665Tall and fine pitch interconnects
#666Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
#667Lead and lead frame for power package
#6683D IC bump height metrology APC
#669SEMICONDUCTOR DEVICE HAVING LOW ON RESISTANCE
#670Selective area heating for 3D chip stack
#671Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#672Method of joining a surface-mount component to a substrate with solder that has been temporarily secured
#673Semiconductor device
#674Info structure with copper pillar having reversed profile
#675Chip mounting structure
#676Semiconductor device and method of manufacturing semiconductor device
#677Packaging for high power integrated circuits and infrared emitter arrays
#678Fan-out semiconductor package
#679Semiconductor device and method of manufacturing the same
#680Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
#681Wire bond wires for interference shielding
#682Method of fabricating a chip module with stiffening frame and orthogonal heat spreader
#683Chip module with stiffening frame and orthogonal heat spreader
#684Engineered polymer-based electronic materials
#685Bump structure having a side recess and semiconductor structure including the same
#686LAND GRID BASED MULTI SIZE PAD PACKAGE
#687Tool and method of reflow
#688Semiconductor packaging structure and method
#689BUMPLESS BUILD-UP LAYER PACKAGE WITH A PRE-STACKED MICROELECTRONIC DEVICES
#690LPS solder paste based low cost fine pitch pop interconnect solutions
#691Elongated bump structures in package structure
#692ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION
#693Method of manufacturing a semiconductor device
#694Hollow metal pillar packaging scheme
#695Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#696Semiconductor device
#697Solder material for semiconductor device
#698METHOD FOR FORMING BUMP STRUCTURE
#699Tooling for coupling multiple electronic chips
#700Embedded semiconductive chips in reconstituted wafers, and systems containing same
#701Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#702Semiconductor device
#703FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#704Surface finishes for interconnection pads in microelectronic structures
#705Conductive connections, structures with such connections, and methods of manufacture
#706Thermal transfer structures for semiconductor die assemblies
#707SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
#708Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates
#709Via and trench filling using injection molded soldering
#710Semiconductor device
#711Enhanced cleaning for water-soluble flux soldering
#712Lead-Free Solder Ball
#713Via and trench filling using injection molded soldering
#714Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#715Via and trench filling using injection molded soldering
#716PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#717Mounting structure and method for manufacturing same
#718Semiconductor device with first and second chips and connections thereof and a manufacturing method of the same
#719TIN-INDIUM BASED LOW TEMPERATURE SOLDER ALLOY
#720Wiring substrate and semiconductor device
#721Method of manufacturing semiconductor device
#722Semiconductor device fabricated by flux-free soldering
#723Structure and method for cooling three-dimensional integrated circuits
#724Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
#725Removal apparatuses for semiconductor chips
#726Collars for under-bump metal structures and associated systems and methods
#727Power module
#728Conductive particle, and connection material, connection structure, and connecting method of circuit member
#729Bump on pad (BOP) bonding structure in semiconductor packaged device
#730Connection structure and connecting method of circuit member
#731Substrate pad structure
#732Electronic device having a liquid crystal polymer solder mask and related devices
#733Copper structures with intermetallic coating for integrated circuit chips
#734Connecting method of circuit member
#735OPTOELECTRONIC SYSTEM
#736Integrated circuit assembly that includes stacked dice
#737Semiconductor die assemblies with heat sink and associated systems and methods
#738Method for forming solder deposits
#739Solder bump for ball grid array
#740Stacked semiconductor devices
#7413D IC method and device
#742Chip on package structure and method
#743Electronic component
#744Semiconductor device having an inductor
#745Thermocompression for semiconductor chip assembly
#746Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#747Fan-out semiconductor package
#748Contact pad for semiconductor device
#749Semiconductor package assembly
#750Package on package structure and method for forming the same
#751Method of manufacturing semiconductor device
#752Package-on-package assembly with wire bonds to encapsulation surface
#753Integrated system and method of making the integrated system
#754Package process and package structure
#755High temperature solder paste
#756Semiconductor device
#757Hollow metal pillar packaging scheme
#758Dual lead frame semiconductor package and method of manufacture
#759Semiconductor device and semiconductor device mounting structure having conductor plates
#760Bonded structures for package and substrate
#761Interconnect structure and method of forming same
#762SEMICONDUCTOR PACKAGING STRUCTURE
#763Semiconductor device and a method of manufacturing the same
#764Interconnection structure with confinement layer
#765Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#766Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom
#767Wiring board and semiconductor device
#768Semiconductor device having electrode pads arranged between groups of external electrodes
#769Wiring board, and semiconductor device
#770Microelectronic elements with post-assembly planarization
#771Solder paste
#772Solder material, solder joint, and method of manufacturing the solder material
#773Semiconductor package having multi-phase power inverter with internal temperature sensor
#774Enhanced cleaning for water-soluble flux soldering
#775Integrated circuit chip packaging
#776Integrated circuit chip packaging including a heat sink topped cavity
#777Fingerprint sensor and manufacturing method thereof
#778Light emitting apparatus, illumination apparatus and display apparatus
#779Multichip modules and methods of fabrication
#780Inter-chip alignment
#781Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
#782Microelectronic substrate having embedded trace layers with integral attachment structures
#783Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device
#784Electronic device and electronic apparatus
#785ELECTRONIC COMPONENT
#786Mechanisms for forming post-passivation interconnect structure
#787Method and materials for warpage thermal and interconnect solutions
#788Test probe substrate
#789Electrical connecting structure between a substrate and a semiconductor chip
#790Electronic device, electronic device fabrication method, and electronic apparatus
#791System and method for an improved interconnect structure
#792Semiconductor packaging structure and method
#793Self-aligned under bump metal
#794SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
#795Multilayer pillar for reduced stress interconnect and method of making same
#796Three dimensional device integration method and integrated device
#797Semiconductor light-emitting device, method for producing same, and display device
#798SOLDER COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#799Semiconductor devices and methods of manufacture thereof
#800Semiconductor device with less positional deviation between aperture and solder
#801Semiconductor device and method for manufacturing semiconductor device
#802Semiconductor device having polyimide layer
#803Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#804Method of manufacturing semiconductor device
#805Metal bump joint structure
#806Semiconductor chip mounted on a packaging substrate
#807Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
#808Post-passivation interconnect structure and method of forming same
#809Semiconductor device package, electronic device and method of manufacturing electronic devices using wafer level chip scale package technology
#810Bump structure for yield improvement
#811Multilayer pillar for reduced stress interconnect and method of making same
#812Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
#813Forming a solder joint between metal layers
#814Gallium arsenide devices with copper backside for direct die solder attach
#815Methods of forming semiconductor packages including molding semiconductor chips of the semiconductor packages
#816CHIP PACKAGE AND METHOD FOR MANUFACTURING SAME
#817Semiconductor die contact structure and method
#818Surface finishes for interconnection pads in microelectronic structures
#819Leadframe package with pre-applied filler material
#820Electronic component, electronic apparatus, and method of manufacturing electronic apparatus
#821Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#822Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#823Semiconductor device and a method of manufacturing the same
#824Semiconductor device and production method therefor
#825PREFORM STRUCTURE FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT, A METHOD FOR FORMING A PREFORM STRUCTURE FOR A SEMICONDUCTOR CHIP ARRANGEMENT, AND A METHOD FOR SOLDERING A SEMICONDUCTOR CHIP ARRANGEMENT
#826Designs and methods for conductive bumps
#827Cu pillar bump with L-shaped non-metal sidewall protection structure
#828Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package
#829SUBSTRATE, CHIP PACKAGE WITH SAME AND METHOD FOR MANUFACTURING SAME
#830Use of electrical power multiplication for power smoothing in power distribution
#831Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#832Semiconductor package interconnect
#833Collars for under-bump metal structures and associated systems and methods
#834Circuit board structure and method for manufacturing a circuit board structure
#8353D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#836Radio frequency integrated circuit module
#837Electronic apparatus and method for fabricating the same
#838Multi-step processes for high temperature bonding and bonded substrates formed therefrom
#839Semiconductor device
#840High quality electrical contacts between integrated circuit chips
#841METHOD, A SEMICONDUCTOR DEVICE AND A LAYER ARRANGEMENT
#842Structures and methods for low temperature bonding using nanoparticles
#843Method for manufacturing thermal interface sheet
#844Power module substrate, heat-sink-attached power-module substrate, and heat-sink-attached power module
#845Semiconductor device having through silicon vias and manufacturing method thereof
#846Semiconductor devices and methods of forming thereof
#847Packaging devices and methods of manufacture thereof
#848Resin-encapsulated semiconductor device and its manufacturing method
#849Semiconductor device and method for manufacturing the same
#850Semiconductor device
#851Semiconductor device with trench-like feed-throughs
#852Electronic Device with Multi-Layer Contact
#853Semiconductor module, bonding jig, and manufacturing method of semiconductor module
#854Semiconductor device manufacturing method
#855Pre-package and methods of manufacturing semiconductor package and electronic device using the same
#856Masking methods for ALD processes for electrode-based devices
#857Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#858Semiconductor device
#859Robust multi-layer wiring elements and assemblies with embedded microelectronic elements
#860Structures and methods for low temperature bonding using nanoparticles
#861Solder bump stretching method for forming a solder bump joint in a device
#862Electronic apparatus and method for fabricating the same
#863Optoelectronic component and method of producing an optoelectronic component
#864Semiconductor device including Schottky barrier diode and power MOSFETs and a manufacturing method of the same
#865Wafer backside interconnect structure connected to TSVs
#866Bump-on-trace structures with high assembly yield
#867Chip mounting structure
#868Semiconductor integrated circuit device
#869Magnetic intermetallic compound interconnect
#870Apparatus, system, and method for wireless connection in integrated circuit packages
#871Method of flip-chip assembly of two electronic components by UV annealing, and assembly obtained
#872Concentric bump design for the alignment in die stacking
#873Semiconductor devices with ball strength improvement
#874Methods of manufacturing printed circuit board and semiconductor package
#875Lead-free solder alloy, solder material and joined structure
#876Semiconductor chip with redundant thru-silicon-vias
#877Grid array connection device and method
#878Semiconductor device
#879Apparatus for stacked semiconductor packages and methods of fabricating the same
#880Semiconductor device and method for manufacturing the same
#881Semiconductor package and method of manufacturing thereof
#882Methods of manufacturing a multi-device package
#883Electronic part embedded substrate and method of producing an electronic part embedded substrate
#884Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#885Copper-ceramic bonded body and power module substrate
#886FLUX AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#887Solder material and connected structure
#888Semiconductor device
#889Bonding material, bonding method and semiconductor device for electric power
#890Copper structures with intermetallic coating for integrated circuit chips
#891Solder metallization stack and methods of formation thereof
#892Semiconductor device
#893Semiconductor device and manufacturing method of semiconductor device
#894High efficiency module
#895Semiconductor packaging structure and method
#896Mechanisms of forming connectors for package on package
#897Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#898Lead-free solder ball
#899Semiconductor device
#900Semiconductor substrate and semiconductor package structure having the same