Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Method of manufacturing a chip stack package

Connecting film, and joined structure and method for producing the same

Power semiconductor module including substrates spaced from each other

Antennas using chip-package interconnections for millimeter-wave wireless communication

Techniques for packaging multiple device components

Semiconductor device

Structure and method of forming a pad structure having enhanced reliability

Bump pad structure

In-situ cavity integrated circuit package

Die Exposed Chip Package

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

Semiconductor Device Package Having Chip With Conductive Layer

QFN semiconductor package

QFN semiconductor package

Semiconductor device driving bridge-connected power transistor

Massively parallel interconnect fabric for complex semiconductor devices

Optoelectronic system

Package with multiple dies

Fabrication method of semiconductor integrated circuit device

Separate probe and bond regions of an integrated circuit

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Injection molded soldering process and arrangement for three-dimensional structures

Semiconductor component with terminal contact surface

Plastic package and method of fabricating the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method to manufacture thereof

Semiconductor module

Semiconductor device

Reworkable electronic device assembly and method

System and method for multi-chip module die extraction and replacement

Wafer backside structures having copper pillars

DEVICE AND DEVICE MANUFACTURE METHOD

LOW THERMAL RESISTANCE AND ROBUST CHIP-SCALE-PACKAGE (CSP), STRUCTURE AND METHOD

Method of forming an interconnect joint

Semiconductor package including power ball matrix and power ring having improved power integrity

Barrier layer for fine-pitch mask-based substrate bumping

Method of interconnecting electronic wafers

Method of making electronic device

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

SEMICONDUCTOR DEVICE

Semiconductor packages and electronic systems including the same

Multi-chip stacked package

Die bonding utilizing a patterned adhesion layer

Microelectronic packages fabricated at the wafer level and methods therefor

Adaptive interconnect structure

High quality electrical contacts between integrated circuit chips

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor device and method of manufacturing semiconductor device

Power lead-on-chip ball grid array package

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

LIQUID ELECTRICAL INTERCONNECT AND DEVICES USING SAME

Apparatus and method for arranging magnetic solder balls

Component mounting apparatus, component mounting head, and component mounting method

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Semiconductor die packages using thin dies and metal substrates

METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD

Multi-chip packages providing reduced signal skew and related methods of operation

Receive circuit for connectors with variable complex impedance

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Semiconductor device and manufacturing method thereof

Methods of fluxless micro-piercing of solder balls, and resulting devices

IC package reducing wiring layers on substrate and its carrier

Semiconductor chip package

Electronic device package

Semiconductor element for package miniaturization

Integrated circuit package system with leaded package and method for manufacturing thereof

Panel, semiconductor device and method for the production thereof

Semiconductor component having through wire interconnect (TWI) with compressed wire

Method of forming an inductor on a semiconductor wafer

Semiconductor integrated circuit device and method of manufacturing same

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Manufacture method for semiconductor device with bristled conductive nanotubes

Manufacturing method of semiconductor device with surface mounting terminals

THERMOSETTING DIE BONDING FILM

Remote chip attachment

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electrode structure and its manufacturing method, and semiconductor module

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor device and method for manufacturing the same

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Stacked semiconductor package

Semiconductor package and manufacturing method thereof

Supporting substrate before cutting, semiconductor device, and method of forming semiconductor device

Semiconductor device and method of forming the same

Staircase shaped stacked semiconductor package

Semiconductor die package and method for making the same

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Semiconductor device having elastic solder bump to prevent disconnection

Semiconductor Manufacturing Method

Method of fabricating a two-sided die in a four-sided leadframe based package

PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS

Fabrication method of multi-chip stack structure

Electronic board, method of manufacturing the same, and electronic device

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

Three-dimensional semiconductor architecture

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

Semiconductor device with pads overlapping wiring layers including dummy wiring

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Joining method and device produced by this method and joining unit

CARBON NANOTUBE CONTACT STRUCTURES FOR USE WITH SEMICONDUCTOR DIES AND OTHER ELECTRONIC DEVICES

Assembly and production of an assembly

METHOD FOR MANUFACTURING SEMICONDUCTOR MODULES

Method of manufacturing a semiconductor device by lamination

Method of handling a thin wafer

Method of making chip-on-lead package

Chip-size-package semiconductor chip and manufacturing method

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Electronic apparatus produced using lead-free bonding material for soldering

Method for ultra thin wafer handling and processing

Method of joining electronic component and the electronic component

Integrated circuit package system with multiple device units and method for manufacturing thereof

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Apparatus, system, and method for wireless connection in integrated circuit packages

Interconnect structure for a semiconductor device

METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER

Chip packages

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Stackable electronic package and method of making same

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device

Semiconductor device with hollow and throughhole and method of manufacturing same

Chip stack package and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor packages and electronic systems including the same

Stackable electronics package and method of fabricating same

Stackable electronic package

Integrated circuit packaging system with package stacking and method of manufacture thereof

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Wafer level packaging using flip chip mounting

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Film-like adhesive, adhesive sheet, and semiconductor device using same

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Power module

Applications of smart polymer composites to integrated circuit packaging

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Semiconductor package with reduced internal stress

Structure and method for sealing cavity of micro-electro-mechanical device

Semiconductor device and wire bonding method

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Making a semiconductor device having conductive through organic vias

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET

Method for manufacturing semiconductor apparatus

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices

FLMP buck converter with a molded capacitor and a method of the same

Microelectronic assembly with impedance controlled wirebond and reference wirebond

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device having a conductive bump

Flip chip semiconductor package and fabrication method thereof

Wire loop and method of forming the wire loop

Reducing stress between a substrate and a projecting electrode on the substrate

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

Semiconductor Carrier for Multi-Chip Packaging

Electrical interconnect forming method

Electrical interconnect forming method

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

BONDING METHOD AND BONDING DEVICE

Conductive ball mounting apparatus and conductive ball mounting method

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Electrical interconnect structure

Peeling sheet with adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloyloxyethyl) hydrogen phosphate

Printed circuit board and method of manufacturing printed circuit board

Integrated circuit for driving semiconductor device and power converter

Integrated circuit packaging system with stacked die and method of manufacture thereof

Chips having rear contacts connected by through vias to front contacts

Three-dimensional system-in-package architecture

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Stress buffering package for a semiconductor component

Mounted body and method for manufacturing the same

Chip-scale packaging with protective heat spreader

Lead and lead frame for power package

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

THROUGH-SILICON VIA STRUCTURE AND METHOD FOR MAKING THE SAME

Semiconductor device having a junction FET and a MISFET for control

FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING

Micro-fluidic injection molded solder (IMS)

Method to build robust mechanical structures on substrate surfaces

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Method of manufacturing ball grid array type semiconductor device

Multi-surface IC packaging structures and methods for their manufacture

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Electronic substrate, semiconductor device, and electronic device

METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT

Electromigration-Resistant Flip-Chip Solder Joints

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS

WINDOW TYPE SEMICONDUCTOR PACKAGE

Complete power management system implemented in a single surface mount package

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Chip capacitive coupling

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

Ribbon bonding in an electronic package

Electronics module comprising an embedded microcircuit

Module having a stacked magnetic device and semiconductor device and method of forming the same

Semiconductor device

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor device having wiring layers with power-supply plane and ground plane

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

Solder bump UBM structure

Integrated circuit micro-module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Stack package

Semiconductor package and manufacturing method thereof and encapsulating method thereof

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Systems and methods of tamper proof packaging of a semiconductor device

Electronic device

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Method of manufacturing semiconductor device

Formation of solder bumps

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Method of mounting LED chip

Method for contacting electronic components by means of a substrate plate

Semiconductor component having a stack of semiconductor chips and method for producing the same

Semiconductor device including conductive element

SEMICONDUCTOR DEVICE

Semiconductor module, method for manufacturing semiconductor module, and portable device

CHIP PACKAGE STRUCTURE

Semiconductor device

Package-on-package system with through vias and method of manufacture thereof

Chip attach adhesive to facilitate embedded chip build up and related systems and methods

Manufacturing method of semiconductor device

Semiconductor apparatus with decoupling capacitor

Electronic Device and Method of Manufacturing Same

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)

Bump Structure With Multiple Layers And Method Of Manufacture

Method of refining solder materials

Semiconductor device and method of manufacturing semiconductor device

Multi-component integrated circuit contacts

Semiconductor package and method for manufacturing the same for decreasing number of processes

Semiconductor package formed within an encapsulation

Method of manufacturing semiconductor device, and wire bonder

Method for fabricating semiconductor packages with discrete components

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Gap capacitors for monitoring stress in solder balls in flip chip technology

Electric module having a conductive pattern layer

III-nitride devices and circuits

Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips

Lock and key through-via method for wafer level 3D integration and structures produced

Grain refinement by precipitate formation in PB-free alloys of tin

Semiconductor device and a method of manufacturing the same

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Layered chip package with wiring on the side surfaces

Semiconductor device and semiconductor memory device

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

THRU SILICON ENABLED DIE STACKING SCHEME

Electronic-component-housing package and electronic device

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Coaxial through chip connection

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Method of making semiconductor device packaged by sealing resin member

Power semiconductor devices having integrated inductor

Electronic member, electronic part and manufacturing method therefor

Semiconductor wafer coated with a filled, spin-coatable material

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Flip chip interconnection having narrow interconnection sites on the substrate

Semiconductor module having semiconductor device mounted on device mounting substrate

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor flip-chip system having oblong connectors and reduced trace pitches

SEMICONDUCTOR MODULE