H01L2924/05341 - CPC Classification Index

ClassID:

212258 ⎘

H01L2924/05341 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 4th Group TiO

Recent Application in this class:

20250323228

2025-10-16

STACKED HIGH-POWER RF SWITCH

20250253287

2025-08-07

LOW TEMPERATURE SUBSTRATE BONDING METHOD

20250226359

2025-07-10

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME

20240321792

2024-09-26

SEMICONDUCTOR PACKAGE

20240194632

2024-06-13

WIRE COATING APPARATUS

20240038723

2024-02-01

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

20240006359

2024-01-04

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

20230412941

2023-12-21

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAGE SENSOR

20230260956

2023-08-17

SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CONNECTION STRUCTURES AND METHOD OF FABRICATING THE SAME

#10

20230230892

2023-07-20

CHIP-SCALE PACKAGE

#11

20230062835

2023-03-02

Semiconductor device

#12

20230051810

2023-02-16

Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device

#13

20220367771

2022-11-17

Display device using micro LED, and manufacturing method therefor

#14

20210377471

2021-12-02

Apparatus for wavelength conversion using layers of different photoelectric conversion materials for detecting visible and infared light simultaneously

#15

20210202417

2021-07-01

Microelectronic devices and apparatuses having a patterned surface structure

#16

20200303202

2020-09-24

Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby

#17

20200244904

2020-07-30

Image sensor, image capturing system, and production method of image sensor

#18

20190304796

2019-10-03

Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby

#19

20190273058

2019-09-05

Methods of forming microelectronic devices having a patterned surface structure

#20

20190244919

2019-08-08

Semiconductor Devices and Methods of Manufacture Thereof

#21

20180367746

2018-12-20

Image sensor, image capturing system, and production method of image sensor

#22

20180247906

2018-08-30

Methods of forming microelectronic structures having a patterned surface structure

#23

20180013260

2018-01-11

Bonding interface layer

#24

20170287867

2017-10-05

Anisotropic conductive film including a reflective layer

#25

20170221843

2017-08-03

Semiconductor devices and methods of manufacture thereof

#26

20170162531

2017-06-08

Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same

#27

20170004994

2017-01-05

Metal-semiconductor contact structure with doped interlayer

#28

20160358868

2016-12-08

Semiconductor structure having a patterned surface structure and semiconductor chips including such structures

#29

20160260658

2016-09-08

Source down semiconductor devices and methods of formation thereof

#30

20160168351

2016-06-16

Narrow-gap flip chip underfill composition

#31

20160035654

2016-02-04

Source down semiconductor devices and methods of formation thereof

#32

20150325484

2015-11-12

Metal-semiconductor contact structure with doped interlayer

#33

20150179478

2015-06-25

Narrow-gap flip chip underfill composition

#34

20140273427

2014-09-18

Electrode for low-leakage devices

#35

20140264747

2014-09-18

Deposition of anisotropic dielectric layers orientationally matched to the physically separated substrate

#36

20130069248

2013-03-21

Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof

#37

20120248495

2012-10-04

Light-reflective anisotropic conductive paste and light-emitting device

#38

20120175660

2012-07-12

Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device

#39

20120156502

2012-06-21

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

#40

20120096813

2012-04-26

Incident radiation detector packaging

#41

20120012999

2012-01-19

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

#42

20110241227

2011-10-06

LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

#43

20110180939

2011-07-28

Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same

#44

20110115076

2011-05-19

Semiconductor device having multi-layered wiring layer and fabrication process thereof

#45

20110084409

2011-04-14

Semiconductor element mounting board

#46

20110068483

2011-03-24

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

#47

20110037174

2011-02-17

Method of manufacturing semiconductor component, and semiconductor component

#48

20100320620

2010-12-23

Adhesive film for semiconductor and semiconductor device using the adhesive film

#49

20100290205

2010-11-18

ADHESIVE FILM

#50

20100213622

2010-08-26

Semiconductor device

#51

20100155969

2010-06-24

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

#52