212257 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 4th Group
Sub-classes:CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES
#2INTEGRATED CIRCUIT PACKAGES AND METHODS
#3STACKED HIGH-POWER RF SWITCH
#4TREATMENT PROCESS FOR WAFER BONDING PROCESSES
#5HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
#6INTEGRATED CIRCUIT PACKAGES AND METHODS
#7HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
#8BONDING METHOD
#9WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
#10Semiconductor device
#11Capacitive coupling in a direct-bonded interface for microelectronic devices
#12METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHOD FOR ELECTRICALLY TESTING THE INTEGRATED CIRCUIT
#13ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONTACT TO BOND PADS
#14Capacitive coupling in a direct-bonded interface for microelectronic devices
#15Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#16Semiconductor structure and method of manufacturing the same
#17Wafer level package structure and wafer level packaging method
#18Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#19Protrusion bump pads for bond-on-trace processing
#20Capacitive coupling in a direct-bonded interface for microelectronic devices
#21Ultrathin layer for forming a capacitive interface between joined integrated circuit component
#22Bonding interface layer
#23Ultrathin layer for forming a capacitive interface between joined integrated circuit components
#24Protrusion bump pads for bond-on-trace processing
#25Semiconductor device and method for fabricating the same
#26Semiconductor device
#27Integrated passive flip chip package
#28Semiconductor device having a trace comprises a beveled edge