212259 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Oxides composed of metals from groups of the periodic table 4th Group ZrO
STACKED HIGH-POWER RF SWITCH
#2HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
#3BONDING METHOD
#4SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONNECT LAYER FOR HIGH POWER ELECTRONICS
#5Semiconductor device
#6Chemical bonding method, package-type electronic component, and hybrid bonding method for electronic device
#7Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#8Semiconductor structure and method of manufacturing the same
#9Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#10Protrusion bump pads for bond-on-trace processing
#11Bonding interface layer
#12Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#13Power module and fabrication method for the same
#14Protrusion bump pads for bond-on-trace processing
#15Thermally conductive compositions and methods of making thereof
#16Lead-free solder composition for substrates