212352 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Polymers; Adhesive characteristics other than chemical being an ohmic electrical conductor Extrinsic, i.e. with electrical conductive fillers
CURABLE COMPOSITION FOR FORMING ADHESIVE STRUCTURE, ADHESIVE STRUCTURE, METHOD OF MANUFACTURING ADHESIVE STRUCTURE, AND SEMICONDUCTOR DEVICE
#2SEMICONDUCTOR DEVICE AND MEASUREMENT DEVICE
#3CONNECTORS FOR MAKING CONNECTIONS BETWEEN ANALYTE SENSORS AND OTHER DEVICES
#4CONDUCTIVE ADHESIVE ASSEMBLY FOR SEMICONDUCTOR DIE ATTACHMENT
#5CHIP ARRANGEMENT
#6Connectors for making connections between analyte sensors and other devices
#7Semiconductor device and measurement device
#8Adhesive bonding composition and electronic components prepared from the same
#9Filler disposition film
#10Connectors for making connections between analyte sensors and other devices
#11Circuit board structure and method for manufacturing a circuit board structure
#12Connectors for making connections between analyte sensors and other devices
#13Power module package and method of manufacturing the same
#14Connectors for making connections between analyte sensors and other devices
#15Packaging photon building blocks with top side connections and interconnect structure
#16Adhesive bonding composition and electronic components prepared from the same
#17Method of making flexible semiconductor device with graphene tape
#18Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device
#19Semiconductor device having an oscillator and an associated integrated circuit
#20Packaging photon building blocks with top side connections and interconnect structure
#21Connectors for making connections between analyte sensors and other devices
#22Die attach methods and semiconductor devices manufactured based on such methods
#23Decoupling capacitor mounted on an integrated circuit die, and method of manufacturing the same
#24Methods and apparatus for a semiconductor device having bi-material die attach layer
#25Film-like adhesive and method for producing semiconductor package using film-like adhesive
#26Anisotropic conductive film and display device using the same
#27Adhesive bonding composition and electronic components prepared from the same
#28ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
#29Methods and apparatus for semiconductor device having bi-material die attach layer
#30Connectors for making connections between analyte sensors and other devices
#31Microelectronic elements with post-assembly planarization
#32Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
#33Anisotropic conductive film, method for producing anisotropic conductive film, method for producing connection body, and connection method
#34Staged via formation from both sides of chip
#35Conductive adhesive film structures
#36Integrated electronic components and methods of formation thereof
#37LIGHT-EMITTING DEVICE WITH IMPROVED FLEXURAL RESISTANCE AND ELECTRICAL CONNECTION BETWEEN LAYERS, PRODUCTION METHOD THEREFOR, AND DEVICE USING LIGHT-EMITTING DEVICE
#38Die attach methods and semiconductor devices manufactured based on such methods
#39Method for manufacturing light emitting device
#40ELECTRICALLY CONDUCTIVE ADHESIVE FILM AND DICING DIE BONDING FILM
#41Electronic part embedded substrate and method of producing an electronic part embedded substrate
#42Flexible semiconductor device with graphene tape
#43Anisotropic conductive film and display device using the same
#44Stacked chip-on-board module with edge connector
#45Microelectronic elements with post-assembly planarization
#46Low stress vias
#47Thermally and electrically conductive adhesive composition
#48Display device using semiconductor light emitting device and method for manufacturing
#49Logic die and other components embedded in build-up layers
#50Circuit board structure and method for manufacturing a circuit board structure
#51Electronic part embedded substrate and method of producing an electronic part embedded substrate
#52Staged via formation from both sides of chip
#53Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
#54Connectors for making connections between analyte sensors and other devices
#55Wireless chip and electronic device having wireless chip
#56Semiconductor device having semiconductor chip affixed to substrate via insulating resin adhesive film
#57APPARATUS AND METHOD FOR BONDING CHIPS
#58Multiple die stacking for two or more die
#59Methods for adhesive bonding of electronic devices
#60Systems for adhesive bonding of electronic devices
#61Thermal management in electronic devices with yielding substrates
#62Packaging a substrate with an LED into an interconnect structure only through top side landing pads on the substrate
#63Adhesive and light-emitting device
#64Stacked chip-on-board module with edge connector
#65Semiconductor device and measurement device
#66Light-emitting dies incorporating wavelength-conversion materials and related methods
#67Wafer-level flip chip device packages and related methods
#68Wafer-level flip chip device packages and related methods
#69Stackable molded microelectronic packages with area array unit connectors
#70Stacked packaging improvements
#71Light-emitting device with improved flexural resistance and electrical connection between layers, production method therefor, and device using light-emitting device
#72Engineered-phosphor LED packages and related methods
#73Semiconductor device and manufacturing method therefor
#74Semiconductor device and manufacturing method thereof
#75Thermal management in electronic devices with yielding substrates
#76Packaging photon building blocks having only top side connections in a molded interconnect structure
#77Low-stress vias
#78Integrated circuit (“IC”) assembly includes an IC die with a top metallization layer and a conductive epoxy layer applied to the top metallization layer
#79Microelectronic elements with post-assembly planarization
#80Adhesive bonding composition and method of use
#81Integrated electronic components and methods of formation thereof
#82Connectors for making connections between analyte sensors and other devices
#83Anisotropic conductive adhesive
#84Reduced stress TSV and interposer structures
#85Engineered-phosphor LED packages and related methods
#86Light-reflective anisotropic conductive adhesive and light-emitting device
#87Light-emitting dies incorporating wavelength-conversion materials and related methods
#88Multiple die stacking for two or more die
#89Staged via formation from both sides of chip
#90Semiconductor device connected by anisotropic conductive film
#91Processes and structures for IC fabrication
#92Wafer-level flip chip device packages and related methods
#93Power module package
#94Stacked packaging improvements
#95Light-emitting dies incorporating wavelength-conversion materials and related methods
#96Semiconductor device and measurement device having an oscillator
#97Methods of fabricating wafer-level flip chip device packages
#98Polymeric binders incorporating light-detecting elements
#99Light-reflective anisotropic conductive adhesive agent, and light emitting device
#100Contactless data transmission device, security and/or valuable document including the same and method for manufacturing the contactless data transmission device
#101Thin wafer handling and known good die test method
#102Stress relief for array-based electronic devices
#103Electronic devices with yielding substrates
#104Through silicon vias for semiconductor devices and manufacturing method thereof
#105Compliant interconnects in wafers
#106Low-stress vias
#107Semiconductor device and electronic device having the same
#108Chip embedded substrate and method of producing the same
#109Connection device, method for manufacturing connection structure, method for manufacturing stacked chip component and method for mounting electronic component
#110Component built-in board and method of manufacturing the same, and component built-in board mounting body
#111Thermal management in electronic devices with yielding substrates
#112Wireless chip and electronic device having wireless chip
#113Discrete phosphor chips for light-emitting devices and related methods
#114Method of manufacturing connection structure
#115Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer
#116Semiconductor module system having encapsulated through wire interconnect (TWI)
#117Light-reflective conductive particle, anisotropic conductive adhesive, and light-emitting device
#118Integrated circuit film and method of manufacturing the same
#119Low-stress TSV design using conductive particles
#120Light-heat dual curing anisotropic conductive adhesive, anisotropic conductive film and preparation methods thereof
#121Semiconductor device and manufacturing method thereof
#122Anisotropic conductive adhesive film and electronic device
#123Semiconductor device connected by anisotropic conductive film
#124Adhesive material for electric connection, display device using the adhesive material and method of fabricating the display device
#125Logic die and other components embedded in build-up layers
#126Semiconductor device bonded by anisotropic conductive film
#127Stacked chip-on-board module with edge connector
#128Packaging photon building blocks having only top side connections in a molded interconnect structure
#129Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
#130Semiconductor device connected by anisotropic conductive film
#131Display panel, chip on film and display device including the same
#132Stacked dual-chip packaging structure and preparation method thereof
#133Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device
#134Semiconductor device connected by anisotropic conductive adhesive film
#135Anisotropic conductive adhesive
#136Method for manufacturing a circuit board structure
#137Light-reflective anisotropic conductive adhesive and light-emitting device
#138Device contact, electric device package and method of manufacturing an electric device package
#139Microelectronic assembly tolerant to misplacement of microelectronic elements therein
#140CTE ADAPTION IN A SEMICONDUCTOR PACKAGE
#141Reduced stress TSV and interposer structures
#142Wafer-level flip chip device packages and related methods
#143Integrated electronic components and methods of formation thereof
#144Thermally conductive adhesive
#145Light emitting device
#146Multichip power semiconductor device
#147Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips
#148GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH
#149Clip frame semiconductor packages and methods of formation thereof
#150Manufacturing method of semiconductor device
#151Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
#152Power semiconductor module with method for manufacturing a sintered power semiconductor module
#153Anisotropic conductive film and electronic device including the same
#154Anisotropic conductive film and semiconductor device
#155Anisotropic conductive film and semiconductor device bonded by the same
#156Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device
#157Flip chip package for DRAM with two underfill materials
#158Display panel
#159Anisotropic conductive film composition and semiconductor device bonded by the same
#160Semiconductor device with wireless communication
#161Miniaturized electrical component comprising an MEMS and an ASIC and production method
#162Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film
#163Packaging photon building blocks with top side connections and interconnect structure
#164Multiple die stacking for two or more die
#165ANISOTROPIC CONDUCTIVE FILM AND FABRICATION METHOD THEREOF
#166Tape attaching device and tape attaching method
#167Chips having rear contacts connected by through vias to front contacts
#168BROAD-AREA LIGHTING SYSTEMS
#169Light-reflective anisotropic conductive adhesive agent, and light emitting device
#170Chip-packaging module for a chip and a method for forming a chip-packaging module
#171Area array quad flat no-lead (QFN) package
#172Semiconductor device and manufacturing method therefor
#173Low stress vias
#174Vibrating device and electronic apparatus
#175Substrate for integrated modules
#176Carrier structures for microelectronic elements
#177Flip-chip QFN structure using etched lead frame
#178Light emitting device
#179Connecting film, and joined structure and method for producing the same
#180Connectors for making connections between analyte sensors and other devices
#181CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#182Low-stress TSV design using conductive particles
#183Connecting and bonding adjacent layers with nanostructures
#184POLYMIDE RESIN COMPOSITION, ADHESIVE AGENT AND LAMINATE EACH COMPRISING SAME, AND DEVICE
#185Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#186Semiconductor device and manufacturing method thereof
#187Anisotropic conductive film, joined structure and method for producing the joined structure
#188Window interposed die packaging
#189Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material
#190Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
#191PACKAGE-ON-PACKAGE SEMICONDUCTOR DEVICE
#192Multi-chip module with stacked face-down connected dies
#193Stacked chip-on-board module with edge connector
#194CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COMPONENT, ELECTRONIC MEMBER WITH CONDUCTIVE CONNECTING MATERIAL AND ELECTRONIC COMPONENT
#195Production method of connection structure
#196SEMICONDUCTOR DEVICE WAFER BONDING METHOD
#197PACKAGE-ON-PACKAGE STRUCTURE
#198Anisotropic conductive film, connection structure and method of producing the same
#199Semiconductor packages and methods of packaging semiconductor devices
#200Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding
#201Electronic devices with yielding substrates
#202CONDUCTIVE CONNECTING MATERIAL AND METHOD FOR CONNECTING TERMINALS USING THE SAME
#203DISPLAY APPARATUS
#204Light-reflective anisotropic conductive adhesive and light-emitting device
#205Packaging photon building blocks having only top side connections in a molded interconnect structure
#206CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS AND METHOD FOR PRODUCING CONNECTION TERMINAL
#207Board module and fabrication method thereof
#208Light-reflective conductive particle, anisotropic conductive adhesive and light-emitting device
#209Packaging photon building blocks having only top side connections in an interconnect structure
#210LIGHTING DEVICE AND PRODUCTION METHOD OF THE SAME
#211Wafer level molding structure
#212ADHESIVE COMPOSITION
#213PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
#214Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
#215JOINED STRUCTURE, METHOD FOR PRODUCING THE SAME, AND ANISOTROPIC CONDUCTIVE FILM USED FOR THE SAME
#216Semiconductor device with wireless communication
#217Compliant interconnects in wafers
#218Connecting and bonding adjacent layers with nanostructures
#219ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME
#220Anisotropic conductive adhesive
#221ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES
#222Light-emitting element unit and display device
#223ANISOTROPIC CONDUCTIVE PARTICLES
#224Adhesive bonding composition and method of use
#225ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER
#226Method for producing display device
#227Staged via formation from both sides of chip
#228Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#229Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
#230Contacting means and method for contacting electrical components
#231Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes
#232ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
#233Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
#234Component arrangement and method for production thereof
#235Pressure sensor module and electronic component
#236Flexible micro-system and fabrication method thereof
#237Microelectronic elements with post-assembly planarization
#238Microelectronic elements having metallic pads overlying vias
#239Stackable molded microelectronic packages with area array unit connectors
#240Method of manufacturing a flexible electronic product
#241Composite component and method for producing a composite component
#242Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#243Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#244Electronic devices with yielding substrates
#245Package on package having improved thermal characteristics
#246Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
#247Contactless IC label
#248MULTILAYER PRINTED CIRCUIT BOARD USING FLEXIBLE INTERCONNECT STRUCTURE, AND METHOD OF MAKING SAME
#249Components joining method and components joining structure
#250CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL
#251Anisotropic conductive film and light emitting device
#252Chip embedded substrate and method of producing the same
#253FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE
#254STACKED AND SHIELDED PACKAGES WITH INTERCONNECTS
#255Adhesive for bonding circuit members, circuit board and process for its production
#256Adhesive for bonding circuit members, circuit board and process for its production
#257Adhesive for bonding circuit members, circuit board and process for its production
#258Method of manufacturing semiconductor device
#259Semiconductor device
#260Semiconductor device package having a buffer structure and method of fabricating the same
#261Semiconductor device package having a jumper chip and method of fabricating the same
#262Semiconductor device and manufacturing method thereof
#263Connecting film, and joined structure and method for producing the same
#264Printed wiring board and method for manufacturing same
#265Light-emitting device
#266METHOD FOR CONNECTION OF FLEXIBLE CIRCUIT BOARDS TO RIGID CIRCUIT BOARD, DEVICE FOR CONNECTION THEREOF, PRINTED CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC APPARATUS
#267MEMS package and method for the production thereof
#268Wireless chip and electronic device having wireless chip
#269Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#270Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#271System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#272Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#273Board module and method of manufacturing same
#274System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
#275System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#276Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#277Acrylic insulating adhesive
#278Stackable circuit structures and methods of fabrication thereof
#279Semiconductor device and manufacturing method thereof
#280ELECTRONIC CHIP AND SUBSTRATE WITH SHAPED CONDUCTOR
#281Thin multi-chip flex module
#282Thin multi-chip flex module
#283ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#284Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate
#285ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#286ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#287ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES
#288Thin multi-chip flex module
#289FLIP CHIP PACKAGE
#290Circuit-connecting material and circuit terminal connected structure and connecting method
#291Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip
#292Anisotropic conductive adhesive
#293ELECTRONIC CHIP AND SUBSTRATE PROVIDING INSULATION PROTECTION BETWEEN CONDUCTING NODES
#294Integrated (multilayer) circuits and process of producing the same
#295STACKING SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREOF
#296Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#297Bump structure, chip package structure including the same and method of manufacturing the same
#298Double-side mountable MEMS package
#299Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
#300Stacked packaging improvements