212366 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected Shape
Sub-classes:PACKAGED MODULE WITH LOW MODULUS COMPOSITE MAGNETIC MOLDING MATERIAL
#2DIE AND MANUFACTURING METHOD THEREOF AS WELL AS SEMICONDUCTOR PACKAGE WITH THE SAME
#3SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#4Stress isolation for silicon photonic applications
#5High power gallium nitride devices and structures
#6High power gallium nitride devices and structures
#7RF communications device with conductive trace and related switching circuits and methods
#8Semiconductor device
#9INTEGRATED DEVICE COMPRISING A SUBSTRATE WITH ALIGNING TRENCH AND/OR COOLING CAVITY
#10Semiconductor device
#11Ramp-stack chip package with static bends
#12RF communications device with conductive trace and related switching circuits and methods