212367 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Shape being other than a cuboid
Sub-classes:Heat Spreading Device and Method
#2Light emitting device and fluidic manufacture thereof
#3Electronic package and substrate structure having chamfers
#4Receiver optical module and process of assembling the same
#5Multi-die package with bridge layer
#6Manufacturing method of sensor chip package structure
#7Electronics assemblies and cooling structures having metalized exterior surface
#8Heat spreading device and method
#9Light emitting diode (LED) components and methods
#10Method of manufacturing a semiconductor device
#11Photo-sensitive silicon package embedding self-powered electronic system
#12NON-RECTANGULAR ELECTRONIC DEVICE COMPONENTS
#13Pressure sensor, in particular a microphone with improved layout
#14Die encapsulation in oxide bonded wafer stack
#15Light emitting device and fluidic manufacture thereof
#16Selective recess
#17Systems and methods for electromagnetic interference shielding
#18Method of manufacturing a semiconductor device
#19Microelectronic device stacks having interior window wirebonding
#20Receiver optical module and process of assembling the same
#21Package and light-emitting device
#22APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVICE CONFIGURED TO MEASURE A HYDROSTATIC PRESSURE OF THE FLUID
#23Heat spreading device and method
#24Chip packaging structure, chip module and electronic terminal
#25High bandwidth memory (HBM) bandwidth aggregation switch
#26Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#27Die encapsulation in oxide bonded wafer stack
#28Semiconductor device and method of manufacturing the same
#29Method of manufacturing light emitting device
#30Electronics assemblies and cooling structures having metalized exterior surface
#31Semiconductor package with improved bandwidth
#32Photo-sensitive silicon package embedding self-powered electronic system
#33Light detection device
#34Surface mount package and manufacturing method thereof
#35Pixel tile structures and layouts
#36MEMS transducer package
#37MEMS transducer package
#38Fingerprint identification apparatus
#39Semiconductor light emitting device package and method for manufacturing the same
#40Light emitting device and fluidic manufacture thereof
#41Optical sensor module and sensor chip thereof
#42Substrate structure having chamfers
#43Display device
#44Systems and methods for electromagnetic interference shielding
#45Semiconductor dies with recesses, associated leadframes, and associated systems and methods
#46Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid
#47Methods for making multi-die package with bridge layer
#48Display device
#49Non-rectangular electronic device components
#50Method of manufacturing a semiconductor device
#51Sensor chip package structure and manufacturing method thereof
#52Imaging unit, lens barrel, and portable terminal
#53Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#54Semiconductor package and mounting structure thereof
#55Packaged semiconductor device having stacked attached chips overhanging the assembly pad
#56Connection pads for a fingerprint sensing device
#57Silicon package for embedded electronic system having stacked semiconductor chips
#58Chip package and method for forming the same
#59Photo-sensitive silicon package embedding self-powered electronic system
#60Light emitting diode (LED) components and methods
#61Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor
#62Light emitting device having first and second wavelength converter parts
#63Multi-die package with bridge layer and method for making the same
#64Package and light-emitting device
#65Wire bond sensor package
#66Method to form primary optic with variable shapes and/or geometries without a substrate
#67Semiconductor device having a cooling body with a groove
#68Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#69Chip package and method for forming the same
#70Semiconductor element, semiconductor element manufacturing method, semiconductor module, semiconductor module manufacturing method, and semiconductor package
#71Methods for forming a sensor array package
#72Substrate composite, method and device for bonding of substrates
#73Lighting device with a phosphor layer on a peripheral side surface of a light-emitting element and a reflecting layer on an upper surface of the light-emitting element and on an upper surface of the phosphor layer
#74Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#75Semiconductor device
#76Electronic circuit arrangement and method of manufacturing the same
#77Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structure
#78Chip package and method for forming the same
#79Semiconductor module system having encapsulated through wire interconnect (TWI)
#80Semiconductor device, and manufacturing method for same
#81Preform including a groove extending to an edge of the preform
#82Chip package
#83Packages and methods for 3D integration including two stacked dies with a portion of one die extending into a hole of the other die
#84Chip package and method for forming the same
#85Sensor array package
#86Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same
#87Light emitter packages and devices having improved wire bonding and related methods
#88SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#89Thin semiconductor die package
#90LIGHT EMITTING DIODE WITH CONFORMAL SURFACE ELECTRICAL CONTACTS WITH GLASS ENCAPSULATION
#91Semiconductor device and manufacturing method of the same
#92SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
#93SEMICONDUCTOR DEVICE DIE BONDING
#94Light emitting devices
#95Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
#96Gel underfill layers for light emitting diodes
#97Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#98MEMS component and a semiconductor component in a common housing having at least one access opening
#99Systems and methods for three-axis sensor chip packages
#100Horizontal-cavity surface-emitting laser
#101SURGE PROTECTION DEVICE
#102SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND DISPLAY
#103Light-emitting devices
#104Methods for manufacturing superjunction semiconductor device having a dielectric termination
#105Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof
#106Semiconductor device and electronic device
#107Protecting flip-chip package using pre-applied fillet
#108SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
#109Method for producing lamps
#110Substrateless power device packages
#111Semiconductor package
#112Ramp-stack chip package with static bends
#113Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
#114DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SENSOR APPARATUS
#115Semiconductor laser apparatus and optical apparatus
#116Package for vacuum encapsulation of an associated microelectromechanical system, and a method for detecting a problem with a solder joint in such an assembly
#117Laminate constructs for micro-fluid ejection devices
#118Semiconductor device with substrate-side exposed device-side electrode and method of fabrication
#119SEMICONDUCTOR LASER APPARATUS AND OPTICAL APPARATUS
#120GALLIUM NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE
#121Heterogeneous Technology Integration
#122Stacked semiconductor package having discrete components
#123Arrangement having at least two light-emitting semiconductor components and method for the production of such an arrangement
#124Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming
#125Light source for lighting
#126Microelectromechanical systems microphone packaging systems
#127Stack-type semiconductor device having chips having different backside structure and electronic apparatus including the same
#128Method of manufacturing group-III nitride semiconductor light-emitting device, and group-III nitride semiconductor light-emitting device, and lamp
#129System with semiconductor components having encapsulated through wire interconnects (TWI)
#130Semiconductor package having discrete components and system containing the package
#131IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods
#132Methods to fabricate integrated circuits by assembling components
#133Semiconductor package and method for producing the same
#134Processes and structures for IC fabrication
#135Semiconductor power module
#136LED with substrate modifications for enhanced light extraction and method of making same
#137Widebody coil isolators
#138Self-Aligned Chip Stacking
#139Semiconductor device with hollow and throughhole and method of manufacturing same
#140Light-emitting devices
#141IGBT semiconductor device
#142Light emitting diode package structure
#143Method for fabricating semiconductor packages with discrete components
#144Semiconductor device and manufacturing method of the same
#145Method of stacking semiconductor chips including forming an interconnect member and a through electrode
#146Large die package structures and fabrication method therefor
#147Wet/wet differential pressure sensor based on microelectronic packaging process
#148Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
#149Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire
#150Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)
#151SEMICONDUCTOR DEVICE
#152Method of fabricating stacked semiconductor package with localized cavities for wire bonding
#153Stacked semiconductor package with localized cavities for wire bonding
#154Mesa type semiconductor device and manufacturing method thereof
#155Electrically conducting connection with insulating connection medium
#156Method for manufacturing semiconductor chip and semiconductor device
#157SEMICONDUCTOR PACKAGE
#158LED with substrate modifications for enhanced light extraction and method of making same
#159Component comprising a MEMS microphone and method for the production of said component
#160Chip structure and stacked chip package as well as method for manufacturing chip structures
#161Flip chip bonded semiconductor device with shelf and method of manufacturing thereof
#162Method of integrated circuit fabrication
#163Superjunction device having a dielectric termination and methods for manufacturing the device
#164ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY
#165Semiconductor device having a plurality of elements on one semiconductor substrate and method of manufacturing the same
#166SEMICONDUCTOR LASER DIODE WITH REDUCED PARASITIC CAPACITANCE
#167SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS
#168Chip attack protection
#169INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES
#170GALLIUM NITRIDE BASED SEMICONDUCTOR LIGHT EMITTING DIODE AND PROCESS FOR PREPARING THE SAME
#171Semiconductor package having die with recess and discrete component embedded within the recess
#172Integrated circuit package system with interference-fit feature
#173Semiconductor Light Emitting Element and Method for Manufacturing the Same
#174Semiconductor device package having a semiconductor element with a roughened surface
#175Pressure sensor with sensing chip protected by protective material
#176Beveled LED Chip with Transparent Substrate
#177INTEGRATED CIRCUIT DEVICES WITH INTEGRAL HEAT SINKS
#178Semiconductor module
#179Radiation-emitting semiconductor component and method for producing the semiconductor component
#180Semiconductor Light Emitting Element and Method for Manufacturing the Same
#181Structure and manufacturing method of inversed microphone module and microphone chip component
#182Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
#183Semiconductor Light Emitting Element and Method for Manufacturing the Same
#184Carrier Board Structure Embedded with Semiconductor Component and Method for Fabricating the Carrier Board Structure
#185Semiconductor package and method for producing the same
#186GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF FORMING THE SAME
#187Semiconductor power module including epoxy resin coating
#188Semiconductor components having encapsulated through wire interconnects (TWI)
#189METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF
#190Method of fabricating a semiconductor device package having a semiconductor element with a roughened surface
#191Liquid epoxy resin composition
#192Display device
#193Semiconductor device and method of manufacturing the same
#194Single chip and stack-type chip semiconductor package and method of manufacturing the same
#195Electronic component, module, module assembling method, module identification method and module environment setting method
#196Semiconductor device
#197Semiconductor device with a resin-sealed optical semiconductor element
#198Thin IC package for improving heat dissipation from chip backside
#199Apparatuses and methods facilitating functional block deposition
#200METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#201Sensor device having a buffer element between the molding and the sensing element
#202Large die package structures and fabrication method therefor
#203Vertical conducting power semiconducting devices made by deep reactive ion etching
#204Chip-on-board assemblies
#205Manufacturing method for a semiconductor device
#206Semiconductor photodetector and photodetecting device having layers with specific crystal orientations
#207Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming
#208Light emitting diode chip and light emitting diode using the same
#209Semiconductor device and method of stacking semiconductor chips
#210Die structure of package and method of manufacturing the same
#211Light-emitting diode device and method of manufacturing thereof
#212Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof
#213Light emitting device
#214Infrared sensor having no package can
#215Semiconductor light emitting element and semiconductor light emitting device
#216Assembly comprising functional devices and method of making same
#217Semiconductor light emitting element having three side surfaces inclined to connect the top and bottom surfaces of the transparent substrate
#218Pressure sensor with integrated structure
#219Gallium nitride based semiconductor light emitting diode and process for preparing the same
#220LED array package with internal feedback and control
#221LED with substrate modifications for enhanced light extraction and method of making same
#222LED with substrate modifications for enhanced light extraction and method of making same
#223Semiconductor light emitting element and method for manufacturing the same
#224Large die package structures and fabrication method therefor
#225Component mounting substrate and structure
#226Top finger having a groove and semiconductor device having the same
#227Semiconductor device package having a semiconductor element with resin
#228Semiconductor package having step type die and method for manufacturing the same
#229Packaged acoustic and electromagnetic transducer chips
#230Packaged acoustic and electromagnetic transducer chips
#231Process for the manufacture of large area arrays of discrete components
#232Semiconductor device
#233Semiconductor substrate assemblies and methods for preparing and dicing the same
#234Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
#235Single chip and stack-type chip semiconductor package and method of manufacturing the same
#236Micro electro mechanical systems device, method of manufacturing the same and micro electro mechanical systems module
#237Semiconductor package structure
#238Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
#239Power supply device
#240Radiation-emitting semiconductor chip, method for production thereof and radiation-emitting component
#241Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
#242Radiation emitting semiconductor device
#243Silicon package for embedded electronic system having stacked semiconductor chips