H01L2924/1027 - CPC Classification Index

ClassID:

212382 ⎘

H01L2924/1027 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Material of the semiconductor or solid state bodies; Semiconducting materials; Compound semiconductors IV

Sub-classes:

H01L2924/10271 » Silicon-germanium [SiGe] 256
H01L2924/10272 » Silicon Carbide [SiC] 812

Recent Application in this class:

20200350279

Integrated fan-out package structures with recesses in molding compound

20200043892

Chip packages and methods of manufacture thereof

20180350770

Integrated fan-out package structures with recesses in molding compound

20170301649

Chip packages and methods of manufacture thereof

20170040288

Integrated fan-out package structures with recesses in molding compound

20160013150

Integrated fan-out package structures with recesses in molding compound

20150270249

Semiconductor package with via-coupled power transistors

20150243629

Methods for wafer bonding, and for nucleating bonding nanophases

20150076713

Integrated fan-out package structures with recesses in molding compound

20120153426

Void-free wafer bonding using channels