Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same

Optical-semiconductor device and method for manufacturing the same

Light-emitting apparatus with leads coated with metal films

Nitride semiconductor light emitting chip, and nitride semiconductor light emitting device

Electronic device and method of manufacturing an electronic device

Flexible LED device for thermal management

Method for manufacturing red phosphor

Semiconductor device stack with bonding layer and wire retaining member

Lens-equipped optical semiconductor device and method for manufacturing the same

Light emitting device and method of manufacturing the same

Microelectronic device with integrated energy source

Semiconductor component support and semiconductor device

Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device

Semiconductor device and method of forming bump-on-lead interconnection

Photonic semiconductor devices in LLC assembly with controlled molding boundary and method for forming same

Interposers including fluidic microchannels and related structures and methods

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Semiconductor structures including fluidic microchannels for cooling and related methods

Semiconductor light emitting diode having a contact portion and a reflective portion

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Semiconductor device and method of forming an embedded SOP fan-out package

Miniature surface mount device

LED having vertical contacts redistruted for flip chip mounting

Semiconductor device and manufacturing method thereof

METHOD FOR BONDING LED WAFER, METHOD FOR MANUFACTURING LED CHIP AND BONDING STRUCTURE

Wafer level optical proximity sensors and systems including wafer level optical proximity sensors

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

Wafer-level flip chip device packages and related methods

Method of manufacturing electronic device and electronic device

Semiconductor module and method for manufacturing the same

Chip package and method for forming the same

Semiconductor device and method of reflow soldering for conductive column structure in flip chip package

Flexible light emitting semiconductor device

Device module

Chip package and method for forming the same

Wafer-level process for fabricating photoelectric modules

Leadframe for optoelectronic components and method for producing optoelectronic components

Chip package and method for forming the same

SEMICONDUCTOR LIGHT EMITTING DEVICE

Method of manufacturing a semiconductor device including through silicon plugs

Compliant micro device transfer head

Semiconductor device and method of controlling warpage in semiconductor package

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

Semiconductor device and method of depositing underfill material with uniform flow rate

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Wafer level reflector for LED packaging

Flexible LED device and method of making

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

Lead frame for optical semiconductor device and optical semiconductor device using the same

Thin film light emitting diode

Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressure

Circuit device

Circuit device

Circuit device and method for manufacturing same

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor light emitting device

Method of forming a micro LED device with self-aligned metallization stack

Optoelectronic semiconductor component

Semiconductor device and method of adaptive patterning for panelized packaging

Light emitter components and methods having improved electrical contacts

Thermally conductive adhesive

Metal-insulator-metal capacitors on glass substrates

Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Method and system for providing a reliable light emitting diode semiconductor device

Semiconductor light emitting device, backlight, color image display device and phosphor to be used for them

Light-emitting device

Multi-chip light emitter packages and related methods

Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same

Wafer level packaging of multiple light emitting diodes (LEDs) on a single carrier die

Wafer level packaging of light emitting diodes (LEDs)

Deformable network structure

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device

Substrate based light emitter devices, components, and related methods

Multi-chip light emitter packages and related methods

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer

Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief

Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die

Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces

Semiconductor light emitting element

Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration

Molded leadframe substrate semiconductor package

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP

Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package

Semiconductor element and method of manufacturing same

Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers

Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Method and system for ultra miniaturized packages for transient voltage suppressors

Resin coating device and a resin coating method

Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Etched trenches in bond materials for die singulation, and associated systems and methods

Semiconductor light source

Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor

Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP)

Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus

Light-emitting device

Light emitting diode assembly and method for fabricating the same

Active LED module

Heavy-wire bond arrangement and method for producing same

Method for manufacturing light emitting diode package

Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

Method for producing at least one optoelectronic semiconductor component

Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

Light emitting element and fabricating method thereof

Heat spreading substrate with embedded interconnects

Flexible LED device with wire bond free die

Method of transferring and bonding an array of micro devices

Optoelectronic apparatuses and methods for manufacturing optoelectronic apparatuses

Light emitting diode array

Positioning system

Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP

PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME

Light emitting diode with wavelength conversion layer

Light emitter packages and devices having improved wire bonding and related methods

Semiconductor device

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Semiconductor module including first and second wiring portions separated from each other

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Molding method for COB-EUSB devices and metal housing package

Semiconductor device and method of forming an inductor on polymer matrix composite substrate

LED Package with Slanting Structure and Method of the Same

Bonding structure of multilayer copper bonding wire

Method for packaging light emitting diode

Integrated circuit package and method of assembling an integrated circuit package

Semiconductor device and method of forming reduced surface roughness in molded underfill for improved C-SAM inspection

Light emitting device package and method of fabricating the same

Alloy wire and methods for manufacturing the same

Package carrier and manufacturing method thereof

Surface-mounting light emitting diode device and method for manufacturing the same

Method for disposing fine objects, apparatus for arranging fine objects, illuminating apparatus and display apparatus

SOLID-STATE LIGHT-EMITTING DEVICE AND SOLID-STATE LIGHT-EMITTING PACKAGE THEREOF

Method of manufacturing printed wiring board

COMPOSITE ALLOY BONDING WIRE

Semiconductor device and method of forming extended semiconductor device with fan-out interconnect structure to reduce complexity of substrate

Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief

Curable organopolysiloxane composition and optical semiconductor device

Light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces

Chip on flex optical subassembly

Light-emittng device having a resin to control directivity to enhance luminous efficiency

Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Light emitting device, and package array for light emitting device

Method for manufacturing photocoupler, and photocoupler lead frame sheet

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP

Semiconductor device and method of making single layer substrate with asymmetrical fibers and reduced warpage

Semiconductor device

Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer

Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate

Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction

Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers

Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Semiconductor device and method of forming a power MOSFET with interconnect structure to achieve lower RDSON

Semiconductor device and method of forming RDL under bump for electrical connection to enclosed bump

Semiconductor light emission device, image formation apparatus and image display apparatus

Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer

Method of fabricating a micro device transfer head

GLASS-ENCAPSULATED PRESSURE SENSOR

Front facing piggyback wafer assembly

Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids

Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface

Micro device transfer head

Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure

Surface-mountable optoelectronic component and method for producing a surface-mountable optoelectronic component

High yield substrate assembly

Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer

Apparatus and Method for Die Bonding

Semiconductor device with wireless communication

Semiconductor light emitting device, light emitting module, lighting apparatus and display element

LED PACKAGE STRUCTURE FOR ENHANCING MIXED LIGHT EFFECT

Termination structure for gallium nitride schottky diode

Vertical gallium nitride Schottky diode

Electronic circuit, method of manufacturing electronic circuit, and mounting member

Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer

Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief

Packaging photon building blocks with top side connections and interconnect structure

Substrate, light emitting device and method for manufacturing substrate

Method of manufacturing light emitting device package having reflector and phosphor layer

Large panel leadframe

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Semiconductor device and method of forming conductive posts and heat sink over semiconductor die using leadframe

Semiconductor die and method of forming sloped surface in photoresist layer to enhance flow of underfill material between semiconductor die and substrate

Semiconductor device and method of forming thermal interface material and heat spreader over semiconductor die

3D chip package with shielded structures

Semiconductor device package assembly, semiconductor device assembly, and method of manufacturing semiconductor device

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Wiring substrate, light emitting device, and method for manufacturing wiring substrate

Semiconductor device and method of forming conductive pillar having an expanded base

Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more eWLB packages per wafer with encapsulant deposited under temperature and pressure

Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die

Diode package having improved lead wire and manufacturing method thereof

Method for producing a power semiconductor arrangement

Light emitting device, light emitting element array, and image display device

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE AND THE LIGHT-EMITTING DEVICE

Semiconductor device and method of forming interconnect substrate for FO-WLCSP

Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP

Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die

Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant

Method for assembling a chip in a flexible substrate

Lead frame, wiring board, light emitting unit, and illuminating apparatus

Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device

Light-emitting device

Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus

Semiconductor device and method of forming semiconductor package using panel form carrier

Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant

Semiconductor device and method of forming protection and support structure for conductive interconnect structure

Semiconductor device and method of forming protection and support structure for conductive interconnect structure

Semiconductor device and method of forming a reconfigured stackable wafer level package with vertical interconnect

Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure

Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate

LIGHT-EMITTING DIODE AND METHOD MANUFACTURING THE SAME

PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE

THERMAL CONDUCTIVE SHEET AND PRODUCING METHOD THEREOF

METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE

Mounting method for semiconductor light emitter using resist with openings of different sizes

Backplate interconnect with integrated passives

High thermal conductivity and low degradation die attach with dual adhesive

LED devices having lenses and methods of making same

LIGHT EMITTING DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

LIGHT EMITTING DEVICE

Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method

MANUFACTURING METHOD OF PACKAGE CARRIER

Reduction of etch microloading for through silicon vias

Condensing lens and lighting device equipped with said condensing lens

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die

Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure

Package for semiconductor light-emitting device and light-emitting device

BROAD-AREA LIGHTING SYSTEMS

Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement

Semiconductor Device and Method of Forming TIM Within Recesses of MUF Material

Light-reflective anisotropic conductive adhesive agent, and light emitting device

Discontinuous patterned bonds for semiconductor devices and associated systems and methods

PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME

Bonded semiconductor structures including two or more processed semiconductor structures carried by a common substrate

Semiconductor device including a recess formed above a semiconductor chip

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

Methods of forming bonded semiconductor structures in 3D integration processes using recoverable substrates, and bonded semiconductor structures formed by such methods

Methods of forming bonded semiconductor structures including interconnect layers having one or more of electrical, optical, and fluidic interconnects therein, and bonded semiconductor structures formed using such methods

Semiconductor chips having a dual-layered structure, packages having the same, and methods of fabricating the semiconductor chips and the packages

Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures

LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME

Light emitting device and method for manufacturing light emitting device

Miniature leadless surface mount lamp with dome and reflector cup

SEMICONDUCTOR DEVICE MEMBER, PRODUCTION METHOD OF SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID AND SEMICONDUCTOR DEVICE MEMBER, AND SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING SYSTEM AND IMAGE DISPLAY SYSTEM USING THE SAME

Terminal-integrated metal base package module and terminal-integrated metal base packaging method

Semiconductor light-emitting device and method for manufacturing same

Manufacturing method of LED package structure

Method for assembling at least one chip using a fabric, and fabric including a chip device

Semiconductor device having at least a transistor cell with a second conductive type region surrounding a wall region and being insulated from both gate electrode and source electrode and solid state relay using same

Light-emitting device

Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die

Non-reactive barrier metal for eutectic bonding process

High temperature gold-free wafer bonding for light emitting diodes

LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

LED LIGHT STRIP MODULE STRUCTURE

LED ON SILICON SUBSTRATE USING ZINC-SULFIDE AS BUFFER LAYER

Molding die set and resin molding apparatus having the same

Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device

Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOF

POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the same

Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool

BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL

Chip package and fabrication method thereof

Semiconductor device and method of manufacturing the same

Process for preparing a bonding type semiconductor substrate

LED module and LED module mounting structure

Method of manufacturing light-emitting device

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Optoelectronic semiconductor device

Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking

Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die

Light emitting device package and a lighting unit with base having via hole

Laminate electronic device

RESIN COATING DEVICE IN LED PACKAGE MANUFACTURING SYSTEM

Manufacturing method of light emitting devices