212518 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Passive devices, e.g. 2 terminal devices Capacitor
Making electrical components in handle wafers of integrated circuit packages
#302Semiconductor device and DC-to-DC converter
#303Trap rich layer for semiconductor devices
#304Passive component integrated with semiconductor device in semiconductor package
#305Semiconductor package with integrated semiconductor devices and passive component
#306Cascode power transistors
#307Processing techniques for silicon-based transient devices
#308Radio frequency power device
#309Integrated passive device assemblies for RF amplifiers, and methods of manufacture thereof
#310Methods for surface attachment of flipped active components
#311Power semiconductor package
#312Stacked semiconductor die assemblies with die support members and associated systems and methods
#313Stacked semiconductor die assemblies with support members and associated systems and methods
#314CERAMIC INTERPOSER CAPACITOR
#315EMBEDDED CHIPS
#316Power converter package structure and method
#317Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof
#318Wedge bond foot jumper connections
#319Semiconductor device and method of manufacturing same
#320Power Transistor Die with Capacitively Coupled Bond Pad
#321Integrated passive flip chip package
#322SEMICONDUCTOR DEVICE
#323Integrated voltage regulator with embedded passive device(s) for a stacked IC
#324Metal-insulator-metal (MIM) capacitor in redistribution layer (RDL) of an integrated device
#325Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#326SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES
#327Package assembly having interconnect for stacked electronic devices and method for manufacturing the same
#328Attaching passive components to a semiconductor package
#329Embedded memory and power management subpackage
#330PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
#331Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#332Transistor arrangement
#333SEMICONDUCTOR MODULE CARRYING THE SAME
#334Integrated semiconductor device and wafer level method of fabricating the same
#335Segmented bond pads and methods of fabrication thereof
#336Semiconductor devices with ball strength improvement
#337Power semiconductor package with multiple dies
#338DE-POP ON-DEVICE DECOUPLING FOR BGA
#339Semiconductor device and method of manufacturing same
#340Methods for the formation of a trap rich layer
#341Memory module in a package
#342Integrated circuit package with printed circuit layer
#343Devices and methods related to interconnect conductors to reduce de-lamination
#344Methods of and semiconductor devices with ball strength improvement
#345De-pop on-device decoupling for BGA
#346Package systems including passive electrical components
#347Memory module in a package
#348Memory module in a package
#349De-skewed multi-die packages
#350SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
#351Substrates with transferable chiplets
#352Power converter package structure and method
#353Methods for surface attachment of flipped active componenets
#354Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#355Multichip Packages
#356Trap rich layer for semiconductor devices
#357Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#358Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#359Semiconductor device and method of manufacturing the same
#360Semiconductor device and method of bonding different size semiconductor die at the wafer level
#361Semiconductor storage device and a method of manufacturing the semiconductor storage device
#362Integrated voltage regulator with embedded passive device(s) for a stacked IC
#363Wiring board, method of manufacturing the same, and semiconductor device
#364WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
#365Bonding pad structure
#366Attaching passive components to a semiconductor package
#367Semiconductor device and DC-to-DC converter
#368Semiconductor device and method of manufacturing the same
#369Semiconductor device and passive component integration in a semiconductor package
#370Semiconductor package
#371Electronic device, assembly and methods of manufacturing an electronic device including a vertical trench capacitor and a vertical interconnect
#372Semiconductor device with decoupling unit and method for fabricating the same
#373Semiconductor structure and method for forming the same
#374Package structure and manufacturing method thereof
#375Structure and method for fabricating a computing system with an integrated voltage regulator module
#376Heterogeneous miniaturization platform
#377Semiconductor package and method of forming the same
#378Structure and method for fabricating a computing system with an integrated voltage regulator module
#379Wire bonded electronic devices to round wire
#380Wire bond wires for interference shielding
#381Integrated circuit package with embedded passive structures