Chip package and fabrication method thereof

Wafers including patterned back side layers thereon

Embedded integrated circuit package system and method of manufacture thereof

Integrated circuit chip and flip chip package having the integrated circuit chip

Template process for small pitch flip-chip interconnect hybridization

Chip package and fabrication method thereof

Integrated circuit package system for stackable devices and method for manufacturing thereof

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

Integrated circuit packaging system with protective coating and method of manufacture thereof

Lead frame and method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE

Optoelectronic devices with laminate leadless carrier packaging in side-looker or top-looker device orientation

Multi-chip module for battery power control

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Low cost lead-free preplated leadframe having improved adhesion and solderability

Molded leadframe substrate semiconductor package

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Manufacturing method of semiconductor device

Maintaining integrity of preloaded content in non-volatile memory during surface mounting

Pad layout structure of driver IC chip

Wiring board, semiconductor device, and method of manufacturing the same

Electronic device

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

ELECTRONIC DEVICE

Method for manufacturing a semiconductor component

Back side metallization with superior adhesion in high-performance semiconductor devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor module, method of manufacturing semiconductor module, and mobile device

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE

Semiconductor device with copper wire having different width portions

Semiconductor device with overlapped lead terminals

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Substrate with built-in semiconductor element, and method of fabricating substrate with built-in semiconductor element

Mechanical coupling in a multi-chip module using magnetic components

Isostress grid array and method of fabrication thereof

SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND LEAD FRAME, COMPRISING A BENT CONTACT SECTION

Foil based semiconductor package

Stacking devices at finished package level

MIXED ALLOY LEAD FRAME FOR PACKAGING POWER SEMICONDUCTOR DEVICES AND ITS FABRICATION METHOD

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor device, electronic apparatus, and manufacturing methods thereof

Semiconductor integrated circuit

Semiconductor integrated circuit device

Semiconductor device and method for manufacturing same

Wireless IC device and manufacturing method thereof

Plating apparatus

Foil plating for semiconductor packaging

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Interposer and electronic device

Method for forming a current distribution structure

Manufacturing method of semiconductor device

Method of manufacturing semiconductor device

Method for connecting integrated circuit chip to power and ground circuits

3D smart power module

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Fabrication method of semiconductor integrated circuit device

Method for integrating an electronic component into a printed circuit board

Component and method for producing a component

Device and manufacturing method

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Semiconductor package with semiconductor core structure and method of forming the same

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Integrated circuit packaging system with a leaded package and method of manufacture thereof

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Method for manufacturing packaging structure

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Integrated circuit packaging system with encapsulated via and method of manufacture thereof

LOW COST DIE PLACEMENT

Integrated circuit packaging system with cap layer and method of manufacture thereof

Integrated circuit packaging system with circuitry stacking and method of manufacture thereof

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Thermally improved semiconductor QFN/SON package

Screened electrical device and a process for manufacturing the same

Semiconductor device having semiconductor chip within multilayer substrate

Method for low temperature bonding and bonded structure

LEAD FRAME AND METHOD OF FORMING SAME

Protection layer for adhesive material at wafer edge

Wafer level integration module with interconnects

3D multiple die stacking

Dicing tape and die attach adhesive with patterned backing

Differential read and write architecture

Robust FBEOL and UBM structure of C4 interconnects

Integrated circuit packaging system with fan-in package and method of manufacture thereof

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

Stacked-die package including substrate-ground coupling

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Through hole electrode substrate with different area weighted average crystal grain diameter of metal in the conductive part and semiconductor device using the through hole electrode substrate

Delamination resistance of stacked dies in die saw

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof

Chip for Reliable Stacking on another Chip

Three-dimensionally integrated semicondutor device and method for manufacturing the same

Stacked die package for peripheral and center device pad layout device

Semiconductor package

Protection layer for preventing UBM layer from chemical attack and oxidation

Group III nitride based flip-chip integrated circuit and method for fabricating

Integrated circuit package and device

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Double-side mountable MEMS package

OPTICAL DEVICE, INTEGRATED CIRCUIT DEVICE AND SYSTEM

SEMICONDUCTOR DEVICE PACKAGE WITH DOWN-SET LEADS

Folded lands and vias for multichip semiconductor packages

Leadframe and chip package

Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof

Semiconductor die containing lateral edge shapes and textures

Non-volatile memory with reduced mobile ion diffusion

Protected semiconductor device and method of manufacturing thereof

Semiconductor device and method of forming integrated passive device

Fabrication for electroplating thick metal pads

Laminated substrate for an integrated circuit BGA package and printed circuit boards

Method of manufacturing mounting structure and mounting structure

MULTI-LAYER CERAMIC CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRIC DEVICE MODULE USING THE SAME

Circuit module and method of manufacturing the same

Method of manufacturing a printed wiring board

Semiconductor wafer coat layers and methods therefor

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

METHOD OF FORMING TAPE BALL GRID ARRAY PACKAGE

MEMS device package with vacuum cavity by two-step solder reflow method

BONDING WIRE

SEMICONDUCTOR DEVICE

Bonding metallurgy for three-dimensional interconnect

Packaging structure having embedded semiconductor element

3-D MULTI-WAFER STACKED SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Enhanced copper posts for wafer level chip scale packaging

Integrated circuit packaging system with conductive pillars and method of manufacture thereof

Semiconductor Chip with Stair Arrangement Bump Structures

Edge mounted integrated circuits with heat sink

Package substrate having semiconductor component embedded therein and fabrication method thereof

Method for fabricating a semiconductor and semiconductor package

Impedance optimized chip system

Direct contact leadless flip chip package for high current devices

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

CMOS IMAGE SENSOR HAVING A CURVED SEMICONDUCTOR CHIP

Wafer level packaged integrated circuit

System with recessed sensing or processing elements

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

Method of manufacturing a through-hole electrode substrate

Arrangement for solder bump formation on wafers

Semiconductor circuit

Manufacturing method of semiconductor device and electronic device

Integrated circuit with pins at multiple edges of a chip

HIGH-DENSITY MEMORY ASSEMBLY

Wafer-level molded structure for package assembly

Solder joint reliability in microelectronic packaging

Stacking-Type USB Memory Device And Method Of Fabricating The Same

Transformer signal coupling for flip-chip integration

Using interrupted through-silicon-vias in integrated circuits adapted for stacking

Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm

Electronic devices with extended metallization layer on a passivation layer

Semiconductor package with its surface edge covered by resin

Semiconductor chip with contoured solder structure opening

Methods and structures for controlling wafer curvature

Integrated circuits having TSVs including metal gettering dielectric liners

Interconnect layouts for electronic assemblies

Front side copper post joint structure for temporary bond in TSV application

Self-aligned protection layer for copper post structure

SEMICONDUCTOR DEVICE PACKAGES WITH INTEGRATED HEATSINKS

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor package and method of fabricating the same

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers

Direct contact leadless package for high current devices

Semiconductor device with acene heat spreader

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Semiconductor device with electromagnetic interference shielding

Bonding pad structure and integrated circuit chip using such bonding pad structure

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFET

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

OPTICAL MODULE

Wire-bonding machine with cover-gas supply device

Surface mounted electronic component

Resin sheet for circuit boards, sheet for circuit boards and circuit board displays

Method for producing flexible integrated circuits which may be provided contiguously

Bonding method and bonding apparatus

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Method and system for bonding electrical devices using an electrically conductive adhesive

Lightweight and compact through-silicon via stack package with excellent electrical connections and method for manufacturing the same

Vertically stacked pre-packaged integrated circuit chips

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Fabrication of compact opto-electronic component packages

Silicon carrier optoelectronic packaging

3D optoelectronic packaging

High frequency circuit having multi-chip module structure

Electronic component and manufacturing method thereof

Semiconductor device

Semiconductor device having a wafer level chip size package structure

Extendable connector and network

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Vias and conductive routing layers in semiconductor substrates

Electronic device and method of manufacturing the same

Semiconductor device having stable signal transmission at high speed and high frequency

Chip package with heavily doped region and fabrication method thereof

Chip package with heavily doped regions and fabrication method thereof

Die package and method of manufacturing the same

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

Chip package and fabrication method thereof

Flexible contactless wire bonding structure and methodology for semiconductor device

Chip package and fabrication method thereof

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

Trenched mosfets with part of the device formed on a (110) crystal plane

Radio frequency identification tag, and method of manufacturing the same

Electronic component and manufacturing method thereof

Room temperature metal direct bonding

Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof

Manufacturing method of semiconductor device

Method for manufacturing semiconductor device

Flip chip cavity package

Sub-field enhanced global alignment

Wireless transmission system and wireless transmission method

Method for forming an electronic module having backside seal

Microstructure Apparatus, Manufacturing Method Thereof, and Sealing Substrate

Semiconductor device

Integrated circuit

Device under bonding pad using single metallization

Semiconductor device

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Electronic device and manufacturing method therefor

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

Method and package for circuit chip packaging

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Device including a ring-shaped metal structure and method

Electrically interconnected stacked die assemblies

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Variable feature interface that induces a balanced stress to prevent thin die warpage

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Embedded semiconductor die package and method of making the same using metal frame carrier

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Multiple substrate electrical circuit device

Package-level integrated circuit connection without top metal pads or bonding wire

Semiconductor device and method of manufacturing the same

Wafer level package having cylindrical capacitor and method of fabricating the same

Semiconductor chip attaching apparatus

Distributed computing

Method and apparatus for selectively placing components into a sleep mode in response to loss of one or more clock signals or receiving a command to enter sleep mode

Distributed computing

Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier

Structure and process for the formation of TSVs

Systems and methods to laminate passives onto substrate

Manufacturing method for integrating a shunt resistor into a semiconductor package

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

Edge connect wafer level stacking

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Self-assembly of chips on a substrate

SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE

Tie-bar configuration for leadframe type carrier strips

Distributed computing

INTERPOSER, MODULE, AND ELECTRONICS DEVICE INCLUDING THE SAME

Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

Distributed computing

Integrated circuit device and electronic equipment

Flip chip package for monolithic switching regulator

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Die stacking with an annular via having a recessed socket

Edge connect wafer level stacking

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

System-in-package with fan-out WLCSP

Bond pad design for reducing the effect of package stress

Semiconductor package substrate structure and manufacturing method thereof

Structures and methods for improving solder bump connections in semiconductor devices

Embedded laminated device

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Method of manufacturing a semiconductor device

Semiconductor device having an interposer

Semiconductor device including first and second carriers

NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Semiconductor device and manufacturing method thereof

Integrated circuit (IC) having TSVS with dielectric crack suppression structures

Wireless communication unit and semiconductor device having a power amplifier therefor

Method for manufacturing electronic device

Method for producing substrate for mounting device and method for producing a semiconductor module

Method of forming electrical connections

Stud bumps as local heat sinks during transient power operations

ANISOTROPIC PARTICLE-ARRANGED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

System-in packages

Integrated circuit device and electronic apparatus

RFID tag

Bond and probe pad distribution

Semiconductor device and programming method

Stacked semiconductor chips