Printed circuit board assembly

Chip mounter for recognizing BGA package through chip mounter

Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices

Method for fine-pitch, low stress flip-chip interconnect

Method of fabricating stacked wire bonded semiconductor package with low profile bond line

Bonded semiconductor structure and method of fabricating the same

Method of fabricating stacked semiconductor package with localized cavities for wire bonding

Laser optical path detection in integrated circuit packaging

Non-destructive laser optical integrated circuit package marking

SEMICONDUCTOR WITH TOP-SIDE WRAP-AROUND FLANGE CONTACT

Method of making an electronic device and electronic device substrate

INJECTION MOLDED METAL STIFFENER AND INTEGRATED CARRIER FOR PACKAGING APPLICATIONS

Semiconductor package with reduced inductive coupling between adjacent bondwire arrays

Transistor and routing layout for a radio frequency integrated CMOS power amplifier device

Injection molded metal stiffener for packaging applications

Microelectronic package with self-heating interconnect

Chip arrangement and method of manufacturing a chip arrangement

Securing integrated circuit dice to substrates

WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE

Stacked wire bonded semiconductor package with low profile bond line

Stacked semiconductor package with localized cavities for wire bonding

Backside mold process for ultra thin substrate and package on package assembly

Surface depressions for die-to-die interconnects and associated systems and methods

Through silicon via bridge interconnect

Coreless substrate package with symmetric external dielectric layers

Flip chip assembly process for ultra thin substrate and package on package assembly

Magnetic particle-based composite materials for semiconductor packages

System-in-package and manufacturing method of the same

Production of integrated circuit chip packages prohibiting formation of micro solder balls

Integrated circuit package system with locking terminal

Semiconductor package and manufacturing method thereof

Stacked integrated circuit package system with intra-stack encapsulation

Stacked integrated circuit package system

Semiconductor device and semiconductor integrated circuit

Integrated circuit package system stackable devices

Integrated circuit package system with conformal shielding and method of manufacture thereof

Method and apparatus of power ring positioning to minimize crosstalk

Semiconductor device and its manufacturing method

SYSTEM WITH RADIO FREQUENCY INTEGRATED CIRCUITS

Chip pad resistant to antenna effect and method

Method and apparatus providing an imager module with a permanent carrier

Fabrication of compact opto-electronic component packages

Wireless IC device and manufacturing method thereof

METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE

Arrangement for energy conditioning

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same

Method of interconnecting workpieces

TRANSPONDER INCORPORATED INTO AN ELECTRONIC DEVICE

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Wafer bonding apparatus

Method for manufacturing a semiconductor integrated circuit device

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Semiconductor chip having alignment mark and method of manufacturing the same

Semiconductor integrated circuit including plurality of bonding pads

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS

Conductive bump, method for producing the same, and electronic component mounted structure

Semiconductor package and method for manufacturing semiconductor package

Semiconductor die separation method

Heat-transfer structure

Pin substrate and package

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof

Integrated circuit package system with wire-in-film encapsulation

Die attach method and leadframe structure

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

High voltage device with constant current source and manufacturing method thereof

Semiconductor integrated circuit having terminal for measuring bump connection resistance and semiconductor device provided with the same

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION

Manufacturing method of a wiring substrate

Processes of making pad-less interconnect for electrical coreless substrate

Pressure sensing device package and manufacturing method thereof

Controlling warping in integrated circuit devices

METHODS OF SEPARATING INTEGRATED CIRCUIT CHIPS FABRICATED ON A WAFER

Manufacturing method of semiconductor device

Semiconductor package and manufacturing method thereof

Performing die-to-wafer stacking by filling gaps between dies

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

Printed circuit board including electronic component embedded therein and method of manufacturing the same

Light emitting elements, light emitting devices including light emitting elements and methods for manufacturing such light emitting elements and/or devices

Return loss techniques in wirebond packages for high-speed data communications

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE

Molded flip chip package with enhanced mold-die adhesion

Semiconductor package system with substrate having different bondable heights at lead finger tips

Method and apparatus for wafer level integration using tapered vias

Top layers of metal for high performance IC's

Circuitry component and method for forming the same

Semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Semiconductor device mounted on heat sink having protruded periphery

Method of forming stress relief layer between die and interconnect structure

Compliant wirebond pedestal

Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed

Integrated circuit package system with die and package combination

Ball grid array package stacking system

Integrated circuit package system with internal stacking module

Inductor module, silicon tuner module and semiconductor device

Interconnection of electronic devices with raised leads

Wireless IC device and component for wireless IC device

WIRE BONDING CAPILLARY TOOL HAVING MULTIPLE OUTER STEPS

Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold

Apparatus for mounting conductive balls

Bump structure for a semiconductor device and method of manufacture

Array-processed stacked semiconductor packages

System and Method for Thermal Optimized Chip Stacking

Compact multi-port cam cell implemented in 3D vertical integration

Method of making foil based semiconductor package

Integrated circuit package system for stackable devices

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Substrate including alignment columnar member and plural protection columnar members, and method of making the same

STACKED DIE PACKAGE

Semiconductor device and method of forming recessed conductive vias in saw streets

Semiconductor device and manufacturing method therefor

Printed circuit board comprising semiconductor chip and method of manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device having substrate with differentially plated copper and selective solder

Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof

Contact pads for silicon chip packages

Mountable integrated circuit package-in-package system

Packaged products, including stacked package modules, and methods of forming same

Semiconductor arrangement having specially fashioned bond wires

Semiconductor package fabricated by cutting and molding in small windows

Method and apparatus for thermally enhanced semiconductor package

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Integrated circuit packaging system with isolated pads and method of manufacture thereof

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of shielding semiconductor die from inter-device interference

Method of accessing semiconductor circuits from the backside using ion-beam and gas-etch

Low resistance integrated MOS structure

Semiconductor integrated circuit

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Structures & Methods for Combining Carbon Nanotube Array and Organic Materials as a Variable Gap Interposer for Removing Heat from Solid-State Devices

Techniques for arranging solder balls and forming bumps

Techniques for arranging solder balls and forming bumps

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPONENT MOUNTING STRUCTURE USING THE SAME

Printed circuit board including electronic component embedded therein and method of manufacturing the same

Method and system for composite bond wires

METHOD OF MANUFACTURING WIRING SUBSTRATE AND CHIP TRAY

Method of making electronic entities

Maskless Process for Solder Bumps Production

Integrated module for data processing system

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER

Method of forming a leaded molded array package

CMOS process for fabrication of ultra small or non standard size or shape semiconductor die

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

MANUFACTURING METHOD FOR A SILVER ALLOY BONDING WIRE AND PRODUCTS THEREOF

Wiring substrate and semiconductor package

Electronic apparatus

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

Bond pad structure located over active circuit structure

FLIP-CHIP INTERCONNECTION WITH FORMED COUPLINGS

Semiconductor device, and manufacturing method therefor

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Substrate for semiconductor package

High frequency interconnect pad structure

SEMICONDUCTOR DEVICE

WAFER LEVEL REDISTRIBUTION USING CIRCUIT PRINTING TECHNOLOGY

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

3-D ICs with microfluidic interconnects and methods of constructing same

Integrated circuit package module and method of the same

Semiconductor device including an LSI chip and a method for manufacturing the same

Semiconductor device and manufacturing method therefor

Stacked structure of integrated circuits having space elements

Package on package using a bump-less build up layer (BBUL) package

Package-on-package system with heat spreader

Flip-chip package with fan-out WLCSP

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Four mosfet full bridge module

Semiconductor package system with cut multiple lead pads

Leadframe having delamination resistant die pad

Methods of making an electronic component package and semiconductor chip packages

Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield

Bonding method for through-silicon-via based 3D wafer stacking

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Methods and devices for fabricating and assembling printable semiconductor elements

Transponder and method of producing a transponder

Method of manufacturing a printed wiring board with built-in electronic component

Linked Chip Attach And Underfill

Probe card assembly and kit, and methods of making same

Semiconductor chip and method for fabricating the same

METHOD OF RESIN ENCAPSULATION MOLDING FOR ELECTRONIC PART

Method of manufacturing a semiconductor device

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER

Combined metallic bonding and molding for electronic assemblies including void-reduced underfill

Method of manufacturing a semiconductor photodetector device by removing the semiconductor substrate on one surface after forming the light-transmitting layer on the opposing surface

Methods of making an environment protection coating system

Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display

Printed wiring board

Environmental protection coating system and method

Power supply network

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

Wirebondless wafer level package with plated bumps and interconnects

HERMETIC SEALING OF MICRO DEVICES

Structure and manufacturing method of chip scale package

Electronic device package and fabrication method thereof

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit package system with shield and tie bar

Packaging structure and method for fabricating the same

Chip Mounting Apparatus and Chip Mounting Method

Wafer Leveling-Bonding System Using Disposable Foils

Environmental protection coating system and method

POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING A METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM AND PRODUCTION METHOD OF A METAL-PLATING FORMED MATERIAL

Semiconductor package with a chip on a support plate

Method of packaging a semiconductor device and a prefabricated connector

Low-temperature wafer bonding of semiconductors to metals

Method of manufacturing a semiconductor structure

Semiconductor device and method of fabrication thereof

Double-sided monolithically integrated optoelectronic module with temperature compensation

Integrated circuit package having integrated faraday shield

Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry

Electronic apparatus with an electrical conductor in the form of a liquid and an electrical insulator with a light-curing property

ELECTRONIC DEVICE HAVING ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND METHODS OF FABRICATING THE SAME

Re-programmable modular power management circuit

Ball-bump bonded ribbon-wire interconnect

Semiconductor package featuring flip-chip die sandwiched between metal layers

Backend interconnect scheme with middle dielectric layer having improved strength

CONDUCTIVE STRUCTURE OF A CHIP

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device and method for manufacturing the same

Integrated circuit package system with slotted die paddle and method of manufacture thereof

ELASTICALLY DEFORMABLE INTEGRATED-CIRCUIT DEVICE

INTEGRATED CIRCUIT PACKAGE SYSTEM

Package system incorporating a flip-chip assembly

IC card

Semiconductor Device and a Method of Manufacturing the Same

Semiconductor device using lead frame

QFN Semiconductor package

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-DOWN ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Semiconductor device and method

Semiconductor device and manufacturing method thereof

Package structure of three-dimensional stacking dice and method for manufacturing the same

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

Anti-reflection structures for CMOS image sensors

Apparatus and system for miniature surface mount devices

Integrated circuit transponder, method of producing an integrated circuit and method of producing a transponder

FABRICATION METHOD OF IC INLET, ID TAG, ID TAG READER AND METHOD OF READING DATA THEREOF

Techniques for arranging solder balls and forming bumps

Wiring board

Method and Device for the Permanent Connection of Integrated Circuit To a Substrate

Method and apparatus for 3D interconnect

Formation of a through-electrode by inkjet deposition of resin pastes

Method of fabricating chip package

Double wafer carrier process for creating integrated circuit die with through-silicon vias and micro-electro-mechanical systems protected by a hermetic cavity created at the wafer level

Method and apparatus for facilitating proximity communication and power delivery

Proximity optical memory module having an electrical-to-optical and optical-to-electrical converter

METHOD OF ATTACHING AN INTEGRATED CIRCUIT CHIP TO A MODULE

Semiconductor chip bump connection apparatus and method

RELIABILITY WCSP LAYOUTS

Multi-chip package including component supporting die overhang and system including same

Semiconductor package having stepwise depression in substrate

Pad structure for 3D integrated circuit

Bonding pad sharing method applied to multi-chip module and apparatus thereof

Packaged electronic devices with face-up die having TSV connection to leads and die pad

IC device having low resistance TSV comprising ground connection

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTRATE INCLUDING DIE

Electrical contact structure having multiple metal interconnect levels staggering one another

CHIP SCALE SURFACE MOUNT PACKAGE FOR SEMICONDUCTOR DEVICE AND PROCESS OF FABRICATING THE SAME

Electronic component mounting apparatus and electronic component mounting method

Wirebonding method and apparatus

Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture

Substrate for mounting electronic component and electronic apparatus including the substrate

Method for performing a shelf lifetime acceleration test

Method and apparatus for electrostatic discharge protection using a temporary conductive coating

Modified chip attach process

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Methods for assembling thin semiconductor die

Apparatus and methods of forming an interconnect between a workpiece and substrate

Functional Unit And Method For The Production Thereof

Flexible device, flexible pressure sensor

Integrated circuit package and integrated circuit module

Semiconductor integrated circuit

Semiconductor component with improved contact pad and method for forming the same

High density memory device manufacturing using isolated step pads

Rectangular-shaped controlled collapse chip connection

Integrated circuit package on package system

Planar packageless semiconductor structure with via and coplanar contacts

Methods and designs for localized wafer thinning

Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining

SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS

Electronic packages

Semiconductor device package interconnections

Bond wire loop for high speed noise isolation

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Multi-chip discrete devices in semiconductor packages