Semiconductor device and method

OPTO-ELECTRONIC PACKAGE STRUCTURE HAVING SILICON-SUBSTRATE AND METHOD OF FORMING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME

Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging

Ultrahigh-Purity Copper and Process for Producing the Same, and Bonding Wire Comprising Ultrahigh-Purity Copper

Method for controlling warpage in redistributed chip packaging panels

Methods of making a radio frequency identification (RFID) tags

Semiconductor device and method of manufacturing the same

Thermal enhanced package

Semiconductor device

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Chip-based thermo-stack

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Manufacturing method of semiconductor device

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Rotary chip attach process

Optical head, optical information recording and reproducing device, and optical information system device

Printed circuit board having embedded RF module power stage circuit

Printed circuit board having embedded RF module power stage circuit

Liquid crystal display

Bridges for interconnecting interposers in multi-chip integrated circuits

Reduced inductance interconnect for enhanced microwave and millimeter-wave systems

Bonded semiconductor structure and method of making the same

Method of manufacturing an integrated circuit

Package structure for integrated circuit device and method of the same

Intermetallic diffusion block device and method of manufacture

High-contrast laser mark on substrate surfaces

Semiconductor device and method for manufacturing the same

Circuit device including rotated stacked die

Low voltage drop and high thermal performance ball grid array package

3-D stacking of active devices over passive devices

Heat extraction from packaged semiconductor chips, scalable with chip area

Inkjet printed leadframes

Electronic circuit device and method for manufacturing same

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device

Semiconductor device and manufacturing method thereof

Externally configurable integrated circuits

Solder mold plates used in packaging process and method of manufacturing solder mold plates

Multilayer printed wiring board

Process for Preparing a Solder Stand-Off

Method of mounting electronic circuit constituting member and relevant mounting apparatus

SEMICONDUCTOR DEVICES, INTEGRATED CIRCUIT PACKAGES AND TESTING METHODS THEREOF

Spring interconnect structures

Method for low temperature bonding and bonded structure

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Method for manufacturing semiconductor device

Leadframe package for MEMS microphone assembly

Thinned image sensor with trench-insulated contact terminals

Method of fabricating isolation structures for CMOS image sensor chip scale packages

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Semiconductor package with mechanical stress isolation of semiconductor die subassembly

Integrated circuit and method of fabricating the same

Low fabrication cost, fine pitch and high reliability solder bump

Chip package

Semiconductor module

Semiconductor device and method of forming vertical interconnect structure using stud bumps

SEMICONDUCTOR PACKAGE WITH STACKED DIE ASSEMBLY

SEMICONDUCTOR PACKAGE WITH LEAD INTRUSIONS

Wafer level integration package

Die stacking with an annular via having a recessed socket

Mounting method using thermocompression head

Inline integrated circuit system

Semiconductor device fabrication method

Semiconductor processing methods

Semiconductor device and method for manufacturing the same

Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board

Packaged system of semiconductor chips having a semiconductor interposer

DFN semiconductor package having reduced electrical resistance

COMPACT PACKAGING FOR POWER AMPLIFIER MODULE

Bonded structures formed by plasma enhanced bonding

Partially underfilled solder grid arrays

Integrated circuit package-on-package system with central bond wires

Apparatus and method for a chip assembly including a frequency extending device

Semiconductor chip with integrated via

Final via structures for bond pad-solder ball interconnections

Electronic Device and Method of Manufacturing Same

Semiconductor device and programming method

Stacked, interconnected semiconductor package

Method of making semiconductor devices employing first and second carriers

Semiconductor Package, Method for Manufacturing the Same, Semiconductor Module, and Electronic Device

Ultrasonic mounting apparatus

METHOD AND APPARATUS FOR RAPID THERMAL PROCESSING AND BONDING OF MATERIALS USING RF AND MICROWAVES

Interconnect structure including hybrid frame panel

Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking

Mounting device for a chip component

Method of fabricating bonding structure

Microwave Cure of Semiconductor Devices

METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE

Mounting apparatus, inspecting apparatus, inspecting method, and mounting method

Three chip package

Electronic modules and methods for forming the same

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Integrated circuit packaging system with warpage control system and method of manufacture thereof

RELIABILITY IMPROVEMENT IN A COMPOUND SEMICONDUCTOR MMIC

LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

Semiconductor device and method of manufacturing the same

Semiconductor device package having features formed by stamping

Leadframe for packaged electronic device with enhanced mold locking capability

Method of forming a semiconductor package and structure therefor

Curing low-k dielectrics for improving mechanical strength

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

Circuit Device and Method for Manufacturing the Circuit Device

Interposers, electronic modules, and methods for forming the same

Method for bonding metallic terminals by using elastic contact

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Linked chip attach and underfill

Adhesive Composition, Adhesive Sheet and Production Method of Semiconductor Device

Adhesive composition, adhesive sheet and production method of semiconductor device

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS AND ITS METHOD OF MANUFACTURE

Electro-optic integrated circuits and methods for the production thereof

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Method and system for inter-chip communication via integrated circuit package waveguides

Module substrate including optical transmission mechanism and method of producing the same

Semiconductor device and semiconductor integrated circuit

Semiconductor device including multi-chip

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Method for manufacturing multilayer printed wiring board

Thermal interface material for combined reflow

Power Device Substrates and Power Device Packages Including the Same

Flat magnetic element and power IC package using the same

Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Semiconductor device having low dielectric constant film and manufacturing method thereof

Substrate, manufacturing method thereof, method for manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method of semiconductor device

Mock bump system for flip chip integrated circuits

Mock bump system for flip chip integrated circuits

Enhanced thermal dissipation ball grid array package

Integrated circuit package system with planar interconnect

System and method of forming a wafer scale package

Flip chip interconnection structure with bump on partial pad and method thereof

Semiconductor device package

Power Device Packages Having Thermal Electric Modules Using Peltier Effect and Methods of Fabricating the Same

Integrated circuit package system with rigid locking lead

Electronic system modules and method of fabrication

Stacked integrated circuit package system

Stacked integrated circuit package system

Integrated circuit package system with stacking module

Integrated circuit package system with support structure under wire-in-film adhesive

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES

Mountable integrated circuit package system with substrate

Mountable integrated circuit package system with exposed external interconnects

Semiconductor device and method for manufacturing semiconductor device

Method and apparatus for a package having multiple stacked die

IC TAG AND MANUFACTURING METHOD OF THE SAME

Leadframe, semiconductor packaging structure and manufacturing method thereof

I/O connection scheme for QFN leadframe and package structures

Structure for reduction of soft error rates in integrated circuits

INTEGRATED CONDUCTIVE SHIELD FOR MICROELECTRONIC DEVICE ASSEMBLIES AND ASSOCIATED METHODS

Through hole vias at saw streets including protrusions or recesses for interconnection

Capacitive isolation circuitry with improved common mode detector

METHOD AND TOOL FOR REPOSITIONING SOLDER FILL HEAD

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Device interconnects

Method for manufacturing a multilayer printed wiring board for providing an electronic component therein

Method of manufacturing an embedded printed circuit board

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT

Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers

Bump bonding method

IC PACKAGING PROCESS

Methods for a multiple die integrated circuit package

Method of forming an interconnect on a semiconductor substrate

Method for manufacturing microelectronic devices

Method for manufacturing package structure of optical device

Component built-in wiring board

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Flip chip interconnection system having solder position control mechanism

Integrated circuit package system with stacking module

Integrated circuit package system for stackable devices

Package-on-package system with via Z-interconnections

Integrated circuit package system with support structure for die overhang

Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Wire bonding over active circuits

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding

Microelectronic devices

Semiconductor device packages and assemblies

Ball grid array package system

THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE

Stackable integrated circuit package system

PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Integrated circuit packaging system with package-in-package and method of manufacture thereof

Integrated circuit package system with step mold recess

Package-on-package system with internal stacking module interposer

SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER

Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit

IC PACKAGE HAVING REDUCED THICKNESS

Method of making and designing lead frames for semiconductor packages

COL SEMICONDUCTOR PACKAGE

Integrated circuit package system with isloated leads

Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement

Wire bond and redistribution layer process

SEMICONDUCTOR DEVICE WITH CAPACITOR

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Wafer level IC assembly method

Rigid-flexible printed circuit board manufacturing method for package on package

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE

Electric power conversion apparatus

Broadband Power Amplifier with A High Power Feedback Structure

Micro electro mechanical system, semiconductor device, and manufacturing method thereof

Method of post-mold grinding a semiconductor package

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor integrated circuit device

WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS

Bump-on-lead flip chip interconnection

Semiconductor package and multi-chip package using the same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Mounted body and method for manufacturing the same

Semiconductor package structure with heat sink

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING FACE-UP ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Semiconductor die package including embedded flip chip

Semiconductor die package including multiple semiconductor dice

Semiconductor module

System for solder ball inner stacking module connection

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof

Support mounted electrically interconnected die assembly

Method for producing a semiconductor device and the semiconductor device

Stress Mitigation in Packaged Microchips

Semiconductor Device

Semiconductor die package including IC driver and bridge

Integrated circuit package system with integration port

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Device for mounting electric component

Wiring board having solder bump and method for manufacturing the same

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Bump forming method and bump forming apparatus

Method of forming an inlay substrate having an antenna wire

Dicing tape and die attach adhesive with patterned backing

Semiconductor module

Inductor and electric power supply using it

Inductor and electric power supply using it

Methods of fabricating a composite carbon nanotube thermal interface device

Multi-Chips Module Package Structure and the Method thereof

Method of fabricating semiconductor components with through interconnects

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Wafer level die integration and method therefor

Integrated circuit with step molded inner stacking module package in package system

Integrated circuit package system with stacked devices

Optical semiconductor device having pre-molded leadframe with window and method therefor

Chip package with a dam structure on a die pad

Semiconductor package with mold lock vent

Semiconductor device with wire-bonding on multi-zigzag fingers

Protection for bonding pads and methods of formation

Semiconductor circuit and method of fabricating the same

Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD

Semiconductor component with regions electrically insulated from one another and method for making a semiconductor component

Lead frame isolation using laser technology

Electronic component mounting method

Method of a package on package packaging

Method of manufacturing wiring board having a semiconductor thereon

Electrochemical cell and fabrication method of the same

Method of forming a metal bump on a semiconductor device

Packaging an integrated circuit die using compression molding

Method of manufacturing a semiconductor device

Semiconductor integrated circuit device

Methods for bonding and micro-electronic devices produced according to such methods

Wafer-level integrated circuit package with top and bottom side electrical connections

Flip chip semiconductor assembly with variable volume solder bumps

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

Semiconductor chip with passivation layer comprising metal interconnect and contact pads

Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween

Semiconductor module and method of producing the same

Semiconductor device

SEMICONDUCTOR CHIP

Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor IC-embedded substrate and method for manufacturing same

Semiconductor module

Double-side mountable MEMS package

Power device package and method of fabricating the same

Power device package and method of fabricating the same

Device comprising electrode pad

System for forming a micro-assembler

Built-in method of thermal dissipation layer for driver IC substrate and structure thereof

METHOD FOR FORMING SOLDER LUMPS ON PRINTED CIRCUIT BOARD SUBSTRATE

ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRODUCTION EQUIPMENT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method

Package having exposed integrated circuit device

Manufacturing method of resin-sealed semiconductor device

Board on chip package and method of manufacturing the same

Alignment method of two substrates by microcoils

Fabrication method of semiconductor device

Capacitive isolation circuitry

Integrated circuit nanotube-based subsrate

Semiconductor device

Integrated doherty type amplifier arrangement with high power efficiency

Integrated circuit package substrate having configurable bond pads