212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#2402Stacked packaged integrated circuit devices, and methods of making same
#2403Method of manufacturing a semiconductor device
#2404Method for fabricating packaging structure having embedded semiconductor element
#24053D semiconductor package interposer with die cavity
#2406Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#2407GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH
#2408Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof
#2409Embedded capacitor module
#2410Method of manufacturing a semiconductor component
#2411Integrated circuit chip using top post-passivation technology and bottom structure technology
#2412Adaptive patterning for panelized packaging
#2413Methods and apparatus for solder on slot connections in package on package structures
#2414Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
#2415Packaged integrated device die between an external and internal housing
#2416Semiconductor chip package having via hole and semiconductor module thereof
#2417Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die
#2418Eutectic bonding of thin chips on a carrier substrate
#2419Semiconductor device
#2420Semiconductor component that includes a protective structure
#2421Semiconductor device including a stress buffer material formed above a low-k metallization system
#2422Room temperature metal direct bonding
#2423Protection layer for adhesive material at wafer edge
#2424Chip-integrated through-plating of multi-layer substrates
#2425Mechanisms for forming connectors with a molding compound for package on package
#2426High density sensor array without wells
#2427Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2428Misalignment detection devices
#2429Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP
#2430Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die
#2431Package-in-package using through-hole via die on saw streets
#2432Methods and apparatus for measuring analytes using large scale FET arrays
#2433Underfill device and method
#2434Multilayer printed wiring board
#2435Packaging methods for semiconductor devices
#2436Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2437Packaged integrated circuit using wire bonds
#2438Packaged microdevices and methods for manufacturing packaged microdevices
#2439Processes and structures for IC fabrication
#2440Semiconductor substrate and semiconductor chip
#2441Semiconductor device and method of manufacturing the same
#2442Sawing underfill in packaging processes
#2443Molding method for COB-EUSB devices and metal housing package
#2444Method of fabricating a circuit board structure
#2445Data storage and stackable chip configurations
#2446Semiconductor device and method of forming an inductor on polymer matrix composite substrate
#2447Electronic assembly
#2448Integrated circuit package and method of assembling an integrated circuit package
#2449Power semiconductor device with reduced contact resistance
#2450Semiconductor device and bump formation process
#2451Chip package structure
#2452Integrated passive devices
#2453Manufacturing method and electronic module with new routing possibilities
#2454Semiconductor device and method for manufacturing the same
#2455Method of fabricating a packaged semiconductor
#2456Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices
#2457Integrated circuit device
#2458COMPOSITE ALLOY BONDING WIRE
#2459Window clamp top plate for integrated circuit packaging
#2460Module including a discrete device mounted on a DCB substrate
#2461MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#2462Chip on wafer bonder
#2463Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#2464Semiconductor package
#2465Substrate with embedded stacked through-silicon via die
#2466Semiconductor device
#2467Semiconductor package having internal shunt and solder stop dimples
#2468Wafer level package having cylindrical capacitor and method of fabricating the same
#2469Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers
#2470Flip chip package utilizing trace bump trace interconnection
#2471Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
#2472Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#2473Microelectronic package with self-heating interconnect
#2474Semiconductor device and methods of manufacturing semiconductor devices
#2475INTERPOSER AND SEMICONDUCTOR PACKAGE WITH NOISE SUPPRESSION FEATURES
#2476Metallization structure for high power microelectronic devices
#2477Integrated circuit having staggered bond pads and I/O cells
#2478Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#2479Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
#2480Semiconductor device and manufacturing method thereof
#2481Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#2482Defected ground plane inductor
#2483Method of connecting to a monolithic voltage regulator
#2484Flexible interconnect pattern on semiconductor package
#2485Circuit component and method of making the same
#2486Display panel
#2487Semiconductor device with wireless communication
#2488Packaging structural member
#2489Method for developing a custom device
#2490Through-silicon via with low-K dielectric liner
#2491Embedded memory and dedicated processor structure within an integrated circuit
#2492Methods of manufacturing semiconductor device assemblies including face-to-face semiconductor dice
#2493COF packaging unit and COF packaging tape
#2494Apparatus for electrostatic discharge protection and noise suppression in circuits
#2495System in package process flow
#2496Through via package
#2497Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief
#2498MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT
#2499Sensor device manufacturing method and sensor device
#2500Large panel leadframe
#2501Interconnect structures and methods of making the same
#2502Low-profile wireless connectors
#25033D-IC interposer testing structure and method of testing the structure
#2504Package on package devices and methods of packaging semiconductor dies
#2505SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
#2506Structure for hermetic encapsulation of a device and an electronic component
#2507Compact wirebonded power quad flat no-lead (PQFN) package
#25083D chip package with shielded structures
#2509Multiple die stacking for two or more die
#2510Semiconductor device with sealing resin
#2511Support mounted electrically interconnected die assembly
#2512Chamfered corner crackstop for an integrated circuit chip
#2513Wafer level packaging of semiconductor chips
#2514WAFER LEVEL APPLIED RF SHIELDS
#2515Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#2516Integrated circuit with a self-programmed identification key
#2517Electrical device with protruding contact elements and overhang regions over a cavity
#2518Interposer for ESD, EMI, and EMC
#2519Device having wirelessly enabled functional blocks
#2520Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
#2521Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#2522Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
#2523Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
#2524METHOD OF REPAIRING PROBE PADS
#2525Wireless communication with dielectric medium
#2526Method of sealing and contacting substrates using laser light and electronics module
#2527Systems and methods for lowering interconnect capacitance
#2528Method of fabricating a semiconductor test probe head
#2529Semiconductor device
#2530Device including a semiconductor chip and metal foils
#2531Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
#2532Method of manufacturing an electronic device package
#2533Method and structure of monolithically integrated ESD supperssion device
#2534Semiconductor integrated circuit device and method of manufacturing same
#2535Printed circuit board including under-fill dam and fabrication method thereof
#2536Method of repairing probe pads
#2537Multi-chip packages providing reduced signal skew and related methods of operation
#2538Chip arrangement and method for producing a chip arrangement
#2539Semiconductor structure and method for making same
#2540System and method for 3D integrated circuit stacking
#2541Semiconductor package with improved pillar bump process and structure
#2542De-pop on-device decoupling for BGA
#2543Packaging methods and structures for semiconductor devices
#2544Electronic device package
#2545Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
#2546Semiconductor device and manufacturing method of the same
#2547Semiconductor device
#2548METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR
#2549MANUFACTURING METHOD OF PACKAGE CARRIER
#2550Method of manufacturing esterified substance
#2551Routing for a package antenna
#2552Semiconductor device and method of manufacturing the same
#2553Method for manufacturing a package-on-package type semiconductor device
#2554Method and a system for producing a semi-conductor module
#2555Electronic component and method for producing same
#2556Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#2557Pillar structure having a non-planar surface for semiconductor devices
#2558ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#2559Inductive loop formed by through silicon via interconnection
#2560Electronic circuit device
#2561DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME
#2562Method for manufacturing a circuit device
#2563Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
#2564Circuit module
#2565Synchronizing global clocks in 3D stacks of integrated circuits by shorting the clock network
#2566Core circuitry, input and output buffers, and four bypass switches
#2567STACKING METHOD AND STACKING CARRIER
#2568Semiconductor chip device with solder diffusion protection
#2569STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#2570Packaging DRAM and SOC in an IC package
#2571Die-to-die gap control for semiconductor structure and method
#2572Self-aligned protection layer for copper post structure
#2573Wiring board having an engineered metallization layer
#2574Chip on leads
#2575Method for fabricating electronic device package
#2576Method and apparatus for fabricating integrated circuit device using self-organizing function
#2577SYSTEM WITH A DEFECT TOLERANT CONFIGURABLE IC
#2578Semiconductor device
#2579Semiconductor device
#2580Chip package and method for forming the same
#2581MEMS device having chip scale packaging
#2582METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS
#2583Method for permanent connection of two metal surfaces
#2584Semiconductor package and method of fabricating the same
#2585Semiconductor device
#2586Aligned multiple emitter package
#2587Atomic layer deposition encapsulation for power amplifiers in RF circuits
#2588Conductive routings in integrated circuits using under bump metallization
#2589Semiconductor package with under bump metallization routing
#2590STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS
#2591Structure and method for power field effect transistor
#2592Method for assembling at least one chip using a fabric, and fabric including a chip device
#2593Multilayer printed circuit board
#2594Stackable integrated circuit package system
#2595Routing layer for mitigating stress in a semiconductor die
#2596Packaged microelectronic elements having blind vias for heat dissipation
#2597Method and system for forming conductive bumping with copper interconnection
#2598TCE compensation for package substrates for reduced die warpage assembly
#2599Interposer and electronic device using the same
#2600Power semiconductor chip having two metal layers on one face
#2601Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
#2602Manufacturing method for semiconductor device
#2603Wafer-level chip scale package
#2604Flip chip interconnection having narrow interconnection sites on the substrate
#2605PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#2606Method of computing a width of a scribe region based on a bonding structure that extends into the scribe reigon in a wafer-level chip scale (WLCSP) packaging
#2607Dual metal for a backside package of backside illuminated image sensor
#2608Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
#2609Foil plating for semiconductor packaging
#2610Copper column
#2611Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#2612Package structure with electronic component and method for manufacturing same
#2613Composition of a solder, and method of manufacturing a solder connection
#2614Semiconductor device and structure
#2615Semiconductor device and a method of manufacturing the same
#2616Pillar design for conductive bump
#2617Thin foil semiconductor package
#2618Void-Free Implantable Hermetically Sealed Structures
#2619Methods and apparatus for measuring analytes using large scale FET arrays
#2620Manufacturing method of semiconductor device and semiconductor device
#2621Integrated antennas in wafer level package
#2622METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#2623PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTS
#2624Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#2625Semiconductor device having through electrode and method of fabricating the same
#2626Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking
#2627Solder bump with inner core pillar in semiconductor package
#2628Semiconductor device with solder bump formed on high topography plated Cu pads
#2629Ball grid array with improved single-ended and differential signal performance
#2630SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
#2631Method of forming an inductor on a semiconductor wafer
#2632Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
#2633Methods and apparatus for measuring analytes using large scale FET arrays
#2634Methods and apparatus for measuring analytes using large scale FET arrays
#2635Method of forming a package substrate
#2636Method of producing laminated device
#2637Stackable semiconductor assemblies and methods of manufacturing such assemblies
#2638Thermal enhanced package
#2639Laminate electronic device
#2640Carrier structures for microelectronic elements
#2641Circuit board and process for producing the same
#2642RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING SAME
#2643Chip package with coplanarity controlling feature
#2644Stacked memory layers having multiple orientations and through-layer interconnects
#2645SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#2646SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#2647SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#2648Semiconductor device including a contact clip having protrusions and manufacturing thereof
#2649Ball-limiting-metallurgy layers in solder ball structures
#2650Corles multi-layer circuit substrate with minimized pad capacitance
#2651Method of manufacturing a circuit substrate
#2652Methods of forming a metal pattern
#2653Method of fabricating semiconductor package having substrate with solder ball connections
#2654Wafer Level Package For Heat Dissipation And Method Of Manufacturing The Same
#2655Semiconductor device and method for manufacturing the same
#2656Four MOSFET full bridge module
#2657Coreless multi-layer circuit substrate with minimized pad capacitance
#2658Light emitting elements, light emitting devices including light emitting elements and methods of manufacturing such light emitting elements and/or device
#2659Semiconductor device and manufacturing method thereof
#2660Multi-layer interconnect structure for stacked dies
#2661Semiconductor constructions
#2662Multi-component integrated circuit contacts
#2663Stack package having flexible conductors
#2664Copper wire receiving pad
#2665Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#2666Method of manufacturing an electronic system
#2667Backside-illuminated image sensor having a supporting substrate
#2668Semiconductor device
#2669Connecting film, and joined structure and method for producing the same
#2670Method for Predetermined Component Placement to a Target Platform
#2671Method for retaining a device to a substrate
#2672Method for Predetermined Component Placement to a Target Platform
#2673Method for manufacturing a through hole electrode substrate
#2674Methods for controlling wafer curvature
#2675Through wafer vias and method of making same
#2676Fabrication method of semiconductor integrated circuit device
#2677Low-noise flip-chip packages and flip chips thereof
#2678SEMICONDUCTOR DEVICE WITH ENCAPSULATED ELECTRICAL CONNECTION ELEMENTS AND FABRICATION PROCESS THEREOF
#2679Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#2680Techniques for modular chip fabrication
#2681Enhanced WLP for superior temp cycling, drop test and high current applications
#2682STACKED SEMICONDUCTOR DEVICE
#2683Externally Wire Bondable Chip Scale Package in a System-in-Package Module
#2684Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die
#2685Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#2686Silicon carrier optoelectronic packaging
#2687Secondary device integration into coreless microelectronic device packages
#2688ELECTROPLATED LEAD-FREE BUMP DEPOSITION
#2689HEAT DISSIPATING STRUCTURE AND MANUFACTURE THEREOF
#2690Defect free deep trench method for semiconductor chip
#2691MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
#2692Die backside standoff structures for semiconductor devices
#2693Semiconductor device and manufacturing of the semiconductor device
#2694Semiconductor device with heat spreader
#2695Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#2696Method for wafer level packaging of electronic devices
#2697Manufacturing method including deformation of supporting board to accommodate semiconductor device
#2698Methods and apparatus for measuring analytes using large scale FET arrays
#2699Electromagnetic shielding structures for selectively shielding components on a substrate
#2700Electrostatic discharge protection for modular equipment