212576 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type Integrated circuits
Semiconductor device including DC-DC converter
#2102Chip package and method for forming the same
#2103SYSTEMS AND METHODS FOR VOID REDUCTION IN A SOLDER JOINT
#2104Chip package
#2105Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#2106Wafer backside interconnect structure connected to TSVs
#2107Hybrid-integrated photonic chip package with an interposer
#2108Hybrid-integrated photonic chip package with an interposer
#2109Method of making an electronic device having a liquid crystal polymer solder mask and related devices
#2110Stackable package by using internal stacking modules
#2111Semiconductor device and method of forming high routing density interconnect sites on substrate
#2112Semiconductor device and electronic device having the same
#2113Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#2114Integrated circuit package including embedded thin-film battery
#2115Semiconductor device, substrate and semiconductor device manufacturing method
#2116Semiconductor device including a DC-DC converter
#2117Wafer backside interconnect structure connected to TSVs
#2118Semiconductor device and a method of manufacturing the same
#2119Semiconductor device, semiconductor package, and electronic system
#2120Electrical system and core module thereof
#2121Wafer level array of chips and method thereof
#2122Lead and lead frame for power package
#2123Materials, structures and methods for microelectronic packaging
#2124Detection of defective electrical connections
#2125Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus
#2126Resin-sealed semiconductor device and associated wiring and support structure
#2127Arrangement for energy conditioning
#2128Solder joint flip chip interconnection
#2129Hybrid carbon-metal interconnect structures
#2130Carrier tape for tab-package and manufacturing method thereof
#2131Micro device transfer head heater assembly and method of transferring a micro device
#2132System and method of sensing current in a power semiconductor device
#2133Method for manufacturing semiconductor devices having a metallisation layer
#2134Microelectronic devices and methods for filling vias in microelectronic devices
#2135Semiconductor device and method of forming PIP with inner known good die interconnected with conductive bumps
#2136Chip diode and diode package
#2137Semiconductor device
#2138Method of manufacturing semiconductor device
#2139Power module having stacked flip-chip and method for fabricating the power module
#2140Laser die backside film removal for integrated circuit (IC) packaging
#2141Three-dimensional semiconductor architecture
#2142Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#2143Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect
#2144Capacitor using barrier layer metallurgy
#2145Semiconductor device and method of forming an inductor on polymer matrix composite substrate
#21463D shielding case and methods for forming the same
#2147Integrated circuit device and electronic apparatus
#2148Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#2149Semiconductor chip with modified regions for dividing the chip
#2150Bonding structures and methods of forming the same
#2151Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
#2152Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product
#2153Pad defined contact for wafer level package
#2154Method and apparatus for printing integrated circuit bond connections
#2155Electromagnetic interference enclosure for radio frequency multi-chip integrated circuit packages
#2156Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#2157Method and apparatus for constructing an isolation capacitor in an integrated circuit
#2158Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure
#2159Multi-chip package having a substrate with a plurality of vertically embedded die and a process of forming the same
#2160Printed circuit board
#2161Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus
#2162Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#2163Solder in cavity interconnection technology
#2164Multilayer wiring board for an electronic device
#2165Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#2166Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#2167Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#2168Window ball grid array (BGA) semiconductor packages
#2169Multiple bonding layers for thin-wafer handling
#2170Current sensors and methods
#2171Semiconductor package and method of forming the same
#2172Tape package and flat panel display device including the same
#2173Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers
#2174Front side copper post joint structure for temporary bond in TSV application
#2175System in package (SIP) with dual laminate interposers
#2176Isolation structure for stacked dies
#2177Semiconductor module system having encapsulated through wire interconnect (TWI)
#2178Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#2179Structure and method of forming a pad structure having enhanced reliability
#2180Method for forming a thin semiconductor device
#2181Method of making a system-in-package device
#21823D semiconductor package interposer with die cavity
#2183Semiconductor device and method of forming conductive vias with trench in saw street
#2184Wafer leveled chip packaging structure and method thereof
#2185Electrical connectivity of die to a host substrate
#2186Pre-soldered leadless package
#2187Circuit module and method of manufacturing the same
#2188Organic module EMI shielding structures and methods
#2189Copper-based alloy wire and methods for manufaturing the same
#2190Method for low temperature bonding and bonded structure
#2191Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#2192Finger sensor including encapsulating layer over sensing area and related methods
#2193Method of forming a power module with a magnetic device having a conductive clip
#2194Power MOSFETs with improved efficiency for multi-channel class D audio amplifiers and packaging therefor
#2195Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core
#2196Interconnection designs and materials having improved strength and fatigue life
#2197Chip package and method for forming the same
#2198Semiconductor device having a bonding pad and shield structure and method of manufacturing the same
#2199Microelectronic assembly having a heat spreader for a plurality of die
#2200Extended redistribution layers bumped wafer
#2201Die package structure
#2202Multi-chip package and interposer with signal line compression
#2203Method of manufacturing semiconductor device
#2204Integrated circuit package
#2205Stacked half-bridge package
#22063D IC method and device
#2207Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip
#2208Voltage noise reduction through co-layouts of multilayer ceramic capacitors and solid electrolytic polymer capacitors
#2209Three-dimensional structure in which wiring is provided on its surface
#2210Ultrathin buried die module and method of manufacturing thereof
#2211Semiconductor device and microphone
#2212Three-dimensional structure for wiring formation
#2213Polymer matrices for polymer solder hybrid materials
#2214Film for flip chip type semiconductor back surface and its use
#2215Packaged microelectronic elements having blind vias for heat dissipation
#2216Apparatus and methods for reducing impact of high RF loss plating
#2217Edge coupling alignment using embedded features
#2218Semiconductor wiring patterns
#2219Routing layer for mitigating stress in a semiconductor die
#2220Semiconductor device
#2221Semiconductor die package and method for making the same
#2222Leadframe-type semiconductor package having EMI shielding layer connected to ground
#2223Multiple bonding layers for thin-wafer handling
#2224Method for top-side cooled semiconductor package with stacked interconnection plates
#2225Chip package and method for forming the same
#2226Method of manufacturing chip-stacked semiconductor package
#2227Methods for attachment and devices produced using the methods
#2228Test structures for post-passivation interconnect
#2229Apparatus for mounting semiconductor chips on a circuit board
#2230Carrier tape for tab-package and manufacturing method thereof
#2231Thermoset polymides for microelectronic applications
#2232Method of manufacturing a semiconductor device using markings on both lead frame and sealing body
#2233Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
#2234Tamper-resistant coating for an integrated circuit
#2235Semiconductor device and production method therefor
#2236Semiconductor device and method for producing the same
#2237Semiconductor device and semiconductor package containing the same
#2238Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#2239Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#2240Semiconductor device with copper-tin compound on copper connector
#2241Plasma treatment for semiconductor devices
#2242Semiconductor device and method for manufacturing the same
#2243Method for fabricating a semiconductor and semiconductor package
#2244Embedded semiconductor die package and method of making the same using metal frame carrier
#2245Packaged semiconductor assemblies and methods for manufacturing such assemblies
#2246Memory device, laminated semiconductor substrate and method of manufacturing the same
#2247Laminate electronic device
#2248Semiconductor device and manufacturing method thereof
#2249Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#2250Semiconductor device having electrode pads arranged between groups of external electrodes
#2251Semiconductor device and method of confining conductive bump material with solder mask patch
#2252Active area bonding compatible high current structures
#2253Inductor with conductive trace
#2254Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support
#2255Semiconductor dies with reduced area consumption
#2256Routing layer for mitigating stress in a semiconductor die
#2257Packaging devices, methods of manufacture thereof, and packaging methods
#2258Module comprising a semiconductor chip
#2259Semiconductor device and a method of manufacturing the same
#2260Semiconductor device and production method therefor
#2261Cylindrical embedded capacitors
#2262Self-aligned protection layer for copper post structure
#2263Semiconductor device and a method of manufacturing the same
#2264Alkali silicate glass based coating and method for applying
#2265Techniques for packaging multiple device components
#2266Stacked multi-chip integrated circuit package
#2267Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#2268Method for manufacturing printed wiring board and printed wiring board
#2269Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#2270Linked semiconductor module unit and electronic circuit-integrated motor device using same
#2271Noise attenuation wall
#2272Semiconductor device including semiconductor chip mounted on lead frame
#2273Semiconductor chip and film and tab package comprising the chip and film
#2274Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer
#2275Semiconductor device
#2276Compliant printed circuit semiconductor package
#2277Method for manufacturing package structure with electronic component
#2278Device mounting board, semiconductor module, and method for fabricating the device mounting board
#2279Heat sinking and electromagnetic shielding structures
#2280Integrated circuit device
#2281Post passivation interconnect structures and methods for forming the same
#2282Three-dimensional integrated circuit device using a wafer scale membrane
#2283Semiconductor device having low dielectric insulating film and manufacturing method of the same
#2284Chip package and manufacturing method thereof
#2285Stacked semiconductor devices including a master device
#2286Electronic substrate, semiconductor device, and electronic device
#2287Extrusion-resistant solder interconnect structures and methods of forming
#2288Integrated electronic device with transceiving antenna and magnetic interconnection
#2289Double solder bumps on substrates for low temperature flip chip bonding
#2290Electronic system modules and method of fabrication
#2291Method for manufacturing a circuit board structure
#2292Chip package
#2293Semiconductor device with copper wirebond sites and methods of making same
#2294Stacked dual chip package having leveling projections
#2295Flexible sized die for use in multi-die integrated circuit
#2296Stacked microelectronic assembly with TSVS formed in stages with plural active chips
#2297Semiconductor package for high power devices
#2298Semiconductor device and method of manufacturing the same
#2299Waterproof structure of pad, waterproof pad, and method for forming waterproof structure
#2300Method for packaging circuits
#2301Semiconductor device
#2302Apparatus, system, and method for wireless connection in integrated circuit packages
#2303Semiconductor device and method of manufacturing the same
#2304Microelectronic devices and methods for manufacturing microelectronic devices
#2305Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#2306Embedded package security tamper mesh
#2307Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages
#2308Semiconductor seal ring
#2309High-frequency device including high-frequency switching circuit
#2310Systems and methods for integrating radio-frequency identification circuitry into flexible circuits
#2311Routing method for flip chip package and apparatus using the same
#2312Interlayer filler composition for three-dimensional integrated circuit
#2313Semiconductor device with embedded interconnect pad
#2314Semiconductor package with single sided substrate design and manufacturing methods thereof
#2315Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#2316Chip packages having dual DMOS devices with power management integrated circuits
#2317Apparatus and method for harvesting energy in an electronic device
#2318Methods for flip chip stacking
#2319Multilayer ceramic electronic device and method for manufacturing the same
#2320Hybrid computing module
#2321Semiconductor device and method of forming bump-on-lead interconnection
#2322Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material
#2323Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
#2324Waveguide integration on laser for alignment-tolerant assembly
#2325Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#2326Interposer and semiconductor package with noise suppression features
#2327Semiconductor structure with thin film resistor and terminal bond pad
#2328Microelectronic package having direct contact heat spreader and method of manufacturing same
#2329Electronic assembly with detachable components
#2330Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#2331Integrated circuit packages and methods for forming the same
#2332Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection
#2333Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#2334Semiconductor device with output circuit and pad
#2335Methods and apparatus for measuring analytes using large scale FET arrays
#2336Three-dimensional integrated structure comprising an antenna
#2337Apparatus, system, and method for wireless connection in integrated circuit packages
#2338Bumpless build-up layer package design with an interposer
#2339Method for manufacturing printed circuit boards
#2340Method of making a stacked microelectronic package
#2341Electronic modules
#2342Through-hole electrode substrate
#2343Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof
#2344Chip arrangement and method for producing a chip arrangement
#2345Electronic device and method for production
#2346Bump-on-lead flip chip interconnection
#2347Semiconductor device and a method of manufacturing the same
#2348Method of manufacturing electronic device and electronic device
#2349Bead for 2.5D/3D chip packaging application
#2350Chip package and method for forming the same
#2351Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects
#2352Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package
#2353Embedded 3D interposer structure
#2354Integrated chip package structure using ceramic substrate and method of manufacturing the same
#2355Multi-chip package with offset die stacking and method of making same
#2356Integrated circuit apparatus, systems, and methods
#2357Via structure for three-dimensional circuit integration
#2358Chip package and method for forming the same
#2359Microelectronic workpieces and methods for manufacturing microelectronic devices using such workpieces
#2360Bump structure for stacked dies
#2361Protected solder ball joints in wafer level chip-scale packaging
#2362Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact
#2363Semiconductor device and method of forming through vias with reflowed conductive material
#2364Microelectronic wireless transmission device
#2365Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
#2366Semiconductor package with embedded die
#2367Stacked semiconductor packages
#2368Printed wiring board and method for manufacturing printed wiring board
#2369Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
#2370Method of manufacturing leadless integrated circuit packages having electrically routed contacts
#2371Interconnection element with posts formed by plating
#2372Circuit device and method for manufacturing same
#2373Semiconductor device and method of forming a thin wafer without a carrier
#2374Glass frit wafer bond protective structure
#2375Semiconductor module with a semiconductor chip and a passive component and method for producing the same
#2376SYSTEM IN PACKAGE MODULE ASSEMBLY
#2377Semiconductor device fabrication method capable of scribing chips with high yield
#2378Stacked interconnect heat sink
#2379Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#2380Method for producing a component and device comprising a component
#2381Chip pad resistant to antenna effect and method
#2382Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
#2383SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION
#2384Leadless array plastic package with various IC packaging configurations
#2385Packaged semiconductor die with bumpless die-package interface for bumpless build-up layer (BBUL) packages
#2386Methods and apparatus for package on package devices with reversed stud bump through via interconnections
#2387Semiconductor test and monitoring structure to detect boundaries of safe effective modulus
#23883D packaging with low-force thermocompression bonding of oxidizable materials
#2389Etching solution for copper or copper alloy
#2390Indium compositions
#2391Semiconductor packages and methods of fabricating the same
#2392Semiconductor device and method of manufacturing the semiconductor device
#2393RFID tags and processes for producing RFID tags
#2394METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT SYSTEM WITH INTERCONNECTED STACKED DEVICE WAFERS
#2395Semiconductor integrated circuit device having an NMOS with a high resistance drain terminal
#2396Illumination apparatus
#2397Deformable network structure
#2398Ultrathin buried die module and method of manufacturing thereof
#2399Vertical mount package and wafer level packaging therefor
#2400Chip package and manufacturing method thereof