Patents-Review.com
ClassID:

212578 ⎘

H01L2924/142 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Integrated circuits; Analog devices HF devices

Sub-classes:
Recent Application in this class:
#1
20250087604
2025-03-13

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

 #2
20250006669
2025-01-02

PACKAGE STRUCTURE WITH TRANSMISSION LINE AND METHOD FOR MANUFACTURING THE SAME

 #3
20240120289
2024-04-11

ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME

 #4
20240105647
2024-03-28

ELECTRONIC DEVICE AND MULTILEVEL PACKAGE SUBSTRATE WITH INTEGRATED FILTER

 #5
20230343700
2023-10-26

SEMICONDUCTOR DEVICE

 #6
20230299046
2023-09-21

Electronic package device and method of operating the same

 #7
20220293550
2022-09-15

SEMICONDUCTOR DEVICE

 #8
20210273342
2021-09-02

Antenna with graded dielectirc and method of making the same

 #9
20190326188
2019-10-24

Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit

 #10
20190252792
2019-08-15

Antenna with graded dielectirc and method of making the same

 #11
20190109091
2019-04-11

Component-embedded substrate, method of manufacturing the same, and high-frequency module

 #12
20190088490
2019-03-21

Method for manufacturing a semiconductor component and a semiconductor component

 #13
20170243858
2017-08-24

Semiconductor package incorporating redistribution layer interposer

 #14
20170141066
2017-05-18

Electronic device

 #15
20160351466
2016-12-01

Semiconductor structure having thermal backside core

 #16
20160293575
2016-10-06

System-in-package and fabrication method thereof

 #17
20160218678
2016-07-28

High-frequency semiconductor amplifier

 #18
20160143148
2016-05-19

Printed circuit board

 #19
20160005726
2016-01-07

SYSTEM-IN-PACKAGE

 #20
20150364411
2015-12-17

Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

 #21
20150262842
2015-09-17

High frequency module and manufacturing method thereof

 #22
20150171053
2015-06-18

Method for manufacturing semiconductor apparatus

 #23
20150008565
2015-01-08

High-frequency package

 #24
20140319684
2014-10-30

Semiconductor device and electronic device having the same

 #25
20140210066
2014-07-31

Semiconductor package having a cap unit with concave portion and method of manufacturing the same

 #26
20140035154
2014-02-06

Chip package and a method for manufacturing a chip package

 #27
20130250536
2013-09-26

Electronic device

 #28
20120217660
2012-08-30

Semiconductor apparatus, method for manufacturing the same and electric device

 #29
20120038411
2012-02-16

High-frequency switch

 #30
20120032190
2012-02-09

Package and fabrication method of the same

 #31
20080169349
2008-07-17

Semiconductor device and electronic device having the same