212582 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Integrated circuits; Analog devices Converter
Sub-classes:MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME
#2HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED CIRCUITS
#3ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#4ELECTRICAL-OPTICAL CONVERSION WITH 3D STACKED PHOTONIC CHIPLET(S) IN SUBSTRATE
#5SEMICONDUCTOR DEVICE
#6HETEROGENOUS INTEGRATION SCHEME FOR III-V/Si AND Si CMOS INTEGRATED CIRCUITS
#7INTEGRATED HALF-BRIDGE POWER CONVERTER
#8POWER MODULE HAVING LEADFRAME-LESS SIGNAL CONNECTORS, IN PARTICULAR FOR AUTOMOTIVE APPLICATIONS, AND ASSEMBLING METHOD THEREOF
#9Heterogenous Integration Scheme for III-V/Si and Si CMOS Integrated Circuits
#10Integrated semiconductor device isolation package
#11DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD TO BE MOUNTED IN ELECTRONIC APPARATUS
#12MULTI-INTERPOSER STRUCTURES AND METHODS OF MAKING THE SAME
#13Electrical apparatus
#14Semiconductor image sensor module and method of manufacturing the same
#15Semiconductor device
#16THERMALLY ENHANCED ELECTRONIC PACKAGES FOR GAN POWER INTEGRATED CIRCUITS
#17Integrated half-bridge power converter
#18Package structure applied to power converter
#19Wind turbine assembly
#20Switch device having a pulldown transistor and a voltage clamp
#21Transformer-based driver for power switches
#22Semiconductor image sensor module and method of manufacturing the same
#23Semiconductor devices and methods of forming same
#24POWER MODULE AND POWER CONVERSION APPARATUS
#25Photo-sensitive silicon package embedding self-powered electronic system
#26Semiconductor module and power conversion apparatus
#27Power module and power conversion apparatus including case and elastic member
#28Multi-phase power converter with common connections
#29Power converter monolithically integrating transistors, carrier, and components
#30Semiconductor module
#31Power semiconductor module
#32Physical topology for a power converter
#33Integrated circuit package for assembling various dice in a single IC package
#34Multi-phase power converter with common connections
#35Photo-sensitive silicon package embedding self-powered electronic system
#36Semiconductor module
#37Semiconductor module and power converter
#38Fan-out semiconductor package
#39Semiconductor package including flip chip mounted IC and vertically integrated inductor
#40Silicon package for embedded semiconductor chip and power converter
#41Silicon package for embedded semiconductor chip and power converter
#42POWER CONVERSION APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#43Compact optical transceiver by hybrid multichip integration
#44Methods for microelectronics fabrication and packaging using a magnetic polymer
#45Systems and methods for microelectronics fabrication and packaging using a magnetic polymer
#46Power converter monolithically integrating transistors, carrier, and components
#47SEMICONDUCTOR IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
#48Leadless electronic packages for GAN devices
#49Semiconductor image sensor module and method of manufacturing the same
#50Semiconductor device
#51Semiconductor device having terminals directly attachable to circuit board
#52Back-to-back stacked dies
#53Semiconductor device package having an oscillator and an apparatus having the same
#54Semiconductor image sensor module and method of manufacturing the same
#55DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#56Silicon package for embedded electronic system having stacked semiconductor chips
#57Photo-sensitive silicon package embedding self-powered electronic system
#58Silicon package for embedded semiconductor chip and power converter
#59Robust and Reliable Power Semiconductor Package
#60Semiconductor device and DC-to-DC converter
#61Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#62DC-DC converter having terminals of semiconductor chips directly attachable to circuit board
#63Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#64Semiconductor device having multiple contact clips
#65Apparatus and method for harvesting energy in an electronic device
#66Solder bump arrangements for large area analog circuitry
#67Lead frame having a perimeter recess within periphery of component terminal
#68Apparatus and method for harvesting energy in an electronic device
#69Back-to-back stacked dies
#70STACKED DIE PACKAGES WITH FLIP-CHIP AND WIRE BONDING DIES
#71Semiconductor device and DC-to-DC converter
#72Semiconductor image sensor module and method of manufacturing the same
#73Thermally enhanced electronic packages for GaN power integrated circuits
#74Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates
#75IC package with integrated inductor
#76Compact optical transceiver by hybrid multichip integration
#77Semiconductor device having compliant and crack-arresting interconnect structure
#78Silicon package for embedded electronic system having stacked semiconductor chips