Patents-Review.com
ClassID:

212588 ⎘

H01L2924/143 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of semiconductor or other solid state devices to be connected; Device type; Integrated circuits Digital devices

Sub-classes:
Recent Application in this class:
#1
20260018579
2026-01-15

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES

 #2
20250343568
2025-11-06

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

 #3
20250316607
2025-10-09

LOGIC DRIVE BASED ON MULTICHIP PACKAGE COMPRISING STANDARD COMMODITY FPGA IC CHIP WITH COOPERATING OR SUPPORTING CIRCUITS

 #4
20250132223
2025-04-24

DEVICES AND METHODS FOR FORMING DEVICES WITH LIDS

 #5
20240274583
2024-08-15

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH DIE SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS

 #6
20240222350
2024-07-04

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON- PACKAGE STRUCTURES

 #7
20240222301
2024-07-04

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTOR PACKAGES

 #8
20240128254
2024-04-18

STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOCIATED SYSTEMS AND METHODS

 #9
20240030152
2024-01-25

Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits

 #10
20240006401
2024-01-04

Offset interposers for large-bottom packages and large-die package-on-package structures

 #11
20230378075
2023-11-23

Method of forming semiconductor packages having through package vias

 #12
20230238337
2023-07-27

SEMICONDUCTOR DEVICE

 #13
20220344318
2022-10-27

Offset interposers for large-bottom packages and large-die package-on-package structures

 #14
20220302095
2022-09-22

Display device and method for manufacturing the same

 #15
20220285334
2022-09-08

Semiconductor device and method of stacking semiconductor die for system-level ESD protection

 #16
20220157799
2022-05-19

Offset interposers for large-bottom packages and large-die package-on-package structures

 #17
20220093524
2022-03-24

Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits

 #18
20220038066
2022-02-03

Heterogeneous Semiconductor Transceiver Integrated Circuit

 #19
20210384185
2021-12-09

Stacked semiconductor die assemblies with support members and associated systems and methods

 #20
20210384167
2021-12-09

Stacked semiconductor die assemblies with die support members and associated systems and methods

 #21
20210343680
2021-11-04

System on integrated chips and methods of forming same

 #22
20210281286
2021-09-09

RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE

 #23
20210265285
2021-08-26

Semiconductor device

 #24
20210265276
2021-08-26

Package structure and manufacturing method thereof

 #25
20210233854
2021-07-29

Method of forming semiconductor packages having through package vias

 #26
20210217672
2021-07-15

Packaging mechanisms for dies with different sizes of connectors

 #27
20210111165
2021-04-15

Device assembly structure and method of manufacturing the same

 #28
20210098396
2021-04-01

Package structure and manufacturing method thereof

 #29
20210050300
2021-02-18

Logic drive based on multichip package comprising standard commodity FPGA IC chip with cooperating or supporting circuits

 #30
20200388585
2020-12-10

Chip packages and methods for forming the same

 #31
20200357714
2020-11-12

Semiconductor device and method of manufacture

 #32
20200335462
2020-10-22

Chip packages and methods for forming the same

 #33
20200327214
2020-10-15

Fingerprint sensor pixel array and methods of forming same

 #34
20200321318
2020-10-08

Memory devices with controllers under memory packages and associated systems and methods

 #35
20200294926
2020-09-17

Package structure and manufacturing method thereof

 #36
20200279832
2020-09-03

Stacked semiconductor die assemblies with die support members and associated systems and methods

 #37
20200251462
2020-08-06

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES

 #38
20200161184
2020-05-21

Methods and apparatus for scribe seal structures

 #39
20200152604
2020-05-14

System on integrated chips and methods of forming same

 #40
20200105737
2020-04-02

Stacked semiconductor die assemblies with support members and associated systems and methods

 #41
20200058607
2020-02-20

Package structure and manufacturing method thereof

 #42
20200043892
2020-02-06

Chip packages and methods of manufacture thereof

 #43
20200020640
2020-01-16

Package structure and manufacturing method thereof

 #44
20190348376
2019-11-14

Semiconductor device

 #45
20190341319
2019-11-07

Packaging mechanisms for dies with different sizes of connectors

 #46
20190311988
2019-10-10

Method of forming semiconductor packages having through package vias

 #47
20190279973
2019-09-12

Magnetic small footprint inductor array module for on-package voltage regulator

 #48
20190181121
2019-06-13

Method and system for electronic devices with polycrystalline substrate structure interposer

 #49
20190172805
2019-06-06

Chip packages and methods for forming the same

 #50
20190164892
2019-05-30

Stacked modules

 #51
20190157224
2019-05-23

Package structure and manufacturing method thereof

 #52
20190157216
2019-05-23

Shielded package with integrated antenna

 #53
20190121952
2019-04-25

Fingerprint sensor pixel array and methods of forming same

 #54
20190096827
2019-03-28

Semiconductor device and manufacturing method thereof

 #55
20190088636
2019-03-21

Laminated interposers and packages with embedded trace interconnects

 #56
20190088630
2019-03-21

Micro-transfer printable electronic component

 #57
20190057916
2019-02-21

Semiconductor device and method of manufacture

 #58
20190052301
2019-02-14

Radio frequency shielding within a semiconductor package

 #59
20190035877
2019-01-31

Package structure and method of fabricating the same

 #60
20190035737
2019-01-31

Package structure and manufacturing method thereof

 #61
20190027465
2019-01-24

System on integrated chips and methods of forming same

 #62
20190013256
2019-01-10

Passivation layer having opening for under bump metallurgy

 #63
20180350776
2018-12-06

Memory devices with controllers under memory packages and associated systems and methods

 #64
20180294236
2018-10-11

Integrated circuit packaging system with shielding and method of manufacture thereof

 #65
20180294235
2018-10-11

Integrated circuit packaging system with shielding and method of manufacture thereof

 #66
20180247924
2018-08-30

Electronics package having a multi-thickness conductor layer and method of manufacturing thereof

 #67
20180247882
2018-08-30

Chip-on-film semiconductor packages and display apparatus including the same

 #68
20180240785
2018-08-23

Stacked semiconductor die assemblies with die support members and associated systems and methods

 #69
20180197845
2018-07-12

Magnetic small footprint inductor array module for on-package voltage regulator

 #70
20180190590
2018-07-05

Packaged chip and signal transmission method based on packaged chip

 #71
20180173600
2018-06-21

Self healing compute array

 #72
20180130747
2018-05-10

Stacked electronics package and method of manufacturing thereof

 #73
20180108583
2018-04-19

DEVICE CHIP, ACCOMMODATING TRAY, AND METHOD OF ACCOMMODATING DEVICE CHIPS

 #74
20180068979
2018-03-08

Multi-stack package-on-package structures

 #75
20180012857
2018-01-11

Semiconductor device and method of forming PoP semiconductor device with RDL over top package

 #76
20180006008
2018-01-04

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

 #77
20180005957
2018-01-04

Shielded package with integrated antenna

 #78
20170372976
2017-12-28

Packaging mechanisms for dies with different sizes of connectors

 #79
20170330871
2017-11-16

Chip package and manufacturing method thereof

 #80
20170330858
2017-11-16

Multi-stack package-on-package structures

 #81
20170301649
2017-10-19

Chip packages and methods of manufacture thereof

 #82
20170287814
2017-10-05

Chip-on-film semiconductor packages and display apparatus including the same

 #83
20170256528
2017-09-07

Methods of making semiconductor device packages and related semiconductor device packages

 #84
20170256521
2017-09-07

Micro-transfer printable electronic component

 #85
20170250172
2017-08-31

Semiconductor device and method of stacking semiconductor die for system-level ESD protection

 #86
20170186801
2017-06-29

Microelectronic package with horizontal and vertical interconnections

 #87
20170179094
2017-06-22

Magnetic small footprint inductor array module for on-package voltage regulator

 #88
20170170149
2017-06-15

Memory devices with controllers under memory packages and associated systems and methods

 #89
20170125346
2017-05-04

Package structures and methods of making the same

 #90
20170103956
2017-04-13

Integrated circuit package

 #91
20170084577
2017-03-23

Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates

 #92
20170033026
2017-02-02

Semiconductor device and method of forming small Z semiconductor package

 #93
20170012031
2017-01-12

Methods of making semiconductor device packages and related semiconductor device packages

 #94
20160379967
2016-12-29

Laminated interposers and packages with embedded trace interconnects

 #95
20160365318
2016-12-15

Semiconductor device and manufacturing method thereof

 #96
20160359520
2016-12-08

Radio frequency shielding within a semiconductor package

 #97
20160343699
2016-11-24

Stacked semiconductor die assemblies with support members and associated systems and methods

 #98
20160336300
2016-11-17

Stacked semiconductor die assemblies with die support members and associated systems and methods

 #99
20160300803
2016-10-13

Crosstalk polarity reversal and cancellation through substrate material

 #100
20160300799
2016-10-13

Integrated circuit packaging system with shielding and method of manufacturing thereof

 #101
20160276307
2016-09-22

Semiconductor device and method of forming PoP semiconductor device with RDL over top package

 #102
20160247763
2016-08-25

High density substrate interconnect formed through inkjet printing

 #103
20160218093
2016-07-28

Offset interposers for large-bottom packages and large-die package-on-package structures

 #104
20160181212
2016-06-23

Chip package and method for forming the same

 #105
20160172329
2016-06-16

Interconnect structures for wafer level package and methods of forming same

 #106
20160163578
2016-06-09

Method of forming semiconductor packages having through package vias

 #107
20160163564
2016-06-09

Method of forming semiconductor packages having through package vias

 #108
20160148918
2016-05-26

Memory devices with controllers under memory packages and associated systems and methods

 #109
20160086921
2016-03-24

Semiconductor package having cascaded chip stack

 #110
20160079216
2016-03-17

SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

 #111
20160020379
2016-01-21

Circuit device, electronic apparatus and moving object

 #112
20160005727
2016-01-07

Semiconductor device

 #113
20150325557
2015-11-12

Chip package and method for forming the same

 #114
20150325552
2015-11-12

Chip package and method for forming the same

 #115
20150325509
2015-11-12

Substrate block for PoP package

 #116
20150311186
2015-10-29

Stacked semiconductor die assemblies with die support members and associated systems and methods

 #117
20150311185
2015-10-29

Stacked semiconductor die assemblies with support members and associated systems and methods

 #118
20150311094
2015-10-29

Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof

 #119
20150279814
2015-10-01

EMBEDDED CHIPS

 #120
20150270206
2015-09-24

Pressure sensor device with through silicon via

 #121
20150262898
2015-09-17

Packaging mechanisms for dies with different sizes of connectors

 #122
20150262866
2015-09-17

Integrated circuit package

 #123
20150221624
2015-08-06

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

 #124
20150214155
2015-07-30

Packages for three-dimensional die stacks

 #125
20150200189
2015-07-16

Integrated circuit module having a first die with a power amplifier stacked with a second die and method of making the same

 #126
20150187745
2015-07-02

SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE

 #127
20150179616
2015-06-25

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

 #128
20150001689
2015-01-01

Radio frequency shielding within a semiconductor package

 #129
20130285056
2013-10-31

Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structure

 #130
20130271907
2013-10-17

Offset interposers for large-bottom packages and large-die package-on-package structures

 #131
20130105950
2013-05-02

3D chip package with shielded structures

 #132
20110317371
2011-12-29

Electronic package with stacked semiconductor chips

 #133
15802170
2018-07-17

Passivation layer having an opening for under bump metallurgy

 #134
15604659
2018-08-28

Multilayer chipset structure

 #135
14273171
2015-09-29

Three-dimensional multiple chip packages including multiple chip stacks

 #136
14253868
2015-08-18

Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof