ClassID:

212604

H01L2924/15155 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid

Sub-classes:
Recent Application in this class:
#1
20210183784
2021-06-17

Substrate having electronic component embedded therein

#2
20210151633
2021-05-20

Light emitting device and fluidic manufacture thereof

#3
20190238092
2019-08-01

Integrated circuit device, oscillator, electronic device, and vehicle

#4
20190181304
2019-06-13

Light emitting device and fluidic manufacture thereof

#5
20170317242
2017-11-02

Light emitting device and fluidic manufacture thereof

#6
20160172344
2016-06-16

Low profile reinforced package-on-package semiconductor device

#7
20130299848
2013-11-14

Semiconductor packages and methods of formation thereof

#8
20120318872
2012-12-20

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

#9
20110300668
2011-12-08

Use of device assembly for a generalization of three-dimensional metal interconnect technologies

#10
20110277917
2011-11-17

Method for disposing a microstructure

#11
20110230015
2011-09-22

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

#12
20110140267
2011-06-16

Electronic device package and method for fabricating the same

#13
20100308453
2010-12-09

Integrated circuit package including a thermally and electrically conductive package lid

#14
20100181381
2010-07-22

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

#15
20100122654
2010-05-20

THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY

#16
20100092741
2010-04-15

MICROPARTS AND APPARATUS FOR SELF-ASSEMBLY AND ALIGNMENT OF MICROPARTS THEREOF

#17
20100075463
2010-03-25

Method and apparatus for fabricating self-assembling microstructures

#18
20090320139
2009-12-24

TRANSPONDER INCORPORATED INTO AN ELECTRONIC DEVICE

#19
20090271973
2009-11-05

Methods of making a radio frequency identification (RFID) tags

#20
20090109002
2009-04-30

Assembly comprising a functional device and a resonator and method of making same

#21
20090056113
2009-03-05

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

#22
20080235940
2008-10-02

APPARATUSES AND METHODS FOR FORMING SMART LABELS

#23
20080218299
2008-09-11

Method and structure for magnetically-directed, self-assembly of three-dimensional structures

#24
20080156445
2008-07-03

Transfer assembly for manufacturing electronic devices

#25
20080036087
2008-02-14

Web process interconnect in electronic assemblies

#26
20080023435
2008-01-31

Method for self-assembling microstructures

#27
20070269914
2007-11-22

Apparatus For Aligning Microchips On Substrate And Method For The Same

#28
20070256291
2007-11-08

Method of making a radio frequency identification (RFID) tag

#29
20070161152
2007-07-12

Method for fabricating semiconductor device and apparatus for fabricating the same

#30
20070158804
2007-07-12

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

#31
20070117274
2007-05-24

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

#32
20070115645
2007-05-24

Apparatuses and methods for forming wireless RF labels

#33
20070092654
2007-04-26

Methods and apparatuses for fluidic self assembly

#34
20070079571
2007-04-12

Methods and apparatuses relating to block receptor configurations and block assembly processes

#35
20070040686
2007-02-22

RFID inlays and methods of their manufacture

#36
20070031992
2007-02-08

Apparatuses and methods facilitating functional block deposition

#37
20070007637
2007-01-11

Multi-layered substrate assembly with vialess electrical interconnect scheme

#38
20070007237
2007-01-11

Method for self-assembling microstructures

#39
20070002203
2007-01-04

Apparatuses and methods for forming assemblies

#40
20060269689
2006-11-30

Method and apparatus for moving blocks

#41
20060249873
2006-11-09

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

#42
20060210769
2006-09-21

Method of making a flexible substrate containing self-assembling microstructures

#43
20060148166
2006-07-06

Assembly comprising functional devices and method of making same

#44
20060134799
2006-06-22

Thermally controlled fluidic self-assembly

#45
20060109130
2006-05-25

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

#46
20060109129
2006-05-25

Transponder incorporated into an electronic device

#47
20060109123
2006-05-25

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

#48
20060057293
2006-03-16

Thermally controlled fluidic self-assembly

#49
20060051517
2006-03-09

Thermally controlled fluidic self-assembly method and support

#50
20060048384
2006-03-09

Method for assembling micro-components to binding sites

#51
20060014322
2006-01-19

Methods and apparatuses relating to block configurations and fluidic self-assembly processes

#52
20050270757
2005-12-08

Methods for making electronic devices with small functional elements supported on a carriers

#53
20050270752
2005-12-08

Electronic devices with small functional elements supported on a carrier

#54
20050255620
2005-11-17

Web fabrication of devices

#55
20050206585
2005-09-22

Display devices and integrated circuits

#56
20050196524
2005-09-08

Apparatuses and methods for forming assemblies

#57
20050186712
2005-08-25

Method and apparatus for fabricating self-assembling microstructures

#58
20050164485
2005-07-28

Method for fabricating semiconductor device and apparatus for fabricating the same

#59
20050046018
2005-03-03

Electronic devices with small functional elements supported on a carrier

#60
20050000634
2005-01-06

Transfer assembly for manufacturing electronic devices

#61
13735821
2016-05-17

Use of device assembly for a generalization of three-dimensional metal interconnect technologies