212605 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid Side view
SEMICONDUCTOR PACKAGE
#2INTEGRATED-CIRCUIT MODULE COLLECTION AND DEPOSITION
#3SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
#4Semiconductor package
#5METHOD FOR LIGHT-EMITTING ELEMENT TRANSFERRING AND DISPLAY PANEL
#6Fluidic assembly encapsulating light emitting diodes
#7Semiconductor device and a method of manufacturing thereof
#8Semiconductor device package and a method of manufacturing the same
#9Semiconductor package
#10Semiconductor device and a method of manufacturing thereof
#11Encapsulated light emitting diodes for selective fluidic assembly
#12Semiconductor device and a method of manufacturing thereof
#13Chip assembly
#14Method for encapsulating emissive elements for fluidic assembly
#15Encapsulated emissive element for fluidic assembly
#16Printed circuit board and electronic equipment
#17Semiconductor device and a method of manufacturing thereof
#18Package substrate processing method and protective tape
#19Encapsulated fluid assembly emissive elements
#20Microelectronic elements with post-assembly planarization
#21Substrates, assembles, and techniques to enable multi-chip flip chip packages
#22Printed circuit board and electronic equipment
#23Semiconductor device with recess and method of making
#24IC package
#25Integrated circuit module and method of forming same
#26Method and apparatus for using universal cavity wafer in wafer level packaging
#27Self-aligned three dimensional chip stack and method for making the same
#28Chip assembly
#29Self-aligned three dimensional chip stack and method for making the same
#30Semiconductor device package and a method of manufacturing the same
#31Semiconductor device with plated lead frame
#32Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
#33Semiconductor chip, method for producing a plurality of semiconductor chips and method for producing an electronic or optoelectronic device and electronic or optoelectronic device
#34Self-aligned three dimensional chip stack and method for making the same
#35Thin stack packages
#36Semiconductor device and a method of manufacturing thereof
#37Microelectronic elements with post-assembly planarization
#38Semiconductor device
#39Semiconductor device and manufacturing method thereof
#40Chip on chip attach (passive IPD and PMIC) flip chip BGA using new cavity BGA substrate
#41Semiconductor device
#42Method and apparatus for using universal cavity wafer in wafer level packaging
#43Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
#44Device and method for localized underfill
#45Electronic device
#46Semiconductor packages
#47Semiconductor device
#48Substrate for mounting chip and chip package
#49IC package
#50Silicon package for embedded electronic system having stacked semiconductor chips
#51Electronic component housing package and electronic apparatus
#52Semiconductor device
#53Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
#54Printed circuit board and electronic equipment
#55Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof
#56Method of forming a chip assembly with a die attach liquid
#57Semiconductor device
#58Functional spacer for SIP and methods for forming the same
#59Semiconductor package
#60Microelectronic packages having cavities for receiving microelectronic elements
#61Semiconductor package and semiconductor package mounting structure
#62Package structure having a laminated release layer and method for fabricating the same
#63Thin stack packages
#64Semiconductor device with plated lead frame, and method for manufacturing thereof
#65Stepped package for image sensor
#66Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the same
#67Techniques for adhesive control between a substrate and a die
#68Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
#69Method for mounting a chip and chip package
#70Semiconductor packages including a metal layer between first and second semiconductor chips
#71Electronic component mounting structure
#72Electronic module allowing fine tuning after assembly
#73Semiconductor package having embedded semiconductor elements
#74Semiconductor device
#75Formulation for packaging an electronic device and assemblies made therefrom
#76Fan-out and heterogeneous packaging of electronic components
#77Microelectronic packages having cavities for receiving microelectronic elements
#78Semiconductor component support and semiconductor device
#79Assembly and production of an assembly
#80Pre-molded Cavity 3D Packaging Module with Layout
#81Semiconductor package and method of manufacturing the semiconductor package
#82Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
#83Functional spacer for SIP and methods for forming the same
#84MEMS pressure sensor device and manufacturing method thereof
#85SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#86SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#87HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
#88Stepped package for image sensor and method of making same
#89Component assembly using a temporary attach material
#90Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#91Carrier structures for microelectronic elements
#92PACKAGE ON PACKAGE USING THROUGH SUBSTRATE VIAS
#93Semiconductor package
#94SEMICONDUCTOR PACKAGES
#95Method for fabricating multi-chip module with multi-level interposer
#96Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration
#97MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
#98Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die
#99Submount and manufacturing method thereof
#100Transition from a chip to a waveguide port
#101HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#102Microelectronic elements with post-assembly planarization
#103Multilayer structures for magnetic shielding
#104Stacked semiconductor device with through via
#105Use of device assembly for a generalization of three-dimensional metal interconnect technologies
#106Microelectronic packages having cavities for receiving microelectronic elements
#107Semiconductor device including semiconductor elements mounted on base plate
#108Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#109Multi-chip module with multi-level interposer
#110CONNECTING PAD PRODUCING METHOD
#111Light-emitting diode (LED) package systems
#112Light emitting device, method for manufacturing the same, and backlight unit
#113Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
#114Recessed semiconductor substrates and associated techniques
#115TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
#116Multi-tiered integrated circuit package
#117Electronic device, electronic module, and methods for manufacturing the same
#118SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME
#119Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV
#120SEMICONDUCTOR DEVICE WITH DOUBLE-SIDED ELECTRODE STRUCTURE AND ITS MANUFACTURING METHOD
#121SEMICONDUCTOR CHIP PACKAGES HAVING REDUCED STRESS
#122System with recessed sensing or processing elements
#123Package structure
#124CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#125Assembly and production of an assembly
#126Multilayer wiring substrate having a castellation structure
#127SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#128Light emitting device package and lighting system including the same
#129Method of making semiconductor device packaged by sealing resin member
#130Package for electronic component, manufacturing method thereof and sensing apparatus
#131METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREIN
#132STEREOSCOPIC ELECTRONIC CIRCUIT DEVICE, AND RELAY BOARD AND RELAY FRAME USED THEREIN
#133Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display
#134SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF
#135Semiconductor chip packages having reduced stress
#136Electronic device, electronic module, and methods for manufacturing the same
#137Semiconductor device with double-sided electrode structure and its manufacturing method
#138Microelectronic imagers and methods for manufacturing such microelectronic imagers
#139Microelectronic packages having cavities for receiving microelectric elements
#140Printed circuit board, production method therefor, electronic-component carrier board using printed circuit board, and production method therefor
#141Multilayer ceramic substrate
#142STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
#143Multilayer structures for magnetic shielding
#144Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package
#145Multiple flip-chip integrated circuit package system
#146Die stack system and method
#147Redistributed solder pads using etched lead frame
#148LIGHT-EMITTING DIODE PACKAGE STRUCTURE
#149Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#150Semiconductor device with integrated heat spreader
#151Methods and apparatuses relating to block receptor configurations and block assembly processes
#152Cavity chip package
#153Method for manufacturing a tamper-proof cap for an electronic module
#154Light-emitting device
#155Pressure detecting apparatus
#156Production method of a multilayer ceramic substrate
#157Light source utilizing an infrared sensor to maintain brightness and color of an LED device
#158Stepped integrated circuit packaging and mounting
#159Redistributed solder pads using etched lead frame
#160Semiconductor package with build-up structure and method for fabricating the same
#161Stereoscopic electronic circuit device, and relay board and relay frame used therein
#162Semiconductor device including semiconductor element mounted on another semiconductor element
#163Semiconductor device including semiconductor elements mounted on base plate
#164Light-emitting diode package structure
#165Semiconductor packaging