Semiconductor package and substrate for the same

Semiconductor apparatus with decoupling capacitor

Scanning acoustic microscope with profilometer function

Method of manufacturing substrate

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for fabricating heat dissipating semiconductor package

Method of manufacturing semiconductor device

Electronic assemblies with hot spot cooling and methods relating thereto

Method of fabricating a stacked type chip package structure

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Semiconductor device

Semiconductor package having marking layer

Semiconductor package having restraining ring surfaces against soldering crack

Stackable semiconductor package having plural pillars per pad

Stable gold bump solder connections

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Memory Packages Having Stair Step Interconnection Layers

Electronic component sealing substrate for hermetically sealing a micro electronic mechanical system of an electronic component

Stacked-type chip package structure and method of fabricating the same

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Semiconductor device

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Multilayer printed wiring board

Manufacturing process of leadframe-based BGA packages

Flip chip package process

Package with passive component support assembly

Interface module

Integrated circuit package including miniature antenna

Die warpage control

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

Semiconductor device and semiconductor memory device

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING

Semiconductor device and method of making semiconductor device

Ball grid array substrate package and solder pad

Method for manufacturing an electronic component package and electronic component package

Integrated circuit package system with mold lock subassembly

Nanotube based vapor chamber for die level cooling

Heat-releasing printed circuit board and semiconductor chip package

Semiconductor device with different conductive features embedded in a mold enclosing a semiconductor die and method for making same

Semiconductor device and methods of manufacturing semiconductor devices

STACK-TYPE SEMICONDUCTOR PACKAGE, METHOD OF FORMING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME

Integrated circuit packaging system with base structure device

Electronic components on trenched substrates and method of forming same

Package with improved connection of a decoupling capacitor

Glass cap molding package, manufacturing method thereof and camera module

Solder ball loading method and solder ball loading unit

Heat resistant substrate incorporated circuit wiring board

Semiconductor device including wiring excellent in impedance matching, and method for designing the same

X-ray inspection of solder reflow in high-density printed circuit board applications

Structure to share internally generated voltages between chips in MCP

Method for forming BGA package with increased standoff height

Apparatus and Method for ESD Protection of an Integrated Circuit

High frequency module

Test socket and test board for wafer level semiconductor testing

Method of testing using a temporary chip attach carrier

Integrated circuit packaging system with interposer

Stacked semiconductor chips

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Stress relief structures for silicon interposers

Method for stacking semiconductor chips

Integrated circuit packaging system with passive components

Semiconductor device including electronic component coupled to a backside of a chip

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Method and structure for dispensing chip underfill through an opening in the chip

Method and structure of expanding, upgrading, or fixing multi-chip package

Semiconductor package and method of reducing electromagnetic interference between devices

Three dimensional packaging optimized for high frequency circuitry

Method of attaching an electronic device to an MLCC having a curved surface

Method of manufacturing a printed circuit board having an embedded electronic component

Vertically tapered transmission line for optimal signal transition in high-speed multi-layer ball grid array packages

Semiconductor device having a through electrode, semiconductor module employing thereof and method for manufacturing semiconductor device having a through electrode

Electromagnetic shield formation for integrated circuit die package

Thermally enhanced package structure

Carrier assembly for an integrated circuit

Semiconductor chip package and printed circuit board

DECOUPLING CAPACITOR ASSEMBLY, INTEGRATED CIRCUIT/DECOUPLING CAPACITOR ASSEMBLY AND METHOD FOR FABRICATING SAME

Method and apparatus for interrogating an electronic component

Integrated circuit package system with package encapsulation having recess

Integrated circuit, circuit system, and method of manufacturing

Semiconductor device and method of manufacturing the same

Techniques for forming solder bump interconnects

Semiconductor device with double-sided electrode structure and its manufacturing method

Integrated circuit package system with delamination prevention structure

Integrated circuit package system with multi-chip module

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

Multilayer substrate with interconnection vias and method of manufacturing the same

Thermal spreader for simultaneously enhancing capillary effect and structural strength

Formation of circuitry with modification of feature height

Printed circuit board manufacturing method

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Method for fabricating stacked semiconductor components

Manufacturing process for a chip package structure

Alkali silicate glass based coating and method for applying

Electronic device having stack-type semiconductor package and method of forming the same

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Method and apparatus for interrogating an electronic component

Semiconductor chip with crack stop

Stacked die package

Stack chip and stack chip package having the same

Semiconductor package and semiconductor module having the same

Package structure for multiple die stack

Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same

Structure of high performance combo chip and processing method

SUBSTRATE, ELECTRONIC COMPONENT, ELECTRONIC CONFIGURATION AND METHODS OF PRODUCING THE SAME

Multi-chip semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Dual-sided chip attached modules

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device package structure

Semiconductor package having resin substrate with recess and method of fabricating the same

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Substrate having through-wafer vias and method of forming

Semiconductor chip and process for forming the same

Semiconductor substrate with islands of diamond and resulting devices

Multilayer semiconductor device

Semiconductor device having wiring substrate stacked on another wiring substrate

Printed wiring board

Thermal interface

Stress-distribution detecting semiconductor package group and detection method of stress distribution in semiconductor package using the same

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Semiconductor device and manufacturing method of the same

Optimization of electronic package geometry for thermal dissipation

FAULT ANALYZER

High-sensitive resistance measuring device and monitoring method of solder bump

Low-noise flip-chip packages and flip chips thereof

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

Stack-type semiconductor package, method of forming the same and electronic system including the same

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

Method of embedding passive component within via

Semiconductor module, method for manufacturing semiconductor modules, semiconductor apparatus, method for manufacturing semiconductor apparatuses, and portable device

Structure of high performance combo chip and processing method

Stacked chip package with redistribution lines

Semiconductor device and method of manufacturing the same

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

SEMICONDUCTOR DEVICE

Multi-Chip Package

Semiconductor device including thermally dissipating dummy pads

Semiconductor module including semiconductor chips in a plastic housing in separate regions

Ball grid array package enhanced with a thermal and electrical connector

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

Integrated Circuit Package with Passive Component

Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same

Integrated circuit package system employing an offset stacked configuration

Integrated circuit package-on-package system with anti-mold flash feature

Integrated circuit package-in-package system with carrier interposer

Integrated circuit package-in-package system with side-by-side and offset stacking

Semiconductor memory package

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

Multiple chips bonded to packaging structure with low noise and multiple selectable functions

Method of manufacturing semiconductor package using redistribution substrate

Semiconductor package having memory devices stacked on logic device

Wiring board, method of manufacturing the same, and semiconductor device having wiring board

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method for the same

DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS

Semiconductor device including semiconductor constituent and manufacturing method thereof

Semiconductor package having buss-less substrate

Package structure and manufacturing method thereof

Flip-chip type semiconductor device

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

Fan out type wafer level package structure and method of the same

Semiconductor package structure

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and printed circuit board

Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board

Method of manufacturing semiconductor device with electrode for external connection and semiconductor device obtained by means of said method

Method And Device For Enhancing Solderability

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR

WIRING BOARD FOR MOUNTING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF THE SAME, AND WIRING BOARD ASSEMBLY

Solid state imaging device and manufacturing method thereof

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

Top layers of metal for high performance IC's

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Carrier substrate and integrated circuit

Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package

Electronic device with flexible heat spreader

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor chip scale package incorporating through-vias electrically connected to a substrate and other vias that are isolated from the substrate, and method of forming the package

STRUCTURE ON CHIP PACKAGE TO SUBSTANTIALLY MATCH STIFFNESS OF CHIP

Semiconductor package having a plurality input/output members

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

INTEGRATED DEVICE AND CIRCUIT SYSTEM

Semiconductor device

Flip-chip package covered with tape

Near chip scale package integration process

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

Package and the method for making the same, and a stacked package

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Larger than die size wafer-level redistribution packaging process

Packaging substrate and application thereof

Stacked memory device

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage

Leadframe-based semiconductor package

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Substrate with low-elasticity layer and low-thermal-expansion layer

Semiconductor device

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Electronic assemblies without solder having overlapping components

WAFER-LEVEL ASSEMBLY OF HEAT SPREADERS FOR DUAL IHS PACKAGES

Semiconductor stack package having wiring extension part which has hole for wiring

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

INTEGRATED CIRCUIT

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus

Integrated circuit package system with multiple devices

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Component and assemblies with ends offset downwardly

Optical device including a wiring having a reentrant cavity

Semiconductor die package with internal bypass capacitors

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Method of manufacturing an electronic part mounting structure

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Integrated circuit having a semiconductor substrate with a barrier layer

Semiconductor device having external connection terminals and method of manufacturing the same

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Semiconductor module

Memory module capable of lessening shock stress

Sensor package

Method and apparatus for loading solder balls

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE HAVING A HEAT SINK WITH A BORED PORTION

Method and apparatus for fabricating integrated circuit device using self-organizing function

Semiconductor device with offset stacked integrated circuits

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

Circuit module and electrical component

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Wafer level package structure and fabrication methods

Method of manufacturing printed wiring board

Thermally aware design modification

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Electronic assemblies without solder and methods for their manufacture

Integrated circuit package system with flexible substrate and mounded package

Integrated circuit package system with flexible substrate and recessed package

Integrated circuit package system including stacked die

Semiconductor chip package and method of manufacturing the same

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Three-dimensional die-stacking package structure

Wiring substrate for a multi-chip semiconductor device

Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof

Heat-conductive package structure

Packaged semiconductor assemblies and methods for manufacturing such assemblies

MICROBUMP SEAL

CHIP PACKAGE PROCESS

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Die-wafer package and method of fabricating same

Photoelectric circuit board

Semiconductor device suitable for a stacked structure

Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Three-dimensional chip-stack package and active component on a substrate

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Method of fabricating a power semiconductor module

Semiconductor package system with patterned mask over thermal relief

Integrated circuit package with sputtered heat sink for improved thermal performance

High-Density Fine Line Structure And Method Of Manufacturing The Same

Chip embedded substrate and method of producing the same

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Semiconductor device and method for manufacturing thereof

Power semiconductor devices with trenched shielded split gate transistor and methods of manufacture

Power semiconductor devices with shield and gate contacts and methods of manufacture

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Multilayered printed circuit board and fabricating method thereof

ELECTRONIC APPARATUS

Fabrication method of semiconductor integrated circuit device

Method for producing a matrix for detecting electromagnetic radiation and method for replacing an elementary module of such a detection matrix

Integrated circuit package system with overhang die

Integrated circuit package system with dual side connection

Electronic device comprising an ESD device