212621 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
Sub-classes:DENSE REDISTRIBUTION LAYERS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
#2Semiconductor Package Using A Coreless Signal Distribution Structure
#3ELECTRONIC PACKAGE WITH A BATTERY SECURED BY A BENT LEADFRAME
#4PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#5POWER MODULE AND RELATED METHODS
#6Semiconductor Device and Method of Forming Embedded Trace Substrate with Barrier Layer to Inhibit Electromigration
#7SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
#8PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
#9Semiconductor package using a coreless signal distribution structure
#10Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#11Power module and related methods
#12Semiconductor package using a coreless signal distribution structure
#13SEMICONDUCTOR DEVICE
#14Dense Redistribution Layers in Semiconductor Packages and Methods of Forming the Same
#15Power module and related methods
#16Semiconductor package using a coreless signal distribution structure
#17Semiconductor package with front side and back side redistribution structures and fabricating method thereof
#18Structure with controlled capillary coverage
#19Mitigating cracking within integrated circuit (IC) device carrier
#20Integrated fan-out package and method for fabricating the same
#21Substrate, imaging unit and imaging device
#22Electronic assembly and electronic system with impedance matched interconnect structures
#23Semiconductor package having a metal paint layer
#24Semiconductor package and fabricating method thereof
#25Radio frequency isolation structure
#26Protrusion bump pads for bond-on-trace processing
#27Dense redistribution layers in semiconductor packages and methods of forming the same
#28Micro-transfer printable electronic component
#29Wireless IC device
#30Integrated fan-out package and method for fabricating the same
#31Identifying lane errors using a pseudo-random binary sequence
#32Methods of determining racetrack layout for radio frequency isolation structure
#33Semiconductor package and fabricating method thereof
#34Semiconductor packages including heat transferring blocks and methods of manufacturing the same
#35Packaged integrated circuit device with cantilever structure
#36Package carrier
#37Package-on-package structure and method
#38Dense redistribution layers in semiconductor packages and methods of forming the same
#39SYSTEMS AND METHODS FOR PROVIDING ELECTROMAGNETIC INTERFERENCE SHIELDING FOR INTEGRATED CIRCUIT MODULES
#40Substrate, imaging unit and imaging device
#41Semiconductor package using a coreless signal distribution structure
#42Racetrack layout for radio frequency isolation structure
#43Electronic substrates and interposers made from nanoporous films
#44Semiconductor package having a metal paint layer
#45Micro-transfer printable electronic component
#46Semiconductor package and fabricating method thereof
#47Packaged integrated circuit device with cantilever structure
#48Package carrier and manufacturing method thereof
#49System and methods for producing modular stacked integrated circuits
#50Apparatus and methods for creating environmentally protective coating for integrated circuit assemblies
#51Electronic apparatus and method for manufacturing electronic apparatus
#52Wireless IC device, molded resin article, and method for manufacturing wireless IC device
#53Mounting substrate, manufacturing method for the same, and component mounting method
#54Wiring board and semiconductor package
#55Semiconductor package using a coreless signal distribution structure
#56Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#57Semiconductor package having a metal paint layer
#58Radio frequency isolation structure with racetrack
#59Racetrack layout for radio frequency shielding
#60Protrusion bump pads for bond-on-trace processing
#61Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
#62Module
#63Via density in radio frequency shielding applications
#64Semiconductor apparatus including a heat dissipating member
#65Multilayer electronic device and manufacturing method therefor
#66Electric component module
#67Component-embedded board and communication terminal device
#68Package structure and methods of forming same
#69Semicondutor device with through-silicon via-less deep wells
#70Semiconductor assembly and method of manufacturing the same
#71Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#72EMI shielding in semiconductor packages
#73Via placement in radio frequency shielding applications
#74Electronic component module
#75EBG structure, semiconductor device, and circuit board
#76Electronic component package and method of manufacturing same
#77Multilayer substrate
#78Semiconductor package having a baseplate with a die attach region and a peripheral region
#79Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#80Composite laminated ceramic electronic component
#81Electronic device
#82Circuit module and production method therefor
#83Semiconductor package including antenna layer and manufacturing method thereof
#84Method of manufacturing mounting member and method of manufacturing electronic component
#85Component built-in board and method of manufacturing the same, and mounting body
#86Method of manufacturing module
#87Voltage noise reduction through co-layouts of multilayer ceramic capacitors and solid electrolytic polymer capacitors
#88Semiconductor packages including semiconductor chips having protrusions and methods of fabricating the same
#89Electronic package module and method of manufacturing the same
#90Reducing loadline impedance in a system
#91Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#92Wiring substrate
#93Wiring board for mounting a semiconductor element
#94Racetrack design in radio frequency shielding applications
#95CONFORMAL SHIELDING MODULE
#96Semiconductor package having a metal paint layer
#97Multilayer electronic support structure with cofabricated metal core
#98Via density and placement in radio frequency shielding applications
#99Systems and methods for providing electromagnetic interference shielding for integrated circuit modules
#100Switch module
#101MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
#102Wiring substrate and method for manufacturing wiring subtrate
#103Tree based adaptive die enumeration
#104PCB based RF-power package window frame
#105Semiconductor package and fabrication method thereof
#106SiP system-integration IC chip package and manufacturing method thereof
#107Methods for molding integrated circuits
#108SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
#109Method of manufacturing wiring substrate having built-in component
#110Synchronizing global clocks in 3D stacks of integrated circuits by shorting the clock network
#111SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#112Wiring board, semiconductor device, and method for manufacturing wiring board
#113Packages and methods for packaging microphone devices
#114Wireless IC device and electronic apparatus
#115Method of manufacturing high frequency module and high frequency module
#116Module with exposed parts of copper foil and process for production thereof
#117Reconfigurable connections for stacked semiconductor devices
#118Semiconductor package module
#119Semiconductor package integrated with conformal shield and antenna
#120Noise suppressor for semiconductor packages
#121Multiple patterning wiring board, wiring board and electronic apparatus
#122Circuit module
#123Semiconductor die having a redistribution layer
#124Wireless IC device and electronic apparatus
#125ELECTRICAL CIRCUIT SYSTEM AND METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT SYSTEM
#126Reconfigurable connections for stacked semiconductor devices
#127Electronic component module and method of manufacturing the electronic component module
#128Semiconductor die having a redistribution layer
#129Semiconductor chip package with stiffener frame and configured lid
#130Method for producing forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component
#131Wireless IC device and electronic apparatus
#132Reconfigurable connections for stacked semiconductor devices
#133Method of fabricating a semiconductor die having a redistribution layer
#134Semiconductor die having a distribution layer
#135Composite ceramic substrate
#136Method for producing powder forsterite powder, forsterite powder, sintered forsterite, insulating ceramic composition, and multilayer ceramic electronic component
#137Method for reducing loadline impedance in a system
#138Multilayer electronic component and structure for mounting multilayer electronic component
#139Method of manufacturing a semiconductor apparatus
#140Multi-layer ceramic substrate, method for manufacturing the same and electronic device using the same
#141Reducing loadline impedance in a system