212622 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Semiconductor device
#902Testing interposer method and apparatus
#9033D device and devices with bonding
#9043DIC formation with dies bonded to formed RDLs
#905Sawing underfill in packaging processes
#906Passive devices in package-on-package structures and methods for forming the same
#907Memory system having combined high density, low bandwidth and low density, high bandwidth memories
#908Antenna module
#909Semiconductor device with thin redistribution layers
#910Semiconductor package and method of fabricating the same
#911Semiconductor package and method
#912Switched power stage with integrated passive components
#913Low warpage high density trench capacitor
#9143D integrated circuit device and structure with hybrid bonding
#915MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
#9163D chip with shared clock distribution network
#917Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices
#918Package structure and method of forming the same
#919Chip package with redistribution layers
#920Semiconductor device and method
#921Package structure
#922DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#923Extending multichip package link off package
#924High frequency module, board equipped with antenna, and high frequency circuit board
#925Integrated device package including thermally conductive element and method of manufacturing same
#926Semiconductor Device and Method
#927Printed circuit board
#928Semiconductor apparatus and system
#929Semiconductor package structure
#930Package structure and method of fabricating the same
#931Packages with Si-substrate-free interposer and method forming same
#932Semiconductor device and method of manufacture
#933Fan-out transition structure for transmission of mm-Wave signals from IC to PCB via chip-scale packaging
#934System and method for laser assisted bonding of an electronic device
#935Fingerprint sensor device and method
#936Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
#937Stacked chip package and methods of manufacture thereof
#938Semiconductor device and method of manufacture
#939MULTIPLE BALL GRID ARRAY (BGA) CONFIGURATIONS FOR A SINGLE INTEGRATED CIRCUIT (IC) PACKAGE
#940Semiconductor package for thermal dissipation
#941Sawing underfill in packaging processes
#942Integrating and accessing passive components in wafer-level packages
#943Pad design for reliability enhancement in packages
#944Interconnect structure fabricated using lithographic and deposition processes
#945GROOVE DESIGN TO FACILITATE FLOW OF A MATERIAL BETWEEN TWO SUBSTRATES
#946Multi-pitch ball grid array
#947Package-on-package assembly with wire bonds to encapsulation surface
#948Cryptographic device arranged to compute a target block cipher
#949Semiconductor device with electromagnetic interference film and method of manufacture
#950Surface treatment method and apparatus for semiconductor packaging
#951Memory device comprising programmable command-and-address and/or data interfaces
#952Structure and method for fabricating a computing system with an integrated voltage regulator module
#953Semiconductor package having discrete antenna device
#954Microelectronic packages with high integration microelectronic dice stack
#955Package-on-package assembly with wire bond vias
#956Adhesive bonding composition and electronic components prepared from the same
#957Integrated circuit package pad and methods of forming
#958Fan-out wafer level package structure
#959Semiconductor device having planarized passivation layer and method of fabricating the same
#960Apparatus For Flexible Electronic Interfaces And Associated Methods
#961Semiconductor device with transmissive layer and manufacturing method thereof
#962Semiconductor structure and manufacturing method thereof
#963Semiconductor device comprising semiconductor die and interposer and manufacturing method thereof
#964Sandwich-molded cores for high-inductance architectures
#965Composite integrated circuits and methods for wireless interactions therewith
#966Modular voltage regulators
#967Chip package with lid
#968Process control for package formation
#969Method for interconnecting stacked semiconductor devices
#970Semiconductor device encapsulated by molding material attached to redestribution layer
#971Multi-stacked package-on-package structures
#972Semiconductor package and method
#973Packaged die stacks with stacked capacitors and methods of assembling same
#974Integrated circuit packages and methods of forming same
#975Stacked semiconductor device assembly in computer system
#976MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNAS ON A SUBSTRATE
#977METHOD OF MANUFACTURING CISCSP WITHOUT DAM
#978Semiconductor package with high routing density patch
#979Method of manufacturing semiconductor package structure
#980Electronic control device
#981Semiconductor structure and manufacturing method thereof
#982Flexible memory system with a controller and a stack of memory
#983Extending multichip package link off package
#984Connection terminal pattern and layout for three-level buck regulator
#985System-in-package with double-sided molding
#986Thermal interface material having different thicknesses in packages
#987Package structures and methods of forming the same
#988Underfill between a first package and a second package
#989Semiconductor device and method of forming microelectromechanical systems (MEMS) package
#990Pad design for reliability enhancement in packages
#991Channeled lids for integrated circuit packages
#992Integrated fan-out package and method of fabricating the same
#993Lids for integrated circuit packages with solder thermal interface materials
#994Optical transmission module
#995Semiconductor package with layer structures, antenna layer and electronic component
#996Packages with Si-substrate-free interposer and method forming same
#997Stack package and methods of manufacturing the same
#998Chip package
#999Semiconductor device and method of forming a 3D interposer system-in-package module
#1000Semiconductor package
#1001Semiconductor package and method of forming the same
#1002Semiconductor device and method of manufacturing semiconductor device
#1003Fabrication method of substrate having electrical interconnection structures
#1004Compact opto-electronic modules and fabrication methods for such modules
#10053D integrated circuit
#1006Package structure with dummy die
#1007Multi-chip modules including stacked semiconductor dice
#1008Package with tilted interface between device die and encapsulating material
#1009FILM FORMING APPARATUS, METHOD FOR MANUFACTURING FILM-FORMED PRODUCT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
#1010Semiconductor structure and manufacturing method thereof
#1011Manufacturing of flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#1012Method and system for packing optimization of semiconductor devices
#1013Package device
#1014Direct-bonded native interconnects and active base die
#1015Method to form a 3D integrated circuit
#1016Semiconductor device having laterally offset stacked semiconductor dies
#1017Semiconductor device having reduced bump height variation
#1018Electronic package and substrate structure having chamfers
#1019Chip embedded integrated voltage regulator
#1020Semiconductor package and fabricating method thereof
#1021Semiconductor device package
#1022Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods
#1023Interposer test structures and methods
#1024Semiconductor die singulation and structures formed thereby
#1025Package-on-package structure
#1026Low cost package warpage solution
#1027MEMORY CONTROL COMPONENT WITH INTER-RANK SKEW TOLERANCE
#1028Semiconductor packages and methods of forming same
#1029Semiconductor device having metal bump and method of manufacturing the same
#1030Semiconductor device with through-mold via
#1031Semiconductor device package and manufacturing method thereof
#1032Semiconductor device with redistribution layers formed utilizing dummy substrates
#1033Device and package structure and method of forming the same
#1034Method of fabricating semiconductor package
#1035Semiconductor device and method of manufacturing the same
#1036Connecting electronic components to substrates
#1037Printed circuit board
#1038Stiffener package and method of fabricating stiffener package
#1039Fingerprint sensor pixel array and methods of forming same
#1040Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
#1041Memory devices with controllers under memory packages and associated systems and methods
#1042Dual sided fan-out package having low warpage across all temperatures
#1043Stacked semiconductor die assemblies with die substrate extensions
#1044IC chip layout for minimizing thermal expansion misalignment
#1045Antenna module
#1046Dual-sided radio-frequency package with overmold structure
#1047Multi-chip package with high density interconnects
#1048Semiconductor package structure on a PCB and semiconductor module including the same
#1049Integrated antenna on interposer substrate
#1050Semiconductor device and manufacturing method thereof
#1051Multi-die memory device
#1052IC analog boundary scan cell, digital cell, comparator, analog switches
#1053Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#1054Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#1055Semiconductor device package with warpage control structure
#1056Package structure
#1057Semiconductor device assemblies with annular interposers
#1058Package with thinned substrate
#1059Integrated fan-out structure and method of forming
#1060EMI shield for molded packages
#1061Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling same
#1062Non-vertical through-via in package
#1063Semiconductor device and manufacturing method thereof
#1064Integrated Circuit Package Including Miniature Antenna
#1065Package-on-package (PoP) semiconductor package and electronic system including the same
#1066Semiconductor device and method for manufacturing semiconductor device
#1067Package structures and methods of forming
#1068Semiconductor package
#1069Chip package and manufacturing method thereof
#1070Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units
#10713D chip with shared clock distribution network
#1072Wafer level chip scale packaging intermediate structure apparatus and method
#1073DIC package comprising perforated foil sheet
#1074Semiconductor device with tiered pillar and manufacturing method thereof
#1075Method of forming semiconductor device package
#1076Optical semiconductor package and method for manufacturing the same
#1077Semiconductor device and method of forming an integrated SiP module with embedded inductor or package
#1078Redistribution layer structures for integrated circuit package
#1079Method of fabricating package structure
#1080Multi-chip structure and method of forming same
#1081ON-PACKAGE VERTICAL INDUCTORS AND TRANSFORMERS FOR COMPACT 5G MODULES
#1082Semiconductor packages and methods of forming the same
#1083Stacked semiconductor die assemblies with die support members and associated systems and methods
#1084Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#1085Semiconductor device and method
#1086Metal oxide layered structure and methods of forming the same
#1087Semiconductor device having through silicon vias and manufacturing method thereof
#1088Wafer level package structure with internal conductive layer
#1089Stacked IC structure with system level wiring on multiple sides of the IC die
#1090Method for fabricating semiconductor package and semiconductor package using the same
#1091Systems and methods for bonding semiconductor elements
#1092Semiconductor device and method for manufacturing the same
#1093Semiconductor device
#1094Semiconductor chip including chip pad, redistribution wiring test pad, and redistribution wiring connection pad
#1095Package stack structure and method for manufacturing the same
#1096Method for fabricating an electronic device comprising forming an infused adhesive and a periperal ring
#1097Method for manufacturing semiconductor package structure
#1098Package structure, package-on-package structure and manufacturing method thereof
#1099Method of forming conductive bumps for cooling device connection and semiconductor device
#1100Semiconductor package having routable encapsulated conductive substrate and method
#1101Semiconductor package and method of fabricating the same
#1102Fan-out structure and method of fabricating the same
#1103Packaging mechanisms for dies with different sizes of connectors
#1104OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
#1105Semiconductor package
#1106Semiconductor structure
#1107Semiconductor device
#1108Semiconductor device having EMI shielding structure and related methods
#1109Package with embedded heat dissipation features
#1110Three dimensional integrated circuit electrostatic discharge protection and prevention test interface
#1111Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#1112Semiconductor package with EMI shield and fabricating method thereof
#1113High performance module for SiP
#1114PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#1115Semiconductor device
#1116Conductive structures and redistribution circuit structures
#1117Package-on-package structure
#1118MICROELECTRONIC DEVICES DESIGNED WITH INTEGRATED ANTENNA ON A SUBSTRATE
#1119Fan-out sensor package and optical fingerprint sensor module including the same
#1120RF devices with enhanced performance and methods of forming the same
#1121Hexagonally arranged connection patterns for high-density device packaging
#1122Semiconductor package device and method of manufacturing the same
#1123Memory system topologies including a memory die stack
#1124Method for fabricating electronic package with conductive pillars
#1125Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric
#1126Methods related to dual-sided module with land-grid array (LGA) footprint
#1127Wire bonding method and apparatus for electromagnetic interference shielding
#1128Very thin embedded trace substrate-system in package (SIP)
#1129Packaged semiconductor devices and methods of packaging semiconductor devices
#1130Packages with through-vias having tapered ends
#1131Antenna apparatus and method
#1132Semiconductor package
#1133Semiconductor device and method of forming a 3D integrated system-in-package module
#1134Semiconductor package having a high reliability
#1135System-in-package with double-sided molding
#1136Microelectronic packages with high integration microelectronic dice stack
#1137Semiconductor package and method of manufacturing the same
#1138Antenna in embedded wafer-level ball-grid array package
#1139Conformal shielding for solder ball array
#1140Fine pitch copper pillar package and method
#1141Semiconductor package
#1142Composite compositions for electronics applications
#11433D chip sharing power interconnect layer
#1144Adhesive bonding composition and electronic components prepared from the same
#1145Configurable, power supply voltage referenced single-ended signaling with ESD protection
#1146Method for fabricating electronic package
#1147Semiconductor Package
#1148METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER INSULATING FILMS HAVING DIFFERENT YOUNG'S MODULUS
#1149Translation system for finer grain memory architectures
#1150Semiconductor device using EMC wafer support system and fabricating method thereof
#1151Semiconductor device
#1152Semiconductor device and manufacturing method thereof
#1153Thermal bump networks for integrated circuit device assemblies
#1154Methods of forming a package substrate
#1155Direct-bonded native interconnects and active base die
#1156Memory system topologies including a buffer device and an integrated circuit memory device
#1157Logic drive based on standard commodity FPGA IC chips using non-volatile memory cells
#1158Scalable High-Bandwidth Connectivity
#1159Semiconductor device manufacturing method
#1160Package on antenna package
#1161Semiconductor packages including a heat insulation wall
#1162SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER
#1163Semiconductor die package with more than one hanging die
#1164STACKED EMBEDDED PASSIVE SUBSTRATE STRUCTURE
#1165Waver-level packaging based module and method for producing the same
#1166Innovative way to design silicon to overcome reticle limit
#1167Semiconductor device package including embedded conductive elements
#1168Package-on-package assembly with wire bonds to encapsulation surface
#1169Semiconductor package with in-package compartmental shielding and fabrication method thereof
#1170Semiconductor structure and manufacturing method thereof
#1171Microelectronic devices including redistribution layers
#1172Handler bonding and debonding for semiconductor dies
#1173High density ball grid array (BGA) package capacitor design
#1174Chip package structure
#1175Methods and modules related to shielded lead frame packages
#1176Chip package
#1177Semiconductor device and process for fabricating the same
#1178METHODS RELATED TO THROUGH-MOLD OPENINGS FOR DUAL-SIDED PACKAGED MODULES WITH BALL GRID ARRAYS
#1179Flux
#1180Semiconductor device and manufacturing method of the same
#1181Integrating passive devices in package structures
#1182METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
#1183Semiconductor package structure and method of manufacturing the same
#1184Chip package having die structures of different heights and method of forming same
#1185Fabrication method of semiconductor package with stacked semiconductor chips
#1186Package on package structure and method for forming the same
#1187Method for manufacturing package structure
#1188Semiconductor package including organic interposer
#11893D IC bump height metrology APC
#1190Packaged semiconductor devices and methods of packaging semiconductor devices
#1191Stacked memory device, a system including the same and an associated method
#1192Interposer, Test Access Port, First and Second Through Silicon Vias
#1193Patch antennas stitched to systems in packages and methods of assembling same
#1194Connection system of semiconductor packages using a printed circuit board
#1195Integrated circuit package assembly
#1196Dummy structure of stacked and bonded semiconductor device
#1197Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#1198Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
#1199Scalable semiconductor interposer integration
#1200Method for fabricating carrier-free semiconductor package