212635 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400 C
SEMICONDUCTOR DEVICE PACKAGE HAVING A BALL GRID ARRAY WITH MULTIPLE SOLDER BALL MATERIALS
#2SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRUCTURE
#3PRINTED CIRCUIT BOARD, PACKAGE SUBSTRATE AND PRODUCTION METHOD FOR SAME
#4Low cost substrates
#5Semiconductor package
#6Lead-Free Solder Alloy
#7Semiconductor device and die bonding structure thereof
#8Underfill fluxing curative