H01L2924/156 - CPC Classification Index

ClassID:

212633 ⎘

H01L2924/156 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate Material

Sub-classes:

H01L2924/157 » with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof 490
H01L2924/15786 » with a principal constituent of the material being a non metallic, non metalloid inorganic material 18
H01L2924/1579 » with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy 449
H01L2924/15793 » with a principal constituent of the material being a solid not provided for in groups to , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond 6
H01L2924/15798 » with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams 23

Recent Application in this class:

20230395463

2023-12-07

METHODS OF MANUFACTURING STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS

20220013434

2022-01-13

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

20200135638

2020-04-30

Electronic component having a transistor and interdigitated fingers to form at least a portion of a capacitive component within the electronic component

20160013173

2016-01-14

Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths

20150115433

2015-04-30

SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAME

20150054019

2015-02-26

Semiconductor device having electrode interconnections within a conductive adhesive