H01L2924/1576 - CPC Classification Index

ClassID:

212640 ⎘

H01L2924/1576 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C Iron [Fe] as principal constituent

Recent Application in this class:

20210066158

2021-03-04

Semiconductor device and method of manufacturing semiconductor device

20200219848

2020-07-09

Chip assembly

20200013747

2020-01-09

Cu alloy core bonding wire with Pd coating for semiconductor device

20190371624

2019-12-05

Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation

20190164927

2019-05-30

Cu alloy core bonding wire with Pd coating for semiconductor device

20190027415

2019-01-24

Chip packaging structure, chip module and electronic terminal

20180269179

2018-09-20

Semiconductor device and method for manufacturing the same

20180254251

2018-09-06

Electronic component mounting board and electronic device

20180122765

2018-05-03

Bonding wire for semiconductor device

#10

20180068982

2018-03-08

Chip assembly

#11

20170194280

2017-07-06

Bonding wire for semiconductor device

#12

20170117244

2017-04-27

Cu alloy core bonding wire with Pd coating for semiconductor device

#13

20170077017

2017-03-16

Semiconductor device having terminals directly attachable to circuit board

#14

20160233156

2016-08-11

Electronic component, semiconductor package, and electronic device using the same

#15

20160111395

2016-04-21

Method of forming a chip assembly with a die attach liquid

#16

20150223316

2015-08-06

Electric power semiconductor device

#17

20140124912

2014-05-08

Semiconductor device and method of manufacturing the same

#18

20140110740

2014-04-24

Semiconductor device and production method therefor

#19

20140021595

2014-01-23

Semiconductor component support and semiconductor device

#20

20130127031

2013-05-23

Chip-package having a cavity and a manufacturing method thereof

#21

20120322211

2012-12-20

Die backside standoff structures for semiconductor devices

#22

20120267770

2012-10-25

Device and method including a soldering process

#23

20120267682

2012-10-25

Semiconductor device

#24

20120256228

2012-10-11

Die-bonded LED

#25

20120248591

2012-10-04

Lead frame and semiconductor device

#26

20120205790

2012-08-16

Semiconductor device including a lead frame

#27

20120153444

2012-06-21

SEMICONDUCTOR DEVICE

#28

20120146228

2012-06-14

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

#29

20120012992

2012-01-19

Semiconductor package having exterior plating films formed over surfaces of outer leads

#30

20110309493

2011-12-22

Method of manufacturing an electronic device with a package locking system

#31

20110272792

2011-11-10

Die backside standoff structures for semiconductor devices

#32

20110210431

2011-09-01

Microwave circuit package

#33

20110189821

2011-08-04

Semiconductor device

#34

20110159641

2011-06-30

Method of manufacturing semiconductor device

#35

20110127563

2011-06-02

Die-bonding method of LED chip and LED manufactured by the same

#36

20110084369

2011-04-14

Device including a semiconductor chip and a carrier and fabrication method

#37

20110031597

2011-02-10

Semiconductor device including first and second carriers

#38

20110018122

2011-01-27

Semiconductor device

#39

20100311205

2010-12-09

Semiconductor device

#40

20100289127

2010-11-18

Semiconductor device

#41

20100195292

2010-08-05

Electronic member, electronic part and manufacturing method therefor

#42

20100187563

2010-07-29

Semiconductor device and production method therefor

#43

20100078784

2010-04-01

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

#44

20100055839

2010-03-04

Method of manufacturing a semiconductor device

#45

20100044854

2010-02-25

Semiconductor device

#46

20090273066

2009-11-05

Semiconductor device and method

#47

20090256247

2009-10-15

Method of making semiconductor devices employing first and second carriers

#48

20090191702

2009-07-30

Semiconductor device and manufacturing method thereof

#49

20090189259

2009-07-30

Method of manufacturing electronic device on leadframe

#50

20090148720

2009-06-11

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY

#51