212641 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550 C
Package for a semiconductor device
#2Heat sink, semiconductor package and semiconductor module
#3Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier
#4Hermetic package for high CTE mismatch
#5Hermetic package for high CTE mismatch
#6METHOD FOR PRODUCING A SUBSTRATE PLATE, SUBSTRATE PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#7Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions
#8Semiconductor device
#9Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability
#10Semiconductor device package and method of manufacturing the same
#11Semiconductor substrate, semiconductor package structure and method of manufacturing a semiconductor device
#12Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#13INTEGRATED CIRCUIT PACKAGE COMPRISING SURFACE CAPACITOR AND GROUND PLANE
#14SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#15Method of fabricating packaging substrate
#16PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME
#17Power decoupling attachment
#18Power decoupling attachment
#19Capacitive interconnect in a semiconductor package
#20Packaging substrate and method of fabricating the same
#21Bonding wire for semiconductor device
#22Semiconductor device having polyimide layer
#23SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#24THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAME
#25Semiconductor package having a trench penetrating a main body
#26Integrated circuit package comprising surface capacitor and ground plane
#27Interposers, semiconductor devices, method for manufacturing interposers, and method for manufacturing semiconductor devices
#28Power module with the integration of control circuit
#29Low cost substrates
#30Methods for forming semiconductor device packages
#31Semiconductor device packages
#32Electronic packages and methods of making and using the same
#33Flexible packaged integrated circuit
#34POWER SEMICONDUCTOR ARRANGEMENT, POWER SEMICONDUCTOR MODULE WITH MULTIPLE POWER SEMICONDUCTOR ARRANGEMENTS, AND MODULE ASSEMBLY COMPRISING MULTIPLE POWER SEMICONDUCTOR MODULES
#35Semiconductor device, method for manufacturing the same, and power supply unit
#36Materials, structures and methods for microelectronic packaging
#37Method for producing a semiconductor element
#38Method for producing a semiconductor component
#39ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY
#40LEAD FRAME STRUCTURE
#41SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#42Materials, structures and methods for microelectronic packaging
#43Semiconductor package and method for forming the same
#44Semiconductor integrated circuit device and method of manufacturing the same
#45Materials, structures and methods for microelectronic packaging
#46Method for producing a semiconductor element