212642 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
Sub-classes:Graphite-laminated chip-on-film-type semiconductor package having improved heat dissipation and electromagnetic wave shielding functions
#2Graphite-laminated chip-on-film-type semiconductor package allowing improved visibility and workability
#3Cavity wall structure for semiconductor packaging
#4Cavity wall structure for semiconductor packaging
#5Through-hole electrode substrate
#6Through-hole electrode substrate
#7Thermally-enhanced provision of underfill to electronic devices using a stencil
#8Memory module in a package
#9Semiconductor device with mechanical lock features between a semiconductor die and a substrate
#10COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#11Memory module in a package
#12Component carrier assembly having a trench structure which separates component carrier regions, and method for producing a plurality of component carrier regions
#13Package on package devices and methods of packaging semiconductor dies
#14Memory module in a package
#15Memory module in a package
#16De-skewed multi-die packages
#17Radio-frequency packaging with reduced RF loss
#18Method of manufacturing a through-hole electrode substrate