H01L2924/15791 - CPC Classification Index

ClassID:

212646 ⎘

H01L2924/15791 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy The principal constituent being an elastomer, e.g. silicones, isoprene, neoprene

Recent Application in this class:

20250379178

MODULE CONTAINING FAN-OUT WAFER-LEVEL PACKAGING (FOWLP) UNIT CONNECTED TO ELECTRONIC COMPONENT BY WIRE BONDING

20180190637

Module and manufacturing method thereof

20180092205

Conformal electronics including nested serpentine interconnects

20170148723

Semiconductor device having polyimide layer

20160293816

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE ARRAY, AND IMAGE FORMATION APPARATUS

20160284630

Bendable and stretchable electronic devices and methods

20140340857

Conformal electronics including nested serpentine interconnects

20130107485

Interconnect structures and methods of making the same

20120248439

Semiconductor packages

20120181687

Materials, structures and methods for microelectronic packaging

20080087986

Materials, structures and methods for microelectronic packaging

20060060956

Materials, structures and methods for microelectronic packaging