212647 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Die mounting substrate; Material with a principal constituent of the material being a solid not provided for in groups - , e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
Cold plates incorporating reactive multilayer systems and S-cells
#2Semiconductor die assembly and methods of forming thermal paths
#3Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#4Semiconductor assembly and method of manufacturing the same
#5Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#6Graphite-containing substrates for LED packages