H01L2924/1615 - CPC Classification Index

ClassID:

212651 ⎘

H01L2924/1615 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap Shape

Sub-classes:

H01L2924/16151 » Cap comprising an aperture e.g. for pressure control, encapsulation 203
H01L2924/16152 » Cap comprising a cavity for hosting the device, e.g. U-shaped cap 1,4K
H01L2924/16195 » Flat cap [not enclosing an internal cavity] 1,1K
H01L2924/16196 » Cap forming a cavity e.g. being a curved metal foil 24

Recent Application in this class:

20250300035

2025-09-25

PACKAGE COMPRISING AN EMBEDDED HEAT PIPE

20250126909

2025-04-17

RELIABLE SEMICONDUCTORS PACKAGES

20210366963

2021-11-25

Reliable semiconductor packages

20200307991

2020-10-01

Electronic device and corresponding manufacturing method

20200013689

2020-01-09

Packaging structures with improved adhesion and strength

20190122946

2019-04-25

System and method for bonding package lid

20180308776

2018-10-25

Electromagnetic shield structure of high frequency circuit and high frequency module

20180295714

2018-10-11

Board level shields with virtual grounding capability

20180047650

2018-02-15

Packaging structures with improved adhesion and strength

#10

20170311438

2017-10-26

Board level shields with virtual grounding capability

#11

20170271223

2017-09-21

System and method for bonding package lid

#12

20160293534

2016-10-06

Circuit assemblies with multiple interposer substrates, and methods of fabrication

#13

20160276294

2016-09-22

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

#14

20160035589

2016-02-04

Semiconductor device, related manufacturing method, and related electronic device

#15

20150262972

2015-09-17

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

#16

20150214128

2015-07-30

System and method for bonding package lid

#17

20140210066

2014-07-31

Semiconductor package having a cap unit with concave portion and method of manufacturing the same

#18

20140091461

2014-04-03

DIE CAP FOR USE WITH FLIP CHIP PACKAGE

#19

20130224912

2013-08-29

Manufacturing method of semiconductor device

#20

20120153448

2012-06-21

Semiconductor device and manufacturing method of semiconductor device

#21

20120018872

2012-01-26

Lid for an electrical hardware component

#22

20100200965

2010-08-12

Package structure for wireless communication module

#23

20100044856

2010-02-25

Electronic package with a thermal interposer and method of manufacturing the same