Semiconductor Device and Method for Partial EMI Shielding

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING OF SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE ARRANGEMENT

FABRICATION METHODS AND STRUCTURES FOR LIQUID COOLING CHANNEL CHIP

Reflowable Vapor Chamber Lid

EMBEDDED LIQUID COOLING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME

ELECTRONIC DEVICE WITH A REINFORCING LAYER

Embedded liquid cooling

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

Semiconductor Device and Method for Partial EMI Shielding

INTEGRATED CIRCUIT PACKAGE

Semiconductor Device and Method for Sensing External Condition in Harsh Environment

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD

Semiconductor device and manufacturing method thereof

Semiconductor package

Method for producing power semiconductor module arrangement

Wearable device with combined sensing capabilities

Cavity wall structure for semiconductor packaging

System and method to enhance reliability in connection with arrangements including circuits

Semiconductor package and electronic device having the same

DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

System and method to enhance solder joint reliability

MEMS device and process

Power semiconductor module arrangement

Pressure sensor, in particular a microphone with improved layout

Electronic devices with environmental sensors

Wearable device with combined sensing capabilities

HIGH RELIABILITY HOUSING FOR A SEMICONDUCTOR PACKAGE

System and method to enhance solder joint reliability

Semiconductor package and electronic device having the same

Cavity wall structure for semiconductor packaging

Imaging device, manufacturing device, and manufacturing method

Camera module and electronic apparatus to lower risk of breakage of camera module

Sensor module and method of making the same

Sensor device with ingress protection

Electronic component package structure and electronic device

Semiconductor packages having an electric device with a recess

Double-encapsulated power semiconductor module and method for producing the same

Electronic devices with environmental sensors

MEMS transducer package

MEMS transducer package

MEMS device and process

High reliability housing for a semiconductor package

Sensor

Semiconductor packages and methods for forming semiconductor package

Semiconductor device with metal patterns having convex and concave sides

Die with integrated microphone device using through-silicon vias (TSVs)

Image sensor and light source driver integrated in a same semiconductor package

Various stress free sensor packages using wafer level supporting die and air gap technique

Chip-scale package and semiconductor device assembly

Making multilayer 3D capacitors using arrays of upstanding rods or ridges

Wearable device with combined sensing capabilities

Lead frame-based chip carrier used in the fabrication of MEMS transducer packages

Power module with a plurality of patterns with convex and concave side

Method for manufacturing semiconductor device and semiconductor device

Chip packages and methods of manufacture thereof

Stack of integrated-circuit chips and electronic device

Semiconductor device, heat conductor, and method for manufacturing semiconductor device

Electronic component package structure and electronic device

Semiconductor device having laterally-extending electrode with reduced inductance

Embedded circuit in a MEMS device

Heat dissipation structure

Multi-die sensor device

Optical sensor package

Semiconductor packages and methods for forming semiconductor package

Semiconductor packages having an electric device with a recess

Semiconductor device and microphone

Power semiconductor housing with contact mechanism

Package assembly and method of manufacturing the same

Power module package and method for manufacturing the same

MEMS MICROPHONE MODULE

Semiconductor power module and method of manufacturing the same

Packaged MEMS device and method of calibrating a packaged MEMS device

Packaged integrated device die between an external and internal housing

Semiconductor packages usable with a mobile device

Semiconductor sensor device with over-molded lid

Unattached contained semiconductor devices

Miniature MEMS condenser microphone packages and fabrication method thereof

Semiconductor device

Method for fabricating package structure having MEMS elements

ELECTRONIC PACKAGE WITH THERMAL VIAS, AND FABRICATION PROCESS

Semiconductor package for MEMS device and method of manufacturing same

Package structure having MEMS elements and fabrication method thereof

SOUND SEPARATING DEVICE AND CAMERA UNIT INCLUDING THE SAME

MEMS component and a semiconductor component in a common housing having at least one access opening

Stacked sensor packaging structure and method

Packages and methods for packaging microphone devices

Semiconductor device and method of manufacturing the same

Power device with bottom source electrode

Electronic Component and Package for Device, and Method of Manufacturing the Same

Package with a CMOS die positioned underneath a MEMS die

PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE

Microelectromechanical transducer and corresponding assembly process

Microphone package and method for manufacturing same

Sensor device having a structure element

VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING VACUUM SEALED PACKAGE

Semiconductor power module and method of manufacturing the same

SEMICONDUCTOR DEVICE

Microphone

Acoustic sensor and method of manufacturing the same

Microphone unit and voice input device using same

Acoustic sensor

Infrared Sensor

Semiconductor package with lid bonded on wiring board and method of manufacturing the same

Microphone

Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package

Infrared detector

Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

Miniature MEMS condenser microphone package and fabrication method thereof

Sensor device having a porous structure element

Miniature MEMS condenser microphone packages and fabrication method thereof

Wet/wet differential pressure sensor based on microelectronic packaging process

MEMS microphone package with RF insensitive MEMS microphone chip

Multi-lid semiconductor package

Power semiconductor module comprising an explosion protection system

Lead frame and package of semiconductor device

Metallic cover of miniaturization module

EMI shielding for imager devices

Solid-state image pick-up device, method for producing the same, and electronics device with the same

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Vacuum package and manufacturing process thereof

Radiation detector array

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Power semiconductor module method

Power semiconductor module

Semiconductor device, lead frame, and microphone package therefor

METHOD OF FORMING PASSAGE IN SUBSTRATE FOR MEMS MODULE

Process for producing a functional device-mounted module

Module including a micro-electro-mechanical microphone

Package structure of a microphone

Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication

Pressure sensor with sensing chip protected by protective material

Packaging methods for imager devices

Module comprising a semiconductor chip comprising a movable element

Cap package for micro electro-mechanical system

CHIP PACKAGE CAPABLE OF MINIMIZING ELECTRO-MAGNETIC INTERFERENCE

MEMS microphone package and method thereof

Liquid metal thermal interface material system

Microphone package

Method for mounting semiconductor chips, and corresponding semiconductor chip system

Methods for manufacturing thermally enhanced flip-chip ball grid arrays

ULTRATHIN MODULE FOR SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor package on which a semiconductor device can be stacked and fabrication method thereof

Structure and manufacturing method of inversed microphone module and microphone chip component

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

Structure and method of making sealed capped chips

Semiconductor package, method of production of same, printed circuit board, and electronic apparatus

Semiconductor package system and method of improving heat dissipation of a semiconductor package

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabrication

Phoshor and Light-Emitting Diode

SEMICONDUCTOR DEVICE PACKAGE

Electronic component device

Microelectromechanical microphone packaging system

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

Package structure of a microphone

Semiconductor package

Functional device-mounted module and a process for producing the same

Hermetically sealed structure, piezoelectric device and improvement of method for manufacturing the same

Potting shell

Liquid metal thermal interface material system

Photonic device with integrated hybrid microlens array

INTEGRATED CIRCUIT PACKAGE SYSTEM

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

FLIP CHIP PACKAGE

Condenser microphone and packaging method for the same

Digital camera module for detachably mounting with flex printed circuit board

Package structure having recession portion on the surface thereof and method of making the same

Semiconductor device having through electrode and method of manufacturing the same

System and method for polymer encapsulated solder lid attach

EMI shielding package and method for making the same

Semiconductor sensor

Scanning micro-mirror package, method for fabricating the same, and optical scanning device employing the same

Liquid metal thermal interface material system

Chip package with grease heat sink

Semiconductor device and method for producing same

Air pocket resistant semiconductor package

Cap for semiconductor device

Flip chip package capable of measuring bond line thickness of thermal interface material

Pressure sensor

Ultrathin module for semiconductor device and method of fabricating the same

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Heat spreader lid cavity filled with cured molding compound

Method of making chip package with grease heat sink

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

Thermally enhanced metal capped BGA package

Semiconductor chip heat transfer

Apparatus and methods for an underfilled integrated circuit package

Corrosion-resistant bond pad and integrated device

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

Structure and method of making capped chips using sacrificial layer

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Chip packaging and connection for reduced EMI

Corrosion-resistant bond pad and integrated device

Chip package with grease heat sink

Method of fabricating semiconductor device