212654 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Shape; Cap comprising a cavity for hosting the device, e.g. U-shaped cap Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND METHODS OF MAKING THE SAME
#2PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
#3PACKAGE ASSMEBLY INCLUDING LID WITH ADDITIONAL STRESS MTITGATING FEET AND METHODS OF MAKING THE SAME
#4PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMMODATION SPACE WITH SEALED LIGHT PASSAGE WHICH FORMS AN INTEGRATED PIECE HAVING COMPLETELY FLAT OUTER SURFACE
#5SEMICONDUCTOR DEVICE
#6ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#7SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#83DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
#9Proximity sensor including enclosed accommodation space with sealed light passage which forms an integrated piece having completely flat outer surface
#10WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
#11Package assembly lid and methods for forming the same
#12POWER SEMICONDUCTOR MODULE, METHOD FOR ASSEMBLING A POWER SEMICONDUCTOR MODULE AND HOUSING FOR A POWER SEMICONDUCTOR MODULE
#13Semiconductor device
#14Package structure having lid with protrusion and manufacturing method thereof
#15PACKAGE ASSEMBLY INCLUDING A PACKAGE LID HAVING AN INNER FOOT AND METHODS OF MAKING THE SAME
#16Package assembly including lid with additional stress mitigating feet and methods of making the same
#17Proximity sensor including enclosed accommodation space with sealed light passage which forms an integrated piece having completely flat outer surface
#183DIC packaging with hot spot thermal management features
#19Proximity sensor including enclosed accommodation space with sealed light passage and manufacturing method thereof
#20Wearable device with combined sensing capabilities
#21Lid structure and semiconductor device package including the same
#22Proximity sensor including enclosed accomodation space with sealed light passage and manufacturing method thereof
#23Semiconductor device
#243DIC packaging with hot spot thermal management features
#25Semiconductor structure
#26Electronics package with improved thermal performance
#27Making electrical components in handle wafers of integrated circuit packages
#28Proximity sensor including enclosed accomodation space with sealed light passage and manufacturing method thereof
#29Wearable device with combined sensing capabilities
#303DIC packaging with hot spot thermal management features
#31Semiconductor package structure and manufacturing method thereof
#32Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management
#33Making electrical components in handle wafers of integrated circuit packages
#34Sealing cap for electronic component
#353DIC packaging with hot spot thermal management features
#36Top-side cooling of RF products in air cavity composite packages
#37Integrated heat spreader having electromagnetically-formed features
#38Lid structure and semiconductor device package including the same
#39Making electrical components in handle wafers of integrated circuit packages
#40Microelectronic assemblies with cavities, and methods of fabrication
#41Multi-MEMS module
#42Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same
#43Circuit assemblies with multiple interposer substrates, and methods of fabrication
#44Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#45Wearable device with combined sensing capabilities
#46Electronic package and fabrication method thereof
#47Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#48Method of manufacturing RF power amplifier module, RF power amplifier module, RF module, and base station
#49Semiconductor device and manufacturing method of semiconductor device
#50Semiconductor device with face-to-face chips on interposer and method of manufacturing the same
#51Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member
#52Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#53Semiconductor package and semiconductor module
#543DIC packaging with hot spot thermal management features
#55Semiconductor package with package-on-package stacking capability and method of manufacturing the same
#56Thinned integrated circuit device and manufacturing process for the same
#57Dual compartment semiconductor package
#58Semiconductor package with temperature sensor
#59DIE CAP FOR USE WITH FLIP CHIP PACKAGE
#60Microelectronic wireless transmission device
#61Semiconductor package and method of manufacturing the same
#62Dual compartment semiconductor package with temperature sensor
#63SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#64Transition from a chip to a waveguide port
#65Method of semiconductor device protection
#66NO LEAD PACKAGE WITH HEAT SPREADER
#67Electrical coupling of wafer structures
#68Method and apparatus for packaging circuit devices
#69Semiconductor device packaging structure
#70LIGHT-EMITTING MODULE FABRICATION METHOD
#71Process for producing a circuit module
#72MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE
#73Method and apparatus for packaging circuit devices
#74Heat spreader for a multi-chip package
#75Integrated circuit package system for shielding electromagnetic interference
#76Electronic shielding apparatus and methods
#77Multi-Chip Package
#78Camera module with window mechanical attachment
#79Thermal paste containment for semiconductor modules
#80Method of semiconductor device protection, package of semiconductor device
#81Circuit module and process for producing the same
#82Heat spreader for a multi-chip package
#83Thermal paste containment for semiconductor modules
#84No lead package with heat spreader
#85Integrated process condition sensing wafer and data analysis system
#86Thermal paste containment for semiconductor modules
#87VSAT block up converter (BUC) chip
#88Semiconductor device
#89MMC memory card with TSOP package
#90High-frequency module and electronic device using the module
#91System and method for high performance heat sink for multiple chip devices
#92Snap lid camera module
#93Component interconnect with substrate shielding
#94Electronic and optoelectronic component packaging technique
#95Integrated process condition sensing wafer and data analysis system
#96Method and apparatus for automotive radar sensor
#97Multi-chip package including at least one semiconductor device enclosed therein
#98Chip package sealing method
#99System and method for high performance heat sink for multiple chip devices
#100Electronic component module and manufacturing method thereof
#101Semiconductor device protection cover, and semiconductor device unit including the cover
#102Heat sink structure with embedded electronic components for semiconductor package