212655 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Details of package parts other than the semiconductor or other solid state devices to be connected; Cap; Shape; Cap comprising a cavity for hosting the device, e.g. U-shaped cap Cavity shape
Semiconductor Device and Method for Partial EMI Shielding
#2Semiconductor Device and Method of Forming Package with Double-Sided Integrated Passive Device
#3Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#4SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5REINFORCED STRUCTURE WITH CAPPING LAYER
#6Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#7METHODS OF FORMING ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE
#8Semiconductor Device and Method Forming Same
#9PACKAGES WITH LIQUID METAL AS HEAT-DISSIPATION MEDIA AND METHOD FORMING THE SAME
#10ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#11DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#12SEMICONDUCTOR DEVICE
#13Packaged Cold Plate Lids For Optimized Cooling Of High Power Chip Packages And Systems And Methods Incorporating Same
#14INTEGRATED CIRCUIT PACKAGE
#15SEMICONDUCTOR DEVICE
#16SEMICONDUCTOR DEVICE
#17SEMICONDUCTOR PACKAGE WITH STIFFENER STRUCTURE
#18PACKAGE STRUCTURE INCLUDING PACKAGE LID WITH A RECESS AND METHODS OF FORMING THE SAME
#19SEMICONDUCTOR PACKAGE
#20SEMICONDUCTOR DEVICES METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#21PACKAGE AND SEMICONDUCTOR DEVICE
#22STIFFENER ASSEMBLY AND METHOD FOR MAKING A SEMICONDUCTOR ASSEMBLY
#23SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
#24EMBEDDED SEMICONDUCTOR DEVICE
#25SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE SAME
#26ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#27BONDING STRUCTURE AND METHOD THEREOF
#28ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR
#29SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
#30ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#31ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#32Integrated Circuit Packages and Methods of Forming the Same
#33Semiconductor Device and Method of Forming Graphene-Coated Core Embedded Within TIM
#34ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
#35ELECTRONIC DEVICE PACKAGE INCLUDING A GEL
#36Semiconductor Device and Method of Forming Package with Double-Sided Integrated Passive Device
#37Semiconductor Device and Method for Partial EMI Shielding
#38SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
#39ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#40Packages with Liquid Metal as Heat-Dissipation Media and Method Forming the Same
#41INTEGRATED CIRCUIT PACKAGE
#42Power Envelope Analysis for the Thermal Optimization of Multi-Chip Modules
#43Semiconductor package
#44Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#45ANCHOR-CONTAINING UNDERFILL STRUCTURES FOR A CHIP PACKAGE AND METHODS OF FORMING THE SAME
#46SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
#47ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKAGING METHOD
#48ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#49Semiconductor Device and Method Forming Same
#50REINFORCED STRUCTURE WITH CAPPING LAYER AND METHODS OF FORMING THE SAME
#51COMPOSITED CARRIER FOR MICROPHONE PACKAGE
#52EMBEDDED HEAT SLUG IN A SUBSTRATE
#53SEMICONDUCTOR PACKAGE
#54Bonding structure and method thereof
#55PACKAGE DEVICE AND MANUFACTURING METHOD THEREOF
#56CAVITY PACKAGES
#57PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#58INTERPOSER STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#59Warpage Compensation for BGA Package
#60WIRING BOARD AND SEMICONDUCTOR PACKAGE
#61SEMICONDUCTOR PACKAGE
#62Semiconductor device
#63HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSORPTION METHOD
#64SEMICONDUCTOR DEVICE
#65Semiconductor device package and manufacturing method thereof
#66Semiconductor Packages with Thermal Lid and Methods of Forming the Same
#67DAM STRUCTURE ON LID TO CONSTRAIN A THERMAL INTERFACE MATERIAL IN A SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND METHODS FOR FORMING THE SAME
#68SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#69Semiconductor device
#70Electronic device package and method of manufacturing the same
#71Direct bonded heterogeneous integration silicon bridge
#72Semiconductor device and manufacturing method thereof
#73Embedded lid for low cost and improved thermal performance
#74Method and device for producing a housing
#75Manufacturing method of housing for semiconductor device
#76Semiconductor package
#77Thermal transfer structures for semiconductor die assemblies
#78Semiconductor package
#79Cavity packages
#80Semiconductor device package and manufacturing method thereof
#81Semiconductor device
#82Semiconductor device package and manufacturing method thereof
#83Cavity packages
#84Semiconductor packaging structure and process
#85Thermal transfer structures for semiconductor die assemblies
#86Semiconductor packaging structure and process
#87Electronic element mounting substrate and electronic device
#88Molded glass lid for wafer level packaging of opto-electronic assemblies
#89Semiconductor packaging structure and process
#90Method and system for a semiconductor for device package with a die-to-packaging substrate first bond
#91Molded glass lid for wafer level packaging of opto-electronic assemblies
#92System and method for integrated waveguide packaging
#93SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#94Method of semiconductor device protection
#95SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#96Package substrate
#97Semiconductor device packaging structure
#98Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly
#99Radiation level reducing device
#100MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE
#101Segmentation of a die stack for 3D packaging thermal management
#102Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
#103System and method for integrated waveguide packaging
#104Multilayer dielectric substrate and semiconductor package
#105Reduced inductance interconnect for enhanced microwave and millimeter-wave systems
#106Electronic shielding apparatus and methods
#107Semiconductor device having metal cap divided by slit
#108Thermal paste containment for semiconductor modules
#109Method of semiconductor device protection, package of semiconductor device
#110Heat dissipating device with preselected designed interface for thermal interface materials
#111Mounting device for high frequency microwave devices
#112Multilayer dielectric substrate and semiconductor package
#113SEMICONDUCTOR DEVICE
#114Planar circuit housing
#115Thermal paste containment for semiconductor modules
#116Integrating a heat spreader with an interface material having reduced void size
#117Millimeter-wave radar apparatus and millimeter radar system using the same
#118Integrated heat spreader lid
#119Circuit module
#120Thermal paste containment for semiconductor modules
#121High frequency package device with internal space having a resonant frequency offset from frequency used
#122Integrated heat spreader and method for using
#123Ground arch for wirebond ball grid arrays
#124Electronic component package including heat spreading member
#125Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate core
#126Electronic circuit packages
#127Method of manufacturing an integrated heat spreader lid
#128Shielding for electromagnetic interference
#129Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#130Electronic component module and manufacturing method thereof
#131Integrated circuit housing
#132Semiconductor device protection cover, and semiconductor device unit including the cover
#133High frequency circuit module
#134Mounting device for high frequency microwave devices
#135Method of fabricating semiconductor device